JP7680880B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP7680880B2 JP7680880B2 JP2021084762A JP2021084762A JP7680880B2 JP 7680880 B2 JP7680880 B2 JP 7680880B2 JP 2021084762 A JP2021084762 A JP 2021084762A JP 2021084762 A JP2021084762 A JP 2021084762A JP 7680880 B2 JP7680880 B2 JP 7680880B2
- Authority
- JP
- Japan
- Prior art keywords
- frame
- wafer
- cooling water
- suction
- grinding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0046—Column grinding machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/06—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving conveyor belts, a sequence of travelling work-tables or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Jigs For Machine Tools (AREA)
Description
2:装置ハウジング
21:本体部
22:直立壁
3:チャックテーブル機構
32:チャックテーブル
320:枠体
321:ポーラスプレート
321a:吸着面
321b:側面
321c:裏面
322:上部枠体
322a:枠上面
322b:プレート載置面
322c:ウエーハ吸引孔
322d:外周段差部
322e:ボルト孔
322f:環状溝
322g::下面
322h:側壁
323:下部枠体
323a:表面
323b:冷却水路
323c:冷却水供給孔
323d:冷却水噴出孔
323e:貫通孔
323f:ボルト孔
323g:下面
34:テーブルベース
341:載置面
342:枠体供給孔
343:冷却水供給孔
344:第一の連通孔
345:ボルト締結孔
3’:チャックテーブル機構
32’:チャックテーブル
320’:枠体
321:ポーラスプレート
321a:吸着面
321b:側面
321c:裏面
322’:上部枠体
322a’:枠上面
322b’:プレート載置面
322c’:ウエーハ吸引孔
322d’:外周段差部
322e’:ボルト孔
322f’:環状溝
322g’:下面
322h’:側壁
323:下部枠体
323a:表面
323b:冷却水路
323c:冷却水供給孔
323d:冷却水噴出孔
323e:貫通孔
323f:ボルト孔
323g:下面
34':テーブルベース
341':載置面
342':枠体供給孔
343':冷却水供給孔
344’:第二の連通孔
345’:ボルト締結孔
4:研削手段
5:加工液供給手段
6a,6b:蛇腹手段
7:研削送り手段
8:ボルト
10:ウエーハ
Claims (2)
- ウエーハを吸引保持する保持手段と、該保持手段に保持されたウエーハを研削する研削ホイールを回転可能に備えた加工手段と、ウエーハに加工液を供給する加工液供給手段と、を少なくとも備えた加工装置であって、
該保持手段は、ウエーハを保持するチャックテーブルと、該チャックテーブルを着脱自在に支持するテーブルベースと、を含み、
該チャックテーブルは、ウエーハを吸着する吸着面を備えたポーラスプレートと、該吸着面以外を囲繞する枠体と、該枠体の内部に形成され冷却水を行き渡らせる冷却水路と、該枠体に形成され該ポーラスプレートの吸着面に吸引力を伝達するウエーハ吸引孔と、該枠体に形成されチャックテーブルを該テーブルベースに固定するボルト孔とを含み構成され、
該テーブルベースは、該枠体の下面側が載置される載置面と、該載置面に形成され該枠体を吸引して引き付ける枠体吸引孔と、該冷却水路に連通され該冷却水路に冷却水を供給する冷却水供給孔と、を備え、
該ウエーハ吸引孔は、該枠体の該ポーラスプレートが載置されるプレート載置面に形成され、該テーブルベースの載置面には、該ウエーハ吸引孔に連通されると共に、該枠体吸引孔とは独立して吸引力を伝達する連通孔が形成される加工装置。 - ウエーハを吸引保持する保持手段と、該保持手段に保持されたウエーハを研削する研削ホイールを回転可能に備えた加工手段と、ウエーハに加工液を供給する加工液供給手段と、を少なくとも備えた加工装置であって、
該保持手段は、ウエーハを保持するチャックテーブルと、該チャックテーブルを着脱自在に支持するテーブルベースと、を含み、
該チャックテーブルは、ウエーハを吸着する吸着面を備えたポーラスプレートと、該吸着面以外を囲繞する枠体と、該枠体の内部に形成され冷却水を行き渡らせる冷却水路と、該枠体に形成され該ポーラスプレートの吸着面に吸引力を伝達するウエーハ吸引孔と、該枠体に形成されチャックテーブルを該テーブルベースに固定するボルト孔とを含み構成され、
該テーブルベースは、該枠体の下面側が載置される載置面と、該載置面に形成され該枠体を吸引して引き付ける枠体吸引孔と、該冷却水路に連通され該冷却水路に冷却水を供給する冷却水供給孔と、を備え、
該ウエーハ吸引孔は、該枠体の側面に形成され、該テーブルベースの側面に該枠体吸引孔とは独立して吸引力を伝達する連通孔が形成される加工装置。
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021084762A JP7680880B2 (ja) | 2021-05-19 | 2021-05-19 | 加工装置 |
