JP7721574B2 - 粘性材料を移すこと - Google Patents

粘性材料を移すこと

Info

Publication number
JP7721574B2
JP7721574B2 JP2022568877A JP2022568877A JP7721574B2 JP 7721574 B2 JP7721574 B2 JP 7721574B2 JP 2022568877 A JP2022568877 A JP 2022568877A JP 2022568877 A JP2022568877 A JP 2022568877A JP 7721574 B2 JP7721574 B2 JP 7721574B2
Authority
JP
Japan
Prior art keywords
functional material
heating
donor
region
heating elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022568877A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023525815A5 (https=
JPWO2021230746A5 (https=
JP2023525815A (ja
Inventor
ヤコブ ヘンドリクス、ロブ
ベルナール ジャック ブルニング、ファビアン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Original Assignee
Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO filed Critical Nederlandse Organisatie voor Toegepast Natuurwetenschappelijk Onderzoek TNO
Publication of JP2023525815A publication Critical patent/JP2023525815A/ja
Publication of JP2023525815A5 publication Critical patent/JP2023525815A5/ja
Publication of JPWO2021230746A5 publication Critical patent/JPWO2021230746A5/ja
Application granted granted Critical
Publication of JP7721574B2 publication Critical patent/JP7721574B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0244—Heating of fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/019—Heaters using heating elements having a negative temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Control Of Resistance Heating (AREA)
  • Wire Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
JP2022568877A 2020-05-12 2021-05-12 粘性材料を移すこと Active JP7721574B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20174175.8A EP3911130A1 (en) 2020-05-12 2020-05-12 Transferring viscous materials
EP20174175.8 2020-05-12
PCT/NL2021/050309 WO2021230746A1 (en) 2020-05-12 2021-05-12 Transferring viscous materials

Publications (4)

Publication Number Publication Date
JP2023525815A JP2023525815A (ja) 2023-06-19
JP2023525815A5 JP2023525815A5 (https=) 2024-05-17
JPWO2021230746A5 JPWO2021230746A5 (https=) 2024-05-17
JP7721574B2 true JP7721574B2 (ja) 2025-08-12

Family

ID=70682635

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022568877A Active JP7721574B2 (ja) 2020-05-12 2021-05-12 粘性材料を移すこと

Country Status (6)

Country Link
US (1) US12414241B2 (https=)
EP (2) EP3911130A1 (https=)
JP (1) JP7721574B2 (https=)
KR (1) KR20230008802A (https=)
CN (1) CN115700015A (https=)
WO (1) WO2021230746A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3911130A1 (en) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transferring viscous materials
EP4037442A1 (en) * 2021-02-01 2022-08-03 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Donor plate, deposition device and deposition method
EP4319486A1 (en) 2022-08-04 2024-02-07 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Heater plate, heater device comprising a heater plate and method of manufacturing a heater plate
EP4335641A1 (en) 2022-09-08 2024-03-13 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for printing a substance on a target surface of a target
EP4346339A1 (en) * 2022-09-30 2024-04-03 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for printing a substance on a target surface of a target
EP4383321A1 (en) * 2022-12-06 2024-06-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for depositing components on a substrate
EP4400625A1 (en) * 2023-01-13 2024-07-17 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Deposition apparatus, method for depositing, method for packaging a die in a chip package
DE102023134256A1 (de) * 2023-12-07 2025-06-12 Ams-Osram International Gmbh Vorrichtung zum aufbringen eines materials auf ein zielsubstrat, verfahren zur verwendung einer solchen vorrichtung und verfahren zur herstellung einer solchen vorrichtung
EP4586308A1 (en) * 2024-01-15 2025-07-16 FononTech Holding B.V. Deposition system and method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305966A (ja) 2004-04-26 2005-11-04 Canon Inc 液体吐出ヘッド
US20170268100A1 (en) 2016-03-16 2017-09-21 Ncc Nano, Llc Method for depositing a functional material on a substrate

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Publication number Priority date Publication date Assignee Title
US3729819A (en) * 1970-01-09 1973-05-01 Nippon Toki Kk Method and device for fabricating printed wiring or the like
JPS61254350A (ja) * 1985-05-08 1986-11-12 Mitsubishi Electric Corp サ−マルジエツト用記録ヘツド
US4956653A (en) * 1989-05-12 1990-09-11 Eastman Kodak Company Bubble jet print head having improved multi-layer protective structure for heater elements
US4991287A (en) * 1989-12-26 1991-02-12 Eastman Kodak Company Method for fabricating printed circuit boards
US5598189A (en) * 1993-09-07 1997-01-28 Hewlett-Packard Company Bipolar integrated ink jet printhead driver
JPH07218716A (ja) 1994-01-27 1995-08-18 Fujitsu Ltd カラーフィルタの製造方法
JPH09511459A (ja) * 1994-04-20 1997-11-18 シーメンス ニクスドルフ インフオルマチオーンスジステーメ アクチエンゲゼルシヤフト インキを記録媒体に転写するための熱電気式の印刷機
US6609652B2 (en) * 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
US6871396B2 (en) * 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
US9647555B2 (en) 2005-04-08 2017-05-09 Lincoln Global, Inc. Chopper output stage for arc welder power source
US8556389B2 (en) * 2011-02-04 2013-10-15 Kateeva, Inc. Low-profile MEMS thermal printhead die having backside electrical connections
EP2294240B1 (en) 2008-06-19 2017-03-08 Utilight Ltd. Light induced patterning
JP5629298B2 (ja) * 2012-10-26 2014-11-19 ヤマハ発動機株式会社 粘性材供給装置および粘性材印刷装置
IN2015DN03284A (https=) * 2012-10-31 2015-10-09 Hewlett Packard Indigo Bv
US20170013724A1 (en) 2014-02-28 2017-01-12 Utilight Ltd Tracks patterns production apparatus
WO2015140775A1 (en) 2014-03-19 2015-09-24 Utilight Ltd. Printing high aspect ratio patterns
CN105474381B (zh) 2014-07-23 2018-06-05 应用材料公司 可调谐温度受控的基板支撑组件
US20180171468A1 (en) 2016-12-21 2018-06-21 Ncc Nano, Llc Method for deposting a functional material on a substrate
CN112118964A (zh) * 2018-10-03 2020-12-22 惠普发展公司，有限责任合伙企业 热转印
US11446750B2 (en) * 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
EP3902380A1 (en) * 2020-04-24 2021-10-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Pattern transfer of high viscosity material
EP3911130A1 (en) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transferring viscous materials

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005305966A (ja) 2004-04-26 2005-11-04 Canon Inc 液体吐出ヘッド
US20170268100A1 (en) 2016-03-16 2017-09-21 Ncc Nano, Llc Method for depositing a functional material on a substrate

Also Published As

Publication number Publication date
EP4151057C0 (en) 2024-08-07
EP4151057B1 (en) 2024-08-07
US12414241B2 (en) 2025-09-09
EP4151057A1 (en) 2023-03-22
US20230240017A1 (en) 2023-07-27
EP3911130A1 (en) 2021-11-17
CN115700015A (zh) 2023-02-03
JP2023525815A (ja) 2023-06-19
WO2021230746A1 (en) 2021-11-18
KR20230008802A (ko) 2023-01-16

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