JP7693136B1 - 接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法 - Google Patents

接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法 Download PDF

Info

Publication number
JP7693136B1
JP7693136B1 JP2024563816A JP2024563816A JP7693136B1 JP 7693136 B1 JP7693136 B1 JP 7693136B1 JP 2024563816 A JP2024563816 A JP 2024563816A JP 2024563816 A JP2024563816 A JP 2024563816A JP 7693136 B1 JP7693136 B1 JP 7693136B1
Authority
JP
Japan
Prior art keywords
primer layer
semiconductor device
resin
metal member
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024563816A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025173163A1 (https=
JPWO2025173163A5 (https=
Inventor
雅知 三國
康平 佐俣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP7693136B1 publication Critical patent/JP7693136B1/ja
Publication of JPWO2025173163A1 publication Critical patent/JPWO2025173163A1/ja
Publication of JPWO2025173163A5 publication Critical patent/JPWO2025173163A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16—Laser beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/44—Joining a heated non plastics element to a plastics element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
    • B29C65/64—Joining a non-plastics element to a plastics element, e.g. by force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/70—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/10—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a discontinuous layer, i.e. formed of separate pieces of material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2024563816A 2024-02-15 2024-02-15 接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法 Active JP7693136B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2024/005236 WO2025173163A1 (ja) 2024-02-15 2024-02-15 接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP7693136B1 true JP7693136B1 (ja) 2025-06-16
JPWO2025173163A1 JPWO2025173163A1 (https=) 2025-08-21
JPWO2025173163A5 JPWO2025173163A5 (https=) 2026-01-21

Family

ID=96055150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024563816A Active JP7693136B1 (ja) 2024-02-15 2024-02-15 接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP7693136B1 (https=)
WO (1) WO2025173163A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278382A (ja) * 2009-06-01 2010-12-09 Seiko Epson Corp リードフレーム、半導体装置及びそれらの製造方法
JP2014117724A (ja) * 2012-12-14 2014-06-30 Polyplastics Co 金属部品の製造方法、及び複合成形体
JP2017061142A (ja) * 2015-09-25 2017-03-30 三ツ星ベルト株式会社 金属樹脂接合体、金属樹脂接合体の製造方法、金属樹脂接合体からなるブロック、金属樹脂接合体からなるブロックの製造方法、並びに、金属樹脂接合体からなるブロックを備えた伝動ベルト
JP2017109383A (ja) * 2015-12-16 2017-06-22 アルプス電気株式会社 複合成形部材、複合成形部材の製造方法、および電子部品
JP2018111788A (ja) * 2017-01-13 2018-07-19 国立大学法人大阪大学 接着構造体及びその製造方法
JP2018114670A (ja) * 2017-01-18 2018-07-26 日新製鋼株式会社 塗装鋼板と樹脂材との複合体の製造方法
WO2020059128A1 (ja) * 2018-09-21 2020-03-26 三井化学株式会社 金属／樹脂複合構造体、金属／樹脂複合構造体の製造方法および冷却装置
JP2023072423A (ja) * 2021-11-12 2023-05-24 新東工業株式会社 複合部材の製造方法、及び複合部材

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278382A (ja) * 2009-06-01 2010-12-09 Seiko Epson Corp リードフレーム、半導体装置及びそれらの製造方法
JP2014117724A (ja) * 2012-12-14 2014-06-30 Polyplastics Co 金属部品の製造方法、及び複合成形体
JP2017061142A (ja) * 2015-09-25 2017-03-30 三ツ星ベルト株式会社 金属樹脂接合体、金属樹脂接合体の製造方法、金属樹脂接合体からなるブロック、金属樹脂接合体からなるブロックの製造方法、並びに、金属樹脂接合体からなるブロックを備えた伝動ベルト
JP2017109383A (ja) * 2015-12-16 2017-06-22 アルプス電気株式会社 複合成形部材、複合成形部材の製造方法、および電子部品
JP2018111788A (ja) * 2017-01-13 2018-07-19 国立大学法人大阪大学 接着構造体及びその製造方法
JP2018114670A (ja) * 2017-01-18 2018-07-26 日新製鋼株式会社 塗装鋼板と樹脂材との複合体の製造方法
WO2020059128A1 (ja) * 2018-09-21 2020-03-26 三井化学株式会社 金属／樹脂複合構造体、金属／樹脂複合構造体の製造方法および冷却装置
JP2023072423A (ja) * 2021-11-12 2023-05-24 新東工業株式会社 複合部材の製造方法、及び複合部材

Also Published As

Publication number Publication date
JPWO2025173163A1 (https=) 2025-08-21
WO2025173163A1 (ja) 2025-08-21

Similar Documents

Publication Publication Date Title
US20180350780A1 (en) An Electronic Device Package
JP6503936B2 (ja) 金属樹脂複合成形体及びその製造方法
KR20140022102A (ko) 적층체 및 적층체의 제조 방법
US10937744B2 (en) Semiconductor packages including roughening features
KR20050029114A (ko) 전자 장치의 제조 동안의 부착력 생성 방법
JP7693136B1 (ja) 接合体、半導体装置、接合体の製造方法及び半導体装置の製造方法
WO2011145202A1 (ja) 半導体装置
JP7722123B2 (ja) 金属部材の製造方法及び金属樹脂接合体の製造方法
US10892253B2 (en) Semiconductor device manufacturing method and semiconductor device
US8178390B2 (en) Semiconductor component and production method
JP2019106480A (ja) 金属部材および当該金属部材を用いた半導体素子、樹脂金属複合体、半導体装置、異種金属複合体並びに当該金属部材の製造方法
JP4363324B2 (ja) 半導体モジュール
US20250144890A1 (en) Joint body, semiconductor device equipped with joint body, and joint body production method
KR20200043033A (ko) 벼이삭형 구리 입자 함유 페이스트
Cui et al. Surface treatment of copper for the adhesion improvement to epoxy mold compounds
CN1812064A (zh) 用于增强半导体器件模塑料的粘着的涂覆
JP2013157400A (ja) 半導体装置およびその製造方法
JP3261987B2 (ja) Ｌｏｃ用リードフレームおよびそれを利用した半導体装置
EP2345073A1 (en) Application of a self-assembled monolayer as an oxide inhibitor
US8618674B2 (en) Semiconductor device including a sintered insulation material
CN116897102A (zh) 异种材料接合体的制造方法和异种材料接合体
TWI861382B (zh) 黏著帶
CN101218082A (zh) 生产涂覆零件的方法
KR20200000665A (ko) 기판 세정용 노즐 및 그 제조 방법
Hagen et al. Reliable BGA assembly using plasma chemical cleaning

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20241029

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241029

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20241029

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20241224

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20250220

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250507

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250604

R150 Certificate of patent or registration of utility model

Ref document number: 7693136

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150