| US17/660,667 US20220375780A1 (en) | 2021-05-19 | 2022-04-26 | Processing apparatus |
| TW111117027A TWI914531B (zh) | 2021-05-19 | 2022-05-05 | 加工裝置 |
| KR1020220056331A KR20220156752A (ko) | 2021-05-19 | 2022-05-09 | 가공 장치 |
| CN202210502358.9A CN115365919A (zh) | 2021-05-19 | 2022-05-10 | 加工装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021084762A JP7680880B2 (ja) | 2021-05-19 | 2021-05-19 | 加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022178178A JP2022178178A (ja) | 2022-12-02 |
| JP7680880B2 true JP7680880B2 (ja) | 2025-05-21 |
Family
ID=84060209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021084762A Active JP7680880B2 (ja) | 2021-05-19 | 2021-05-19 | 加工装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20220375780A1 (ja) |
| JP (1) | JP7680880B2 (ja) |
| KR (1) | KR20220156752A (ja) |
| CN (1) | CN115365919A (ja) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116153840B (zh) * | 2023-02-24 | 2023-11-03 | 长春光华微电子设备工程中心有限公司 | 一种卡盘 |
| CN116652766B (zh) * | 2023-05-30 | 2025-12-30 | 青岛云创环境科技有限公司 | 一种半导体硅晶片加工冷却设备 |
| KR102852065B1 (ko) * | 2024-04-04 | 2025-09-01 | 아석산업 주식회사 | 진공 척 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008177406A (ja) | 2007-01-19 | 2008-07-31 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
| JP2012166274A (ja) | 2011-02-10 | 2012-09-06 | Disco Corp | 研磨装置 |
| JP2014093384A (ja) | 2012-11-02 | 2014-05-19 | Disco Abrasive Syst Ltd | チャックテーブル |
| JP2014212190A (ja) | 2013-04-18 | 2014-11-13 | 株式会社ディスコ | チャックテーブル |
| JP2014237200A (ja) | 2013-06-10 | 2014-12-18 | 株式会社ディスコ | チャックテーブル及び研削研磨装置 |
| JP2015079859A (ja) | 2013-10-17 | 2015-04-23 | 株式会社ディスコ | 被加工物保持機構 |
| JP2018041799A (ja) | 2016-09-06 | 2018-03-15 | 株式会社ディスコ | チャックテーブル、チャックテーブルを構成するポーラスセラミックスの生成方法、及び吸引保持システム |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7169014B2 (en) * | 2002-07-18 | 2007-01-30 | Micron Technology, Inc. | Apparatuses for controlling the temperature of polishing pads used in planarizing micro-device workpieces |
| JP4464113B2 (ja) | 2003-11-27 | 2010-05-19 | 株式会社ディスコ | ウエーハの加工装置 |
| US10480873B2 (en) * | 2012-05-30 | 2019-11-19 | Kyocera Corporation | Flow path member, and adsorption device and cooling device using the same |
| JP6360756B2 (ja) * | 2014-09-05 | 2018-07-18 | 株式会社ディスコ | チャックテーブル |
| JP2016092347A (ja) * | 2014-11-11 | 2016-05-23 | 株式会社ディスコ | エッチング方法 |
| JP6710138B2 (ja) * | 2016-10-07 | 2020-06-17 | 株式会社ディスコ | フレーム固定治具 |
| JP2018085408A (ja) * | 2016-11-22 | 2018-05-31 | 株式会社ディスコ | 減圧処理装置 |
| JP7090465B2 (ja) * | 2018-05-10 | 2022-06-24 | 東京エレクトロン株式会社 | 載置台及びプラズマ処理装置 |
-
2021
- 2021-05-19 JP JP2021084762A patent/JP7680880B2/ja active Active
