JP7716726B2 - 堆積装置の基材位置決め装置およびその方法 - Google Patents

堆積装置の基材位置決め装置およびその方法

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Publication number
JP7716726B2
JP7716726B2 JP2022501114A JP2022501114A JP7716726B2 JP 7716726 B2 JP7716726 B2 JP 7716726B2 JP 2022501114 A JP2022501114 A JP 2022501114A JP 2022501114 A JP2022501114 A JP 2022501114A JP 7716726 B2 JP7716726 B2 JP 7716726B2
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JP
Japan
Prior art keywords
laser
imaging
substrate
light source
deposition apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022501114A
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English (en)
Japanese (ja)
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JP2022540606A (ja
Inventor
マティア カール
ルー ジェシー
チャン ジェリー
オーデト マット
バカ スティーブン
マシェフスキー ヴァディム
ダロー デイビッド
Original Assignee
カティーバ， インコーポレイテッド
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Application filed by カティーバ， インコーポレイテッド filed Critical カティーバ， インコーポレイテッド
Publication of JP2022540606A publication Critical patent/JP2022540606A/ja
Priority to JP2025033289A priority Critical patent/JP2025093980A/ja
Application granted granted Critical
Publication of JP7716726B2 publication Critical patent/JP7716726B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/009—Detecting type of paper, e.g. by automatic reading of a code that is printed on a paper package or on a paper roll or by sensing the grade of translucency of the paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/0095—Detecting means for copy material, e.g. for detecting or sensing presence of copy material or its leading or trailing end
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/36—Blanking or long feeds; Feeding to a particular line, e.g. by rotation of platen or feed roller
    • B41J11/42—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/21—Ink jet for multi-colour printing
    • B41J2/2132—Print quality control characterised by dot disposition, e.g. for reducing white stripes or banding
    • B41J2/2135—Alignment of dots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/28—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for printing downwardly on flat surfaces, e.g. of books, drawings, boxes, envelopes, e.g. flat-bed ink-jet printers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/02—Pretreatment of the material to be coated
    • C23C16/0254—Physical treatment to alter the texture of the surface, e.g. scratching or polishing
    • C23C16/0263—Irradiation with laser or particle beam
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/483—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using coherent light, UV to IR, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
    • G01B21/04—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness by measuring coordinates of points
    • G01B21/042—Calibration or calibration artifacts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01—Embodiments of or processes related to ink-jet heads
    • B41J2202/09—Ink jet technology used for manufacturing optical filters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Laser Beam Processing (AREA)
  • Coating Apparatus (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2022501114A 2019-07-10 2020-06-29 堆積装置の基材位置決め装置およびその方法 Active JP7716726B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025033289A JP2025093980A (ja) 2019-07-10 2025-03-03 堆積装置の基材位置決め装置およびその方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962872501P 2019-07-10 2019-07-10
US62/872,501 2019-07-10
PCT/US2020/040044 WO2021007054A1 (en) 2019-07-10 2020-06-29 Substrate positioning for deposition machine

Related Child Applications (1)

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JP2025033289A Division JP2025093980A (ja) 2019-07-10 2025-03-03 堆積装置の基材位置決め装置およびその方法

Publications (2)

Publication Number Publication Date
JP2022540606A JP2022540606A (ja) 2022-09-16
JP7716726B2 true JP7716726B2 (ja) 2025-08-01

Family

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JP2022501114A Active JP7716726B2 (ja) 2019-07-10 2020-06-29 堆積装置の基材位置決め装置およびその方法
JP2025033289A Pending JP2025093980A (ja) 2019-07-10 2025-03-03 堆積装置の基材位置決め装置およびその方法

Family Applications After (1)

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Country Status (6)

Country Link
US (3) US11679602B2 (https=)
EP (1) EP3997743A4 (https=)
JP (2) JP7716726B2 (https=)
KR (2) KR102835420B1 (https=)
CN (2) CN121925009A (https=)
WO (1) WO2021007054A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7716726B2 (ja) 2019-07-10 2025-08-01 カティーバ， インコーポレイテッド 堆積装置の基材位置決め装置およびその方法
US11780242B2 (en) 2020-10-27 2023-10-10 Kateeva, Inc. Substrate positioning for deposition machine
DE102021127407B4 (de) * 2021-10-21 2023-05-11 ASMPT GmbH & Co. KG Aufzeichnung von Komponentendaten

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030155513A1 (en) 2002-02-21 2003-08-21 Ford Global Technologies, Inc. Active night vision system for vehicles employing short-pulse laser illumination and a gated camera for image capture
US20050235913A1 (en) 2004-04-23 2005-10-27 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
WO2014200642A1 (en) 2013-06-10 2014-12-18 Kateeva, Inc Low-particle gas enclosure systems and methods
US20180015502A1 (en) 2016-07-17 2018-01-18 Io Tech Group Ltd. Kit and system for laser-induced material dispensing

