JPWO2024038511A1 - - Google Patents

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Publication number
JPWO2024038511A1
JPWO2024038511A1 JP2024541320A JP2024541320A JPWO2024038511A1 JP WO2024038511 A1 JPWO2024038511 A1 JP WO2024038511A1 JP 2024541320 A JP2024541320 A JP 2024541320A JP 2024541320 A JP2024541320 A JP 2024541320A JP WO2024038511 A1 JPWO2024038511 A1 JP WO2024038511A1
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JP
Japan
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Application number
JP2024541320A
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Japanese (ja)
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JP7690133B2 (ja
JPWO2024038511A5 (https=
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Publication of JPWO2024038511A1 publication Critical patent/JPWO2024038511A1/ja
Publication of JPWO2024038511A5 publication Critical patent/JPWO2024038511A5/ja
Application granted granted Critical
Publication of JP7690133B2 publication Critical patent/JP7690133B2/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
JP2024541320A 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法 Active JP7690133B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/031026 WO2024038511A1 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2024038511A1 true JPWO2024038511A1 (https=) 2024-02-22
JPWO2024038511A5 JPWO2024038511A5 (https=) 2024-09-20
JP7690133B2 JP7690133B2 (ja) 2025-06-09

Family

ID=89941531

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024541320A Active JP7690133B2 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20250300045A1 (https=)
JP (1) JP7690133B2 (https=)
CN (1) CN119631174A (https=)
DE (1) DE112022007665T5 (https=)
WO (1) WO2024038511A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567871A (ja) * 1991-04-26 1993-03-19 Nec Toyama Ltd 印刷配線板及びその製造方法
JPH09283901A (ja) * 1996-04-12 1997-10-31 Nec Corp 表面実装ｌｓｉパッケージの実装方法および構造
JP2017069521A (ja) * 2015-10-02 2017-04-06 株式会社日立製作所 半導体パワーモジュールおよび移動体
JP2020178003A (ja) * 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
WO2022018868A1 (ja) * 2020-07-22 2022-01-27 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567871A (ja) * 1991-04-26 1993-03-19 Nec Toyama Ltd 印刷配線板及びその製造方法
JPH09283901A (ja) * 1996-04-12 1997-10-31 Nec Corp 表面実装ｌｓｉパッケージの実装方法および構造
JP2017069521A (ja) * 2015-10-02 2017-04-06 株式会社日立製作所 半導体パワーモジュールおよび移動体
JP2020178003A (ja) * 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
WO2022018868A1 (ja) * 2020-07-22 2022-01-27 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Also Published As

Publication number Publication date
DE112022007665T5 (de) 2025-06-12
JP7690133B2 (ja) 2025-06-09
US20250300045A1 (en) 2025-09-25
CN119631174A (zh) 2025-03-14
WO2024038511A1 (ja) 2024-02-22

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