MX2023006862A - Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico. - Google Patents

Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico.

Info

Publication number
MX2023006862A
MX2023006862A MX2023006862A MX2023006862A MX2023006862A MX 2023006862 A MX2023006862 A MX 2023006862A MX 2023006862 A MX2023006862 A MX 2023006862A MX 2023006862 A MX2023006862 A MX 2023006862A MX 2023006862 A MX2023006862 A MX 2023006862A
Authority
MX
Mexico
Prior art keywords
plated material
production method
electrical member
plated
base material
Prior art date
Application number
MX2023006862A
Other languages
English (en)
Inventor
Yosuke Sato
Kentaro Arai
Yutaro Hirai
Original Assignee
Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of MX2023006862A publication Critical patent/MX2023006862A/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C25D5/14—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium two or more layers being of nickel or chromium, e.g. duplex or triplex layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La presente invención se relaciona con un material depositado de Ag en el que se forma una capa de deposición de Ag sobre un material base que comprende un metal conductor; y una tecnología relacionada. El material depositado de Ag comprende una pluralidad de estructuras de deposición de dos capas que se forman sobre el material base y cada una incluye, en orden desde el lado del material base, una capa porosa de deposición de Ni y una capa de deposición de Ag.
MX2023006862A 2020-12-23 2021-07-14 Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico. MX2023006862A (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020214110A JP2022100002A (ja) 2020-12-23 2020-12-23 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品
PCT/JP2021/026414 WO2022137613A1 (ja) 2020-12-23 2021-07-14 Ａｇめっき材、Ａｇめっき材の製造方法、および、電気部品

Publications (1)

Publication Number Publication Date
MX2023006862A true MX2023006862A (es) 2023-06-22

Family

ID=82158896

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2023006862A MX2023006862A (es) 2020-12-23 2021-07-14 Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico.

Country Status (6)

Country Link
US (1) US20240026558A1 (es)
EP (1) EP4269659A1 (es)
JP (1) JP2022100002A (es)
CN (1) CN116601339A (es)
MX (1) MX2023006862A (es)
WO (1) WO2022137613A1 (es)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013094766A1 (ja) 2011-12-22 2013-06-27 オーエム産業株式会社 めっき品及びその製造方法
JP2013129902A (ja) 2011-12-22 2013-07-04 Om Sangyo Kk めっき品及びその製造方法
JP2015059260A (ja) 2013-09-20 2015-03-30 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
JP6532323B2 (ja) 2015-07-03 2019-06-19 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法
JP6532322B2 (ja) 2015-07-03 2019-06-19 Ｄｏｗａメタルテック株式会社 銀めっき材およびその製造方法

Also Published As

Publication number Publication date
JP2022100002A (ja) 2022-07-05
CN116601339A (zh) 2023-08-15
US20240026558A1 (en) 2024-01-25
EP4269659A1 (en) 2023-11-01
WO2022137613A1 (ja) 2022-06-30

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