KR102685758B1 - 딥 러닝을 사용한 3d 구조물 검사 또는 계측 - Google Patents

딥 러닝을 사용한 3d 구조물 검사 또는 계측 Download PDF

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KR102685758B1
KR102685758B1 KR1020227045445A KR20227045445A KR102685758B1 KR 102685758 B1 KR102685758 B1 KR 102685758B1 KR 1020227045445 A KR1020227045445 A KR 1020227045445A KR 20227045445 A KR20227045445 A KR 20227045445A KR 102685758 B1 KR102685758 B1 KR 102685758B1
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스코트 에이 영
크리스 바스카
레나 니콜라이데스
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케이엘에이 코포레이션
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    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
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    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
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  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
KR1020227045445A 2020-08-07 2021-08-06 딥 러닝을 사용한 3d 구조물 검사 또는 계측 Active KR102685758B1 (ko)

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Application Number Priority Date Filing Date Title
US202063062446P 2020-08-07 2020-08-07
US63/062,446 2020-08-07
US17/393,979 2021-08-04
US17/393,979 US11644756B2 (en) 2020-08-07 2021-08-04 3D structure inspection or metrology using deep learning
PCT/US2021/044859 WO2022032046A1 (en) 2020-08-07 2021-08-06 3d structure inspection or metrology using deep learning

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KR102685758B1 true KR102685758B1 (ko) 2024-07-17

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US (1) US11644756B2 (https=)
EP (1) EP4153939A4 (https=)
JP (1) JP7598393B2 (https=)
KR (1) KR102685758B1 (https=)
CN (1) CN115917246A (https=)
IL (1) IL299069B2 (https=)
TW (1) TWI865814B (https=)
WO (1) WO2022032046A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12057336B2 (en) * 2020-12-16 2024-08-06 Samsung Electronics Co., Ltd. Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network
TWI820815B (zh) * 2022-07-22 2023-11-01 合晶科技股份有限公司 平坦度缺陷特徵檢測方法
IL299017B2 (en) * 2022-12-12 2024-09-01 Applied Materials Israel Ltd Automatic segmentation of an image of a semiconductor specimen and usage in metrology
CN115791835B (zh) * 2023-01-10 2025-01-24 上海语荻光电科技有限公司 一种图像采集系统及全息显示用微透镜阵列的微弱缺陷检测方法
US12511731B2 (en) * 2023-05-09 2025-12-30 Orbotech Ltd. System and method for three-dimensional imaging of samples using a machine learning algorithm
CN117601433A (zh) * 2023-11-21 2024-02-27 湖南华曙高科技股份有限公司 零件平整度预测模型训练方法及零件平整度预测方法
CN117824505B (zh) * 2024-03-05 2024-05-07 四川京炜交通工程技术有限公司 一种公路护栏梁板中心离地高度快速检测装置
US20250363615A1 (en) * 2024-05-27 2025-11-27 Kla Corporation Image reconstruction via manifold learning
WO2026033368A1 (en) * 2024-08-08 2026-02-12 Orbotech Ltd Ai 3d-reconstruction from single camera and multiple illumination angles

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG48813A1 (en) * 1993-08-12 1998-05-18 Cytotherapeutics Inc Improved composition and methods for the delivery of biologically active molecules using genetically altered cells contained in biocompatible immunoisolatory capsules
JP4382315B2 (ja) * 2001-09-28 2009-12-09 株式会社日立ハイテクノロジーズ ウェーハバンプの外観検査方法及びウェーハバンプの外観検査装置
US7126699B1 (en) 2002-10-18 2006-10-24 Kla-Tencor Technologies Corp. Systems and methods for multi-dimensional metrology and/or inspection of a specimen
JP2006135129A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp 半導体検査装置及び半導体装置の製造方法
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8698093B1 (en) 2007-01-19 2014-04-15 Kla-Tencor Corporation Objective lens with deflector plates immersed in electrostatic lens field
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8237213B2 (en) 2010-07-15 2012-08-07 Micron Technology, Inc. Memory arrays having substantially vertical, adjacent semiconductor structures and