CN119631174A - 半导体装置及半导体装置的制造方法 - Google Patents

半导体装置及半导体装置的制造方法 Download PDF

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Publication number
CN119631174A
CN119631174A CN202280096070.4A CN202280096070A CN119631174A CN 119631174 A CN119631174 A CN 119631174A CN 202280096070 A CN202280096070 A CN 202280096070A CN 119631174 A CN119631174 A CN 119631174A
Authority
CN
China
Prior art keywords
circuit pattern
electrode terminal
semiconductor device
protrusion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280096070.4A
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English (en)
Chinese (zh)
Inventor
中原贤太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN119631174A publication Critical patent/CN119631174A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN202280096070.4A 2022-08-17 2022-08-17 半导体装置及半导体装置的制造方法 Pending CN119631174A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/031026 WO2024038511A1 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
CN119631174A true CN119631174A (zh) 2025-03-14

Family

ID=89941531

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280096070.4A Pending CN119631174A (zh) 2022-08-17 2022-08-17 半导体装置及半导体装置的制造方法

Country Status (5)

Country Link
US (1) US20250300045A1 (https=)
JP (1) JP7690133B2 (https=)
CN (1) CN119631174A (https=)
DE (1) DE112022007665T5 (https=)
WO (1) WO2024038511A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567871A (ja) * 1991-04-26 1993-03-19 Nec Toyama Ltd 印刷配線板及びその製造方法
JPH09283901A (ja) * 1996-04-12 1997-10-31 Nec Corp 表面実装ｌｓｉパッケージの実装方法および構造
JP6538513B2 (ja) * 2015-10-02 2019-07-03 株式会社 日立パワーデバイス 半導体パワーモジュールおよび移動体
JP2020178003A (ja) * 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
JP7217837B2 (ja) * 2020-07-22 2023-02-03 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Also Published As

Publication number Publication date
DE112022007665T5 (de) 2025-06-12
JP7690133B2 (ja) 2025-06-09
US20250300045A1 (en) 2025-09-25
WO2024038511A1 (ja) 2024-02-22
JPWO2024038511A1 (https=) 2024-02-22

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