JPWO2023058103A1 - - Google Patents

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Publication number
JPWO2023058103A1
JPWO2023058103A1 JP2023552427A JP2023552427A JPWO2023058103A1 JP WO2023058103 A1 JPWO2023058103 A1 JP WO2023058103A1 JP 2023552427 A JP2023552427 A JP 2023552427A JP 2023552427 A JP2023552427 A JP 2023552427A JP WO2023058103 A1 JPWO2023058103 A1 JP WO2023058103A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023552427A
Other languages
Japanese (ja)
Other versions
JP7605334B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023058103A1 publication Critical patent/JPWO2023058103A1/ja
Application granted granted Critical
Publication of JP7605334B2 publication Critical patent/JP7605334B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
JP2023552427A 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール Active JP7605334B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/036754 WO2023058103A1 (ja) 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール

Publications (2)

Publication Number Publication Date
JPWO2023058103A1 true JPWO2023058103A1 (https=) 2023-04-13
JP7605334B2 JP7605334B2 (ja) 2024-12-24

Family

ID=85804009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023552427A Active JP7605334B2 (ja) 2021-10-05 2021-10-05 気密パッケージ素子および素子モジュール

Country Status (4)

Country Link
US (1) US20240387436A1 (https=)
JP (1) JP7605334B2 (https=)
CN (1) CN118043280A (https=)
WO (1) WO2023058103A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024247000A1 (ja) * 2023-05-26 2024-12-05 三菱電機株式会社 赤外線撮像装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335435A (ja) * 1992-05-29 1993-12-17 Kyocera Corp 半導体素子収納用パッケージ
JP2003133535A (ja) * 2001-10-22 2003-05-09 Kyocera Corp 撮像素子収納用パッケージ
JP2020017717A (ja) * 2018-07-11 2020-01-30 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
JP2020123881A (ja) * 2019-01-31 2020-08-13 セイコーエプソン株式会社 振動デバイス、振動モジュール、電子機器および移動体
WO2021033269A1 (ja) * 2019-08-20 2021-02-25 三菱電機株式会社 半導体パッケージ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4776195B2 (ja) * 2004-09-10 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
JP2007188909A (ja) * 2005-12-14 2007-07-26 Fujifilm Corp 固体撮像装置及びその製造方法
SE537499C2 (sv) * 2009-04-30 2015-05-26 Silex Microsystems Ab Bondningsmaterialstruktur och process med bondningsmaterialstruktur
US8597985B1 (en) * 2012-02-01 2013-12-03 Sandia Corporation MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads
US10160638B2 (en) * 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US10167190B2 (en) * 2016-02-16 2019-01-01 The Regents Of The University Of California Low cost wafer level process for packaging MEMS three dimensional devices

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05335435A (ja) * 1992-05-29 1993-12-17 Kyocera Corp 半導体素子収納用パッケージ
JP2003133535A (ja) * 2001-10-22 2003-05-09 Kyocera Corp 撮像素子収納用パッケージ
JP2020017717A (ja) * 2018-07-11 2020-01-30 三菱電機株式会社 パッケージ素子の製造方法およびパッケージ素子
JP2020123881A (ja) * 2019-01-31 2020-08-13 セイコーエプソン株式会社 振動デバイス、振動モジュール、電子機器および移動体
WO2021033269A1 (ja) * 2019-08-20 2021-02-25 三菱電機株式会社 半導体パッケージ

Also Published As

Publication number Publication date
WO2023058103A1 (ja) 2023-04-13
US20240387436A1 (en) 2024-11-21
CN118043280A (zh) 2024-05-14
JP7605334B2 (ja) 2024-12-24

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