JP7605334B2 - 気密パッケージ素子および素子モジュール - Google Patents

気密パッケージ素子および素子モジュール Download PDF

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Publication number
JP7605334B2
JP7605334B2 JP2023552427A JP2023552427A JP7605334B2 JP 7605334 B2 JP7605334 B2 JP 7605334B2 JP 2023552427 A JP2023552427 A JP 2023552427A JP 2023552427 A JP2023552427 A JP 2023552427A JP 7605334 B2 JP7605334 B2 JP 7605334B2
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JP
Japan
Prior art keywords
wafer
device wafer
protruding region
crystal orientation
lid
Prior art date
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Application number
JP2023552427A
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English (en)
Japanese (ja)
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JPWO2023058103A1 (https=
Inventor
有輔 山縣
隆幸 加藤
倫宏 前川
貴紀 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
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Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2023058103A1 publication Critical patent/JPWO2023058103A1/ja
Application granted granted Critical
Publication of JP7605334B2 publication Critical patent/JP7605334B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2023552427A 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール Active JP7605334B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/036754 WO2023058103A1 (ja) 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール

Publications (2)

Publication Number Publication Date
JPWO2023058103A1 JPWO2023058103A1 (https=) 2023-04-13
JP7605334B2 true JP7605334B2 (ja) 2024-12-24

Family

ID=85804009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552427A Active JP7605334B2 (ja) 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール

Country Status (4)

Country Link
US (1) US20240387436A1 (https=)
JP (1) JP7605334B2 (https=)
CN (1) CN118043280A (https=)
WO (1) WO2023058103A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024247000A1 (ja) * 2023-05-26 2024-12-05 三菱電機株式会社 赤外線撮像装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133535A (ja) 2001-10-22 2003-05-09 Kyocera Corp 撮像素子収納用パッケージ
JP2020017717A (ja) 2018-07-11 2020-01-30 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
JP2020123881A (ja) 2019-01-31 2020-08-13 セイコーエプソン株式会社 振動デバイス、振動モジュール、電子機器および移動体
WO2021033269A1 (ja) 2019-08-20 2021-02-25 三菱電機株式会社 半導体パッケージ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335435A (ja) * 1992-05-29 1993-12-17 Kyocera Corp 半導体素子収納用パッケージ
JP4776195B2 (ja) * 2004-09-10 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
JP2007188909A (ja) * 2005-12-14 2007-07-26 Fujifilm Corp 固体撮像装置及びその製造方法
SE537499C2 (sv) * 2009-04-30 2015-05-26 Silex Microsystems Ab Bondningsmaterialstruktur och process med bondningsmaterialstruktur
US8597985B1 (en) * 2012-02-01 2013-12-03 Sandia Corporation MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
US10160638B2 (en) * 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US10167190B2 (en) * 2016-02-16 2019-01-01 The Regents Of The University Of California Low cost wafer level process for packaging MEMS three dimensional devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133535A (ja) 2001-10-22 2003-05-09 Kyocera Corp 撮像素子収納用パッケージ
JP2020017717A (ja) 2018-07-11 2020-01-30 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
JP2020123881A (ja) 2019-01-31 2020-08-13 セイコーエプソン株式会社 振動デバイス、振動モジュール、電子機器および移動体
WO2021033269A1 (ja) 2019-08-20 2021-02-25 三菱電機株式会社 半導体パッケージ

Also Published As

Publication number Publication date
JPWO2023058103A1 (https=) 2023-04-13
WO2023058103A1 (ja) 2023-04-13
US20240387436A1 (en) 2024-11-21
CN118043280A (zh) 2024-05-14

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