CN117916831A - 层叠陶瓷电子部件的制造方法 - Google Patents

层叠陶瓷电子部件的制造方法 Download PDF

Info

Publication number
CN117916831A
CN117916831A CN202280057188.6A CN202280057188A CN117916831A CN 117916831 A CN117916831 A CN 117916831A CN 202280057188 A CN202280057188 A CN 202280057188A CN 117916831 A CN117916831 A CN 117916831A
Authority
CN
China
Prior art keywords
air
cut
green
green sheet
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280057188.6A
Other languages
English (en)
Chinese (zh)
Inventor
江藤大俊
佐藤恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of CN117916831A publication Critical patent/CN117916831A/zh
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/0004Cutting, tearing or severing, e.g. bursting; Cutter details
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/005Electrodes
    • H01G4/012Form of non-self-supporting electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • H01G4/1209Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/04Punching, slitting or perforating
    • B32B2038/042Punching

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
CN202280057188.6A 2021-08-24 2022-08-03 层叠陶瓷电子部件的制造方法 Pending CN117916831A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021136643 2021-08-24
JP2021-136643 2021-08-24
PCT/JP2022/029808 WO2023026807A1 (ja) 2021-08-24 2022-08-03 積層セラミック電子部品の製造方法

Publications (1)

Publication Number Publication Date
CN117916831A true CN117916831A (zh) 2024-04-19

Family

ID=85323142

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280057188.6A Pending CN117916831A (zh) 2021-08-24 2022-08-03 层叠陶瓷电子部件的制造方法

Country Status (4)

Country Link
US (1) US20240351325A1 (https=)
JP (1) JP7602657B2 (https=)
CN (1) CN117916831A (https=)
WO (1) WO2023026807A1 (https=)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5580310A (en) * 1978-12-13 1980-06-17 Matsushita Electric Industrial Co Ltd Method of fabricating laminated ceramic capacitor
JPH065656B2 (ja) * 1988-02-19 1994-01-19 株式会社村田製作所 セラミック積層体の製造方法
JP3042464B2 (ja) * 1997-10-06 2000-05-15 松下電器産業株式会社 セラミック電子部品の製造方法
JP4411682B2 (ja) * 1999-04-15 2010-02-10 パナソニック株式会社 積層セラミック電子部品の製造方法
JP6449826B2 (ja) * 2015-12-25 2019-01-09 太陽誘電株式会社 積層セラミック電子部品及びその製造方法
JP7306051B2 (ja) * 2019-05-16 2023-07-11 株式会社村田製作所 電子部品の製造方法

Also Published As

Publication number Publication date
US20240351325A1 (en) 2024-10-24
JP7602657B2 (ja) 2024-12-18
JPWO2023026807A1 (https=) 2023-03-02
WO2023026807A1 (ja) 2023-03-02

Similar Documents

Publication Publication Date Title
US20080308976A1 (en) Ceramic substrate production process and ceramic substrate produced using the process
KR20060005374A (ko) 적층 전자 부품용 적층체 유닛의 제조방법
KR100733125B1 (ko) 적층 세라믹 전자부품의 제조방법
JPWO2004088686A1 (ja) 積層セラミック電子部品の製造方法
US20100038013A1 (en) Method for manufacturing multilayer ceramic electronic device
CN117916831A (zh) 层叠陶瓷电子部件的制造方法
KR102895528B1 (ko) 절단 방법 및 적층 세라믹 부품의 제조 방법
JP2017112320A (ja) 電子部品の製造方法
TW202405837A (zh) 積層陶瓷電子零件
JP2020004815A (ja) チップ型電子部品の製造方法
JP2005191409A (ja) 積層セラミックコンデンサの製造方法
JP2006100448A (ja) 電子部品の製造方法
JP3909200B2 (ja) ガラスセラミック基板の製造方法
JP3872283B2 (ja) ガラスセラミック基板の製造方法
JP4110536B2 (ja) 多層セラミック集合基板および多層セラミック集合基板の製造方法
JP4683891B2 (ja) 導体形成用シートおよび導体の形成方法ならびに電子部品の製造方法
JP7852600B2 (ja) 電子部品の製造装置
JP2004186343A (ja) セラミック積層体及びその製法
JP3909186B2 (ja) ガラスセラミック基板の製造方法
JP4550243B2 (ja) ガラスセラミック基板の製造方法
CN119317987A (zh) 层叠陶瓷电子部件以及层叠陶瓷电子部件的制造方法
JP2004186344A (ja) セラミック積層体及びその製法
JP3909201B2 (ja) ガラスセラミック基板の製造方法
JP2007123507A (ja) セラミック多層配線基板の製造方法
JP3872440B2 (ja) ガラスセラミック回路基板の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination