JP2022100002A5 - - Google Patents

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Publication number
JP2022100002A5
JP2022100002A5 JP2020214110A JP2020214110A JP2022100002A5 JP 2022100002 A5 JP2022100002 A5 JP 2022100002A5 JP 2020214110 A JP2020214110 A JP 2020214110A JP 2020214110 A JP2020214110 A JP 2020214110A JP 2022100002 A5 JP2022100002 A5 JP 2022100002A5
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JP
Japan
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present
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JP2020214110A
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English (en)
Japanese (ja)
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JP7644597B2 (ja
JP2022100002A (ja
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Priority claimed from JP2020214110A external-priority patent/JP7644597B2/ja
Priority to JP2020214110A priority Critical patent/JP7644597B2/ja
Priority to US18/265,545 priority patent/US12497707B2/en
Priority to CN202180085179.3A priority patent/CN116601339A/zh
Priority to PCT/JP2021/026414 priority patent/WO2022137613A1/ja
Priority to EP21909773.0A priority patent/EP4269659A4/en
Priority to MX2023006862A priority patent/MX2023006862A/es
Publication of JP2022100002A publication Critical patent/JP2022100002A/ja
Publication of JP2022100002A5 publication Critical patent/JP2022100002A5/ja
Publication of JP7644597B2 publication Critical patent/JP7644597B2/ja
Application granted granted Critical
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JP2020214110A 2020-12-23 2020-12-23 Agめっき材、Agめっき材の製造方法、および、電気部品 Active JP7644597B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2020214110A JP7644597B2 (ja) 2020-12-23 2020-12-23 Agめっき材、Agめっき材の製造方法、および、電気部品
EP21909773.0A EP4269659A4 (en) 2020-12-23 2021-07-14 Ag-plated material, production method for ag-plated material, and electrical member
CN202180085179.3A CN116601339A (zh) 2020-12-23 2021-07-14 镀Ag材、镀Ag材的制造方法、以及电子部件
PCT/JP2021/026414 WO2022137613A1 (ja) 2020-12-23 2021-07-14 Agめっき材、Agめっき材の製造方法、および、電気部品
US18/265,545 US12497707B2 (en) 2020-12-23 2021-07-14 Ag-plated material, method for producing Ag-plated material, and electrical component
MX2023006862A MX2023006862A (es) 2020-12-23 2021-07-14 Material depositado de plata (ag), metodo para producir un material depositado de plata (ag) y componente electrico.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020214110A JP7644597B2 (ja) 2020-12-23 2020-12-23 Agめっき材、Agめっき材の製造方法、および、電気部品

Publications (3)

Publication Number Publication Date
JP2022100002A JP2022100002A (ja) 2022-07-05
JP2022100002A5 true JP2022100002A5 (enExample) 2023-05-24
JP7644597B2 JP7644597B2 (ja) 2025-03-12

Family

ID=82158896

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020214110A Active JP7644597B2 (ja) 2020-12-23 2020-12-23 Agめっき材、Agめっき材の製造方法、および、電気部品

Country Status (6)

Country Link
US (1) US12497707B2 (enExample)
EP (1) EP4269659A4 (enExample)
JP (1) JP7644597B2 (enExample)
CN (1) CN116601339A (enExample)
MX (1) MX2023006862A (enExample)
WO (1) WO2022137613A1 (enExample)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1966779A (zh) * 2005-11-17 2007-05-23 中国科学院兰州化学物理研究所 镍-铜-银多层膜的制备方法
CN102691033B (zh) * 2011-03-22 2014-12-31 鸿富锦精密工业(深圳)有限公司 抗菌镀膜件及其制备方法
CN104040035B (zh) * 2011-12-22 2017-05-03 Om产业股份有限公司 镀品及其制造方法
JP2013129902A (ja) * 2011-12-22 2013-07-04 Om Sangyo Kk めっき品及びその製造方法
JP2015059260A (ja) 2013-09-20 2015-03-30 株式会社オートネットワーク技術研究所 コネクタ用電気接点材料及びその製造方法
JP6532323B2 (ja) * 2015-07-03 2019-06-19 Dowaメタルテック株式会社 銀めっき材およびその製造方法
JP6532322B2 (ja) 2015-07-03 2019-06-19 Dowaメタルテック株式会社 銀めっき材およびその製造方法
WO2020153396A1 (ja) * 2019-01-24 2020-07-30 三菱マテリアル株式会社 コネクタ用端子材及びコネクタ用端子
JP2020187971A (ja) * 2019-05-16 2020-11-19 株式会社オートネットワーク技術研究所 コネクタ端子、端子付き電線、及び端子対
JP7625412B2 (ja) * 2020-12-10 2025-02-03 Dowaメタルテック株式会社 Ag被覆素材、Ag被覆素材の製造方法及び端子部品
CN117996479A (zh) * 2022-10-31 2024-05-07 泰科电子(上海)有限公司 导电端子及其所应用的电连接器

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