JP7602657B2 - 積層セラミック電子部品の製造方法 - Google Patents

積層セラミック電子部品の製造方法 Download PDF

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Publication number
JP7602657B2
JP7602657B2 JP2023543782A JP2023543782A JP7602657B2 JP 7602657 B2 JP7602657 B2 JP 7602657B2 JP 2023543782 A JP2023543782 A JP 2023543782A JP 2023543782 A JP2023543782 A JP 2023543782A JP 7602657 B2 JP7602657 B2 JP 7602657B2
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JP
Japan
Prior art keywords
cut
green sheet
cut side
internal electrode
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023543782A
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English (en)
Japanese (ja)
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JPWO2023026807A1 (https=
Inventor
大俊 江藤
恒 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of JPWO2023026807A1 publication Critical patent/JPWO2023026807A1/ja
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/042—Punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2023543782A 2021-08-24 2022-08-03 積層セラミック電子部品の製造方法 Active JP7602657B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021136643 2021-08-24
JP2021136643 2021-08-24
PCT/JP2022/029808 WO2023026807A1 (ja) 2021-08-24 2022-08-03 積層セラミック電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPWO2023026807A1 JPWO2023026807A1 (https=) 2023-03-02
JP7602657B2 true JP7602657B2 (ja) 2024-12-18

Family

ID=85323142

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023543782A Active JP7602657B2 (ja) 2021-08-24 2022-08-03 積層セラミック電子部品の製造方法

Country Status (4)

Country Link
US (1) US20240351325A1 (https=)
JP (1) JP7602657B2 (https=)
CN (1) CN117916831A (https=)
WO (1) WO2023026807A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299222A (ja) 1999-04-15 2000-10-24 Matsushita Electric Ind Co Ltd 積層セラミック電子部品およびその製造方法
JP2017120880A (ja) 2015-12-25 2017-07-06 太陽誘電株式会社 積層セラミック電子部品及びその製造方法
JP2020188192A (ja) 2019-05-16 2020-11-19 株式会社村田製作所 電子部品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580310A (en) * 1978-12-13 1980-06-17 Matsushita Electric Industrial Co Ltd Method of fabricating laminated ceramic capacitor
JPH065656B2 (ja) * 1988-02-19 1994-01-19 株式会社村田製作所 セラミック積層体の製造方法
JP3042464B2 (ja) * 1997-10-06 2000-05-15 松下電器産業株式会社 セラミック電子部品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000299222A (ja) 1999-04-15 2000-10-24 Matsushita Electric Ind Co Ltd 積層セラミック電子部品およびその製造方法
JP2017120880A (ja) 2015-12-25 2017-07-06 太陽誘電株式会社 積層セラミック電子部品及びその製造方法
JP2020188192A (ja) 2019-05-16 2020-11-19 株式会社村田製作所 電子部品の製造方法

Also Published As

Publication number Publication date
US20240351325A1 (en) 2024-10-24
JPWO2023026807A1 (https=) 2023-03-02
CN117916831A (zh) 2024-04-19
WO2023026807A1 (ja) 2023-03-02

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