-
2022
- 2022-04-26 US US17/660,667 patent/US20220375780A1/en active Pending
- 2022-05-09 KR KR1020220056331A patent/KR20220156752A/ko active Pending
- 2022-05-10 CN CN202210502358.9A patent/CN115365919A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008177406A (ja) | 2007-01-19 | 2008-07-31 | Disco Abrasive Syst Ltd | ウエーハの加工装置 |
| JP2012166274A (ja) | 2011-02-10 | 2012-09-06 | Disco Corp | 研磨装置 |
| JP2014093384A (ja) | 2012-11-02 | 2014-05-19 | Disco Abrasive Syst Ltd | チャックテーブル |
| JP2014212190A (ja) | 2013-04-18 | 2014-11-13 | 株式会社ディスコ | チャックテーブル |
| JP2014237200A (ja) | 2013-06-10 | 2014-12-18 | 株式会社ディスコ | チャックテーブル及び研削研磨装置 |
| JP2015079859A (ja) | 2013-10-17 | 2015-04-23 | 株式会社ディスコ | 被加工物保持機構 |
| JP2018041799A (ja) | 2016-09-06 | 2018-03-15 | 株式会社ディスコ | チャックテーブル、チャックテーブルを構成するポーラスセラミックスの生成方法、及び吸引保持システム |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115365919A (zh) | 2022-11-22 |
| US20220375780A1 (en) | 2022-11-24 |
| TW202245975A (zh) | 2022-12-01 |
| JP2022178178A (ja) | 2022-12-02 |
| KR20220156752A (ko) | 2022-11-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP7680880B2 (ja) | 加工装置 | |
| KR102606113B1 (ko) | 연삭 연마 장치 및 연삭 연마 방법 | |
| TWI898132B (zh) | 加工方法 | |
| JP2012166274A (ja) | 研磨装置 | |
| JP2022038718A (ja) | 加工装置 | |
| JP6767803B2 (ja) | 加工装置 | |
| JP7320358B2 (ja) | 加工装置及び洗浄方法 | |
| CN111599739A (zh) | 卡盘工作台 | |
| JP4410062B2 (ja) | チャックテーブル | |
| JP7658725B2 (ja) | 加工装置 | |
| TWI914531B (zh) | 加工裝置 | |
| JP2021003740A (ja) | 被加工物の研削方法及び研削装置 | |
| JP7803725B2 (ja) | チャックテーブル及び研削装置 | |
| JP7636120B2 (ja) | 加工装置 | |
| JP2022092275A (ja) | 加工装置 | |
| US12343821B2 (en) | Processing equipment | |
| CN115816200A (zh) | 加工装置 | |
| JP2023178694A (ja) | Cmp研磨装置 | |
| JP2024000701A (ja) | 異物除去方法 | |
| JP2024134804A (ja) | 研削ホイール及び研削方法 | |
| TW202116482A (zh) | 切割裝置之卡盤台 | |
| JP2025110078A (ja) | 伸縮カバー及びこれを備えた加工装置 | |
| JP2023140627A (ja) | 加工装置、清掃方法、及び清掃用プレート | |
| TW202330191A (zh) | 磨削裝置 | |
| JP2022134856A (ja) | チャックテーブルの洗浄方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240329 |
|
| RD03 | Notification of appointment of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7423 Effective date: 20240412 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20241218 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20241224 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250217 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250415 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250509 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7680880 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |