JP7644597B2 - Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品 - Google Patents

Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品 Download PDF

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Publication number
JP7644597B2
JP7644597B2 JP2020214110A JP2020214110A JP7644597B2 JP 7644597 B2 JP7644597 B2 JP 7644597B2 JP 2020214110 A JP2020214110 A JP 2020214110A JP 2020214110 A JP2020214110 A JP 2020214110A JP 7644597 B2 JP7644597 B2 JP 7644597B2
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JP
Japan
Prior art keywords
plating layer
plating
plated
layer
porous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020214110A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022100002A (ja
JP2022100002A5 (enExample
Inventor
陽介 佐藤
悠太郎 平井
健太郎 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2020214110A priority Critical patent/JP7644597B2/ja
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Priority to US18/265,545 priority patent/US12497707B2/en
Priority to EP21909773.0A priority patent/EP4269659A4/en
Priority to CN202180085179.3A priority patent/CN116601339A/zh
Priority to PCT/JP2021/026414 priority patent/WO2022137613A1/ja
Priority to MX2023006862A priority patent/MX2023006862A/es
Publication of JP2022100002A publication Critical patent/JP2022100002A/ja
Publication of JP2022100002A5 publication Critical patent/JP2022100002A5/ja
Application granted granted Critical
Publication of JP7644597B2 publication Critical patent/JP7644597B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2020214110A 2020-12-23 2020-12-23 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品 Active JP7644597B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020214110A JP7644597B2 (ja) 2020-12-23 2020-12-23 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品
EP21909773.0A EP4269659A4 (en) 2020-12-23 2021-07-14 Ag-plated material, production method for ag-plated material, and electrical member
CN202180085179.3A CN116601339A (zh) 2020-12-23 2021-07-14 镀Ag材、镀Ag材的制造方法、以及电子部件
PCT/JP2021/026414 WO2022137613A1 (ja) 2020-12-23 2021-07-14 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品
US18/265,545 US12497707B2 (en) 2020-12-23 2021-07-14 Ag-plated material, method for producing Ag-plated material, and electrical component
MX2023006862A MX2023006862A (es) 2020-12-23 2021-07-14 Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020214110A JP7644597B2 (ja) 2020-12-23 2020-12-23 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品

Publications (3)

Publication Number Publication Date
JP2022100002A JP2022100002A (ja) 2022-07-05
JP2022100002A5 JP2022100002A5 (enExample) 2023-05-24
JP7644597B2 true JP7644597B2 (ja) 2025-03-12

Family

ID=82158896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020214110A Active JP7644597B2 (ja) 2020-12-23 2020-12-23 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品

Country Status (6)

Country Link
US (1) US12497707B2 (enExample)
EP (1) EP4269659A4 (enExample)
JP (1) JP7644597B2 (enExample)
CN (1) CN116601339A (enExample)
MX (1) MX2023006862A (enExample)
WO (1) WO2022137613A1 (enExample)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1966779A (zh) 2005-11-17 2007-05-23 中国科学院兰州化学物理研究所 镍－铜－银多层膜的制备方法
WO2013094766A1 (ja) 2011-12-22 2013-06-27 オーエム産業株式会社 めっき品及びその製造方法
JP2013129902A (ja) 2011-12-22 2013-07-04 Om Sangyo Kk めっき品及びその製造方法
JP2017014589A (ja) 2015-07-03 2017-01-19 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102691033B (zh) * 2011-03-22 2014-12-31 鸿富锦精密工业（深圳）有限公司 抗菌镀膜件及其制备方法
JP2015059260A (ja) 2013-09-20 2015-03-30 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
JP6532322B2 (ja) 2015-07-03 2019-06-19 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
WO2020153396A1 (ja) * 2019-01-24 2020-07-30 三菱マテリアル株式会社 コネクタ用端子材及びコネクタ用端子
JP2020187971A (ja) * 2019-05-16 2020-11-19 株式会社オートネットワーク技術研究所 コネクタ端子、端子付き電線、及び端子対
JP7625412B2 (ja) * 2020-12-10 2025-02-03 Ｄｏｗａメタルテック株式会社 Ａｇ被覆素材、Ａｇ被覆素材の製造方法及び端子部品
CN117996479A (zh) * 2022-10-31 2024-05-07 泰科电子(上海)有限公司 导电端子及其所应用的电连接器

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1966779A (zh) 2005-11-17 2007-05-23 中国科学院兰州化学物理研究所 镍－铜－银多层膜的制备方法
WO2013094766A1 (ja) 2011-12-22 2013-06-27 オーエム産業株式会社 めっき品及びその製造方法
JP2013129902A (ja) 2011-12-22 2013-07-04 Om Sangyo Kk めっき品及びその製造方法
JP2017014589A (ja) 2015-07-03 2017-01-19 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Also Published As

Publication number Publication date
US12497707B2 (en) 2025-12-16
MX2023006862A (es) 2023-06-22
US20240026558A1 (en) 2024-01-25
EP4269659A1 (en) 2023-11-01
EP4269659A4 (en) 2024-10-09
WO2022137613A1 (ja) 2022-06-30
JP2022100002A (ja) 2022-07-05
CN116601339A (zh) 2023-08-15

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