JP7629935B2 - 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 - Google Patents

二液硬化型組成物セット、熱伝導性硬化物及び電子機器 Download PDF

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Publication number
JP7629935B2
JP7629935B2 JP2022555438A JP2022555438A JP7629935B2 JP 7629935 B2 JP7629935 B2 JP 7629935B2 JP 2022555438 A JP2022555438 A JP 2022555438A JP 2022555438 A JP2022555438 A JP 2022555438A JP 7629935 B2 JP7629935 B2 JP 7629935B2
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JP
Japan
Prior art keywords
group
thermally conductive
epoxy
agent
modified organopolysiloxane
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JP2022555438A
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English (en)
Japanese (ja)
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JPWO2022075213A1 (https=
Inventor
正雄 小野塚
雅士 久米
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2022075213A1 publication Critical patent/JPWO2022075213A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022555438A 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器 Active JP7629935B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020168548 2020-10-05
JP2020168548 2020-10-05
PCT/JP2021/036402 WO2022075213A1 (ja) 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器

Publications (2)

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JPWO2022075213A1 JPWO2022075213A1 (https=) 2022-04-14
JP7629935B2 true JP7629935B2 (ja) 2025-02-14

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JP2022555438A Active JP7629935B2 (ja) 2020-10-05 2021-10-01 二液硬化型組成物セット、熱伝導性硬化物及び電子機器

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JP (1) JP7629935B2 (https=)
WO (1) WO2022075213A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003528198A (ja) 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2011151280A (ja) 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
WO2019097852A1 (ja) 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5590554A (en) * 1978-12-29 1980-07-09 Toray Silicone Co Ltd Silicone-epoxy resin composition
JPS60179417A (ja) * 1984-02-27 1985-09-13 Shin Etsu Chem Co Ltd 液状シリコ−ンゴム組成物
DE4309700C2 (de) * 1993-03-25 1995-02-23 Sigri Great Lakes Carbon Gmbh Verfahren zur Herstellung eines Schichtstoffes aus Metall und Graphit
JP3498823B2 (ja) * 1996-04-30 2004-02-23 電気化学工業株式会社 放熱スペーサーおよびその用途
JP3697645B2 (ja) * 1996-12-25 2005-09-21 株式会社ジェルテック 熱伝導ゲル

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003528198A (ja) 2000-03-16 2003-09-24 クロムプトン コーポレイション シリコーンアミノ−エポキシ架橋性システム
JP2011151280A (ja) 2010-01-25 2011-08-04 Denki Kagaku Kogyo Kk 放熱部材及びその製造方法
CN107325782A (zh) 2017-05-19 2017-11-07 天永诚高分子材料（常州）有限公司 一种双组分灌封胶及其制备方法
WO2019097852A1 (ja) 2017-11-14 2019-05-23 株式会社高木化学研究所 分離安定性に優れたフィラー充填高熱伝導性分散液組成物、前記分散液組成物の製造方法、前記分散液組成物を用いたフィラー充填高熱伝導性材料、前記材料の製造方法、及び前記材料を用いて得られる成形品

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WO2022075213A1 (ja) 2022-04-14

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