JP7598393B2 - 深層学習を用いた三次元構造の検査または計測 - Google Patents

深層学習を用いた三次元構造の検査または計測 Download PDF

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JP7598393B2
JP7598393B2 JP2022578865A JP2022578865A JP7598393B2 JP 7598393 B2 JP7598393 B2 JP 7598393B2 JP 2022578865 A JP2022578865 A JP 2022578865A JP 2022578865 A JP2022578865 A JP 2022578865A JP 7598393 B2 JP7598393 B2 JP 7598393B2
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dimensional structures
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computer systems
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JP2023536564A (ja
JP2023536564A5 (https=
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スコット エー ヤング
クリス バスカー
レナ ニコライデス
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KLA Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
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    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
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    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
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    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
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  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computational Linguistics (AREA)
  • Artificial Intelligence (AREA)
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  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
JP2022578865A 2020-08-07 2021-08-06 深層学習を用いた三次元構造の検査または計測 Active JP7598393B2 (ja)

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US202063062446P 2020-08-07 2020-08-07
US63/062,446 2020-08-07
US17/393,979 2021-08-04
US17/393,979 US11644756B2 (en) 2020-08-07 2021-08-04 3D structure inspection or metrology using deep learning
PCT/US2021/044859 WO2022032046A1 (en) 2020-08-07 2021-08-06 3d structure inspection or metrology using deep learning

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JP2023536564A JP2023536564A (ja) 2023-08-28
JP2023536564A5 JP2023536564A5 (https=) 2024-06-25
JP7598393B2 true JP7598393B2 (ja) 2024-12-11

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US (1) US11644756B2 (https=)
EP (1) EP4153939A4 (https=)
JP (1) JP7598393B2 (https=)
KR (1) KR102685758B1 (https=)
CN (1) CN115917246A (https=)
IL (1) IL299069B2 (https=)
TW (1) TWI865814B (https=)
WO (1) WO2022032046A1 (https=)

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