CN115700015A - 转移粘性材料 - Google Patents

转移粘性材料 Download PDF

Info

Publication number
CN115700015A
CN115700015A CN202180041547.4A CN202180041547A CN115700015A CN 115700015 A CN115700015 A CN 115700015A CN 202180041547 A CN202180041547 A CN 202180041547A CN 115700015 A CN115700015 A CN 115700015A
Authority
CN
China
Prior art keywords
functional material
donor
heating
heating elements
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180041547.4A
Other languages
English (en)
Chinese (zh)
Inventor
罗伯·雅各布·亨德里克斯
法比恩·伯纳德·夏克·布鲁宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Netherlands Organization For Applied Scientific Research
Original Assignee
Netherlands Organization For Applied Scientific Research
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Netherlands Organization For Applied Scientific Research filed Critical Netherlands Organization For Applied Scientific Research
Publication of CN115700015A publication Critical patent/CN115700015A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B1/00—Details of electric heating devices
    • H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
    • H05B1/0227—Applications
    • H05B1/023—Industrial applications
    • H05B1/0244—Heating of fluids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
    • H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/019—Heaters using heating elements having a negative temperature coefficient
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0528—Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/083—Evaporation or sublimation of a compound, e.g. gas bubble generating agent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Control Of Resistance Heating (AREA)
  • Wire Bonding (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
CN202180041547.4A 2020-05-12 2021-05-12 转移粘性材料 Pending CN115700015A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP20174175.8 2020-05-12
EP20174175.8A EP3911130A1 (en) 2020-05-12 2020-05-12 Transferring viscous materials
PCT/NL2021/050309 WO2021230746A1 (en) 2020-05-12 2021-05-12 Transferring viscous materials

Publications (1)

Publication Number Publication Date
CN115700015A true CN115700015A (zh) 2023-02-03

Family

ID=70682635

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180041547.4A Pending CN115700015A (zh) 2020-05-12 2021-05-12 转移粘性材料

Country Status (6)

Country Link
US (1) US12414241B2 (https=)
EP (2) EP3911130A1 (https=)
JP (1) JP7721574B2 (https=)
KR (1) KR20230008802A (https=)
CN (1) CN115700015A (https=)
WO (1) WO2021230746A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3911130A1 (en) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transferring viscous materials
EP4037442A1 (en) * 2021-02-01 2022-08-03 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Donor plate, deposition device and deposition method
EP4319486A1 (en) 2022-08-04 2024-02-07 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Heater plate, heater device comprising a heater plate and method of manufacturing a heater plate
EP4335641A1 (en) 2022-09-08 2024-03-13 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for printing a substance on a target surface of a target
EP4346339A1 (en) * 2022-09-30 2024-04-03 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for printing a substance on a target surface of a target
EP4383321A1 (en) * 2022-12-06 2024-06-12 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Method and device for depositing components on a substrate
EP4400625A1 (en) * 2023-01-13 2024-07-17 Nederlandse Organisatie voor toegepast-natuurwetenschappelijk Onderzoek TNO Deposition apparatus, method for depositing, method for packaging a die in a chip package
DE102023134256A1 (de) * 2023-12-07 2025-06-12 Ams-Osram International Gmbh Vorrichtung zum aufbringen eines materials auf ein zielsubstrat, verfahren zur verwendung einer solchen vorrichtung und verfahren zur herstellung einer solchen vorrichtung
EP4586308A1 (en) * 2024-01-15 2025-07-16 FononTech Holding B.V. Deposition system and method

