DE112022007665T5 - Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung - Google Patents

Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung Download PDF

Info

Publication number
DE112022007665T5
DE112022007665T5 DE112022007665.8T DE112022007665T DE112022007665T5 DE 112022007665 T5 DE112022007665 T5 DE 112022007665T5 DE 112022007665 T DE112022007665 T DE 112022007665T DE 112022007665 T5 DE112022007665 T5 DE 112022007665T5
Authority
DE
Germany
Prior art keywords
electrode terminal
semiconductor device
connection point
circuit pattern
fitted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022007665.8T
Other languages
German (de)
English (en)
Inventor
Kenta NAKAHARA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112022007665T5 publication Critical patent/DE112022007665T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
DE112022007665.8T 2022-08-17 2022-08-17 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung Pending DE112022007665T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/031026 WO2024038511A1 (ja) 2022-08-17 2022-08-17 半導体装置および半導体装置の製造方法

Publications (1)

Publication Number Publication Date
DE112022007665T5 true DE112022007665T5 (de) 2025-06-12

Family

ID=89941531

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112022007665.8T Pending DE112022007665T5 (de) 2022-08-17 2022-08-17 Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung

Country Status (5)

Country Link
US (1) US20250300045A1 (https=)
JP (1) JP7690133B2 (https=)
CN (1) CN119631174A (https=)
DE (1) DE112022007665T5 (https=)
WO (1) WO2024038511A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0567871A (ja) * 1991-04-26 1993-03-19 Nec Toyama Ltd 印刷配線板及びその製造方法
JPH09283901A (ja) * 1996-04-12 1997-10-31 Nec Corp 表面実装ｌｓｉパッケージの実装方法および構造
JP6538513B2 (ja) * 2015-10-02 2019-07-03 株式会社 日立パワーデバイス 半導体パワーモジュールおよび移動体
JP2020178003A (ja) * 2019-04-17 2020-10-29 三菱電機株式会社 パワー半導体モジュールおよびパワー半導体モジュールの製造方法
JP7217837B2 (ja) * 2020-07-22 2023-02-03 三菱電機株式会社 半導体装置、電力変換装置、移動体、および半導体装置の製造方法

Also Published As

Publication number Publication date
JP7690133B2 (ja) 2025-06-09
US20250300045A1 (en) 2025-09-25
CN119631174A (zh) 2025-03-14
WO2024038511A1 (ja) 2024-02-22
JPWO2024038511A1 (https=) 2024-02-22

Similar Documents

Publication Publication Date Title
DE102015210603B4 (de) Verfahren zur Herstellung einer Halbleitervorrichtung
DE102009055691B4 (de) Leistungshalbleitermodul
DE112016002302B4 (de) Leistungs-Halbleitervorrichtung
DE102009042399B4 (de) Leistungshalbleitervorrichtung und Herstellungsverfahren dafür
DE102018200830B4 (de) Halbleitervorrichtung
DE102011084803A1 (de) Leistungshalbleitervorrichtung
DE102014107088B4 (de) Halbleiterpackage und Verfahren
DE102004060935B4 (de) Leistungshalbleitervorrichtung
DE102014223863B4 (de) Leistungshalbleitereinrichtungen
DE102020125705A1 (de) Leistungs-Halbleitervorrichtung
DE112016006336B4 (de) Halbleitervorrichtung
DE102015220639B4 (de) Halbleitervorrichtung und Verfahren zum Herstellen derselben
DE4130899C2 (de) Halbleitervorrichtung
DE102020105267A1 (de) Halbleitervorrichtung und Verfahren zur Herstellung derselben
DE102022103210B4 (de) Chippackage und Verfahren zum Bilden eines Chippackages
DE112021004922T5 (de) Halbleiterbauelement
DE102015223300B4 (de) Halbleitervorrichtung
DE102021121875B4 (de) Halbleitereinrichtung und herstellungsverfahren einer halbleitereinrichtung
DE102022116910A1 (de) Halbleitervorrichtung
DE102022116908A1 (de) Halbleitervorrichtung
DE112022001601T5 (de) Halbleiterbauteil und herstellungsverfahren für das halbleiterbauteil
WO2022263543A1 (de) Leiterplattenanordnung
DE112022007665T5 (de) Halbleitervorrichtung und Verfahren zur Herstellung einer Halbleitervorrichtung
DE112020002845T5 (de) Halbleitervorrichtung
DE102020122542A1 (de) Verbindungsclip mit abgewinkelter kontaktfläche und erhöhter brücke

Legal Events

Date Code Title Description
R012 Request for examination validly filed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023120000

Ipc: H10W0070600000