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61277977A (ja) * 1985-06-04 1986-12-08 Canon Inc 画像形成装置
JP2001338867A (ja) * 2000-05-30 2001-12-07 Nikon Corp 照明装置、位置計測装置、並びに露光装置及び露光方法
US6742454B2 (en) 2001-10-30 2004-06-01 Heidelberger Druckmaschinen Ag Method for modifying an image surface of a printing plate
US6677975B1 (en) * 2002-06-19 2004-01-13 Eastman Kodak Company System and process for magnetic alignment of an imaging subsystem
FR2853278B1 (fr) * 2003-04-04 2006-02-10 Es Technology Procede et dispositif de marquage couleur de supports
GB0400982D0 (en) * 2004-01-16 2004-02-18 Fujifilm Electronic Imaging Method of forming a pattern on a substrate
US7127159B2 (en) 2004-07-29 2006-10-24 Mitutoyo Corporation Strobe illumination
JP2006167534A (ja) * 2004-12-14 2006-06-29 Seiko Epson Corp 液滴量測定方法、液滴吐出ヘッドの駆動信号適正化方法および液滴吐出装置
WO2007098935A2 (en) * 2006-02-28 2007-09-07 Micronic Laser Systems Ab Platforms, apparatuses, systems and methods for processing and analyzing substrates
JP2008135562A (ja) 2006-11-28 2008-06-12 Athlete Fa Kk 樹脂塗布装置および樹脂塗布装置の制御方法
JP5349770B2 (ja) * 2007-07-17 2013-11-20 東京応化工業株式会社 塗布装置及び塗布方法
JP5294141B2 (ja) * 2008-03-25 2013-09-18 株式会社ニコン 表示素子の製造装置
US20110117681A1 (en) 2008-07-09 2011-05-19 Bt Imaging Pty Ltd Thin film imaging method and apparatus
US8902402B2 (en) * 2008-12-19 2014-12-02 Nikon Corporation Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
KR101156441B1 (ko) 2010-03-11 2012-06-18 삼성모바일디스플레이주식회사 박막 증착 장치
KR101202348B1 (ko) 2010-04-06 2012-11-16 삼성디스플레이 주식회사 박막 증착 장치 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US9433939B2 (en) * 2010-08-27 2016-09-06 Hewlett-Packard Development Company, L.P. Liquid dispensing assembly frame
JP5741102B2 (ja) * 2011-03-18 2015-07-01 株式会社リコー 電気機械変換素子の製造方法、電気機械変換素子、液滴吐出ヘッド、及び液滴吐出装置
KR101984329B1 (ko) * 2011-06-21 2019-05-30 바스프 에스이 종이 및 판지 상의 회절 격자 인쇄
CN108099426B (zh) * 2012-12-27 2020-05-12 科迪华公司 用于打印油墨体积控制以在精确公差内沉积流体的技术
WO2014144482A1 (en) 2013-03-15 2014-09-18 Matterfab Corp. Apparatus and methods for manufacturing
KR101566347B1 (ko) * 2013-12-27 2015-11-06 엘아이지인베니아 주식회사 기판검사장치
CN113540130A (zh) 2014-10-28 2021-10-22 株式会社半导体能源研究所 显示装置、显示装置的制造方法及电子设备
PT3302985T (pt) * 2015-05-27 2021-01-13 Landa Labs 2012 Ltd Dispositivo de formação de imagens
BR112019000273B1 (pt) * 2016-07-08 2022-12-13 Macdonald, Dettwiler And Associates Inc Método implementado por computador em tempo real para vedação, sistema de dispensação, e, sistema de vedação
JP7716726B2 (ja) 2019-07-10 2025-08-01 カティーバ， インコーポレイテッド 堆積装置の基材位置決め装置およびその方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030155513A1 (en) 2002-02-21 2003-08-21 Ford Global Technologies, Inc. Active night vision system for vehicles employing short-pulse laser illumination and a gated camera for image capture
US20050235913A1 (en) 2004-04-23 2005-10-27 Speedline Technologies, Inc. Imaging and inspection system for a dispenser and method for same
WO2014200642A1 (en) 2013-06-10 2014-12-18 Kateeva, Inc Low-particle gas enclosure systems and methods
US20180015502A1 (en) 2016-07-17 2018-01-18 Io Tech Group Ltd. Kit and system for laser-induced material dispensing

Also Published As

Publication number Publication date
JP2022540606A (ja) 2022-09-16
EP3997743A4 (en) 2023-07-19
KR102835420B1 (ko) 2025-07-16
US20210010136A1 (en) 2021-01-14
EP3997743A1 (en) 2022-05-18
CN114127973B (zh) 2025-12-23
CN114127973A (zh) 2022-03-01
JP2025093980A (ja) 2025-06-24
WO2021007054A1 (en) 2021-01-14
CN121925009A (zh) 2026-04-24
US11679602B2 (en) 2023-06-20
KR20250114430A (ko) 2025-07-29
US12172430B2 (en) 2024-12-24
US20230347667A1 (en) 2023-11-02
US20250058572A1 (en) 2025-02-20
KR20220031085A (ko) 2022-03-11

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