JP7690133B2 - 半導体装置および半導体装置の製造方法 - Google Patents

半導体装置および半導体装置の製造方法 Download PDF

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Publication number
JP7690133B2
JP7690133B2 JP2024541320A JP2024541320A JP7690133B2 JP 7690133 B2 JP7690133 B2 JP 7690133B2 JP 2024541320 A JP2024541320 A JP 2024541320A JP 2024541320 A JP2024541320 A JP 2024541320A JP 7690133 B2 JP7690133 B2 JP 7690133B2
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Japan
Prior art keywords
electrode terminal
circuit pattern
semiconductor device
joint
recess
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Active
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JP2024541320A
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Japanese (ja)
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JPWO2024038511A5 (https=
JPWO2024038511A1 (https=
Inventor
賢太 中原
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00

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  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP2024541320A 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法 Active JP7690133B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/031026 WO2024038511A1 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

Publications (3)

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JPWO2024038511A1 JPWO2024038511A1 (https=) 2024-02-22
JPWO2024038511A5 JPWO2024038511A5 (https=) 2024-09-20
JP7690133B2 true JP7690133B2 (ja) 2025-06-09

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ID=89941531

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JP2024541320A Active JP7690133B2 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

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Country Link
US (1) US20250300045A1 (https=)
JP (1) JP7690133B2 (https=)
CN (1) CN119631174A (https=)
DE (1) DE112022007665T5 (https=)
WO (1) WO2024038511A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017069521A (ja) 2015-10-02 2017-04-06 株式会社日立製作所 半導体パワーモジュールおよび移動体
JP2020178003A (ja) 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
WO2022018868A1 (ja) 2020-07-22 2022-01-27 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567871A (ja) * 1991-04-26 1993-03-19 Nec Toyama Ltd 印刷配線板及びその製造方法
JPH09283901A (ja) * 1996-04-12 1997-10-31 Nec Corp 表面実装ｌｓｉパッケージの実装方法および構造

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017069521A (ja) 2015-10-02 2017-04-06 株式会社日立製作所 半導体パワーモジュールおよび移動体
JP2020178003A (ja) 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
WO2022018868A1 (ja) 2020-07-22 2022-01-27 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Also Published As

Publication number Publication date
DE112022007665T5 (de) 2025-06-12
US20250300045A1 (en) 2025-09-25
CN119631174A (zh) 2025-03-14
WO2024038511A1 (ja) 2024-02-22
JPWO2024038511A1 (https=) 2024-02-22

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