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729819A (en) * 1970-01-09 1973-05-01 Nippon Toki Kk Method and device for fabricating printed wiring or the like
JPS61254350A (ja) * 1985-05-08 1986-11-12 Mitsubishi Electric Corp サ−マルジエツト用記録ヘツド
US4956653A (en) * 1989-05-12 1990-09-11 Eastman Kodak Company Bubble jet print head having improved multi-layer protective structure for heater elements
US4991287A (en) * 1989-12-26 1991-02-12 Eastman Kodak Company Method for fabricating printed circuit boards
US5598189A (en) * 1993-09-07 1997-01-28 Hewlett-Packard Company Bipolar integrated ink jet printhead driver
JPH07218716A (ja) 1994-01-27 1995-08-18 Fujitsu Ltd カラーフィルタの製造方法
JPH09511459A (ja) 1994-04-20 1997-11-18 シーメンス ニクスドルフ インフオルマチオーンスジステーメ アクチエンゲゼルシヤフト インキを記録媒体に転写するための熱電気式の印刷機
US6609652B2 (en) * 1997-05-27 2003-08-26 Spheretek, Llc Ball bumping substrates, particuarly wafers
US6114088A (en) * 1999-01-15 2000-09-05 3M Innovative Properties Company Thermal transfer element for forming multilayer devices
US6871396B2 (en) * 2000-02-09 2005-03-29 Matsushita Electric Industrial Co., Ltd. Transfer material for wiring substrate
JP2005305966A (ja) 2004-04-26 2005-11-04 Canon Inc 液体吐出ヘッド
US9647555B2 (en) 2005-04-08 2017-05-09 Lincoln Global, Inc. Chopper output stage for arc welder power source
US8556389B2 (en) * 2011-02-04 2013-10-15 Kateeva, Inc. Low-profile MEMS thermal printhead die having backside electrical connections
WO2009153792A2 (en) 2008-06-19 2009-12-23 Utilight Ltd. Light induced patterning
JP5629298B2 (ja) * 2012-10-26 2014-11-19 ヤマハ発動機株式会社 粘性材供給装置および粘性材印刷装置
BR112015009655B1 (pt) * 2012-10-31 2020-12-29 Hewlett-Packard Indigo B.V. método e aparelho para formar em um substrato um padrão de um material
WO2015128857A1 (en) 2014-02-28 2015-09-03 Utilight Ltd. Tracks patterns production apparatus
WO2015140775A1 (en) 2014-03-19 2015-09-24 Utilight Ltd. Printing high aspect ratio patterns
KR101758087B1 (ko) 2014-07-23 2017-07-14 어플라이드 머티어리얼스, 인코포레이티드 튜닝가능한 온도 제어되는 기판 지지 어셈블리
US11089690B2 (en) 2016-03-16 2021-08-10 Ncc Nano, Llc Method for depositing a functional material on a substrate
US20180171468A1 (en) 2016-12-21 2018-06-21 Ncc Nano, Llc Method for deposting a functional material on a substrate
CN112118964A (zh) * 2018-10-03 2020-12-22 惠普发展公司，有限责任合伙企业 热转印
US11446750B2 (en) * 2020-02-03 2022-09-20 Io Tech Group Ltd. Systems for printing solder paste and other viscous materials at high resolution
EP3902380A1 (en) * 2020-04-24 2021-10-27 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Pattern transfer of high viscosity material
EP3911130A1 (en) * 2020-05-12 2021-11-17 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Transferring viscous materials

Also Published As

Publication number Publication date
JP7721574B2 (ja) 2025-08-12
EP4151057B1 (en) 2024-08-07
EP4151057C0 (en) 2024-08-07
EP3911130A1 (en) 2021-11-17
EP4151057A1 (en) 2023-03-22
JP2023525815A (ja) 2023-06-19
US12414241B2 (en) 2025-09-09
WO2021230746A1 (en) 2021-11-18
KR20230008802A (ko) 2023-01-16
US20230240017A1 (en) 2023-07-27

Similar Documents

Publication Publication Date Title
CN115700015A (zh) 转移粘性材料
EP4140262B1 (en) Pattern transfer of high viscosity material
WO2015140775A1 (en) Printing high aspect ratio patterns
CN104781925B (zh) 安装于衬底上的离散装置
KR20230135111A (ko) 도너 플레이트, 증착 장치 및 증착 방법
US7759160B2 (en) Method for producing conductor structures and applications thereof
TW202139317A (zh) 發光二極體晶片初始結構、影像顯示裝置與晶片分類系統
KR102958514B1 (ko) 고점도 물질의 패턴 전사
JP2010179483A (ja) スクリーン印刷方法及びスクリーン印刷装置
CN212010394U (zh) 透明导电电极、调光膜、触控屏
CN212411597U (zh) 透明导电膜
JP2023546355A (ja) 基板の制御された局所加熱
CN111937499A (zh) 具有跳线的电气装置
CN117855109B (zh) 一种封装制备系统和封装制备方法
JPH0677283A (ja) 配線基板へのｉｃ素子の実装方法
TW202433628A (zh) 用以將組件置放在目標之目標表面上之方法及裝置與配合其使用的供體板
TWI221117B (en) A printing stencil for die surface printing and a printing stencil for die surface printing and a process carried out by the printing stencil
JPH02205392A (ja) クリーム半田の塗布装置
JP2022008707A (ja) チップオンボードｌｅｄ基板及び表面実装デバイスｌｅｄ基板の製造方法
JP2010214777A (ja) 印刷用マスク及び印刷方法
JP2003318517A (ja) 導体層形成方法
JP2000353761A (ja) 配線基板の製造方法
An Glossary of Hybrid Microelectronics Terms
JPH04364742A (ja) 半導体装置の構造及び半導体装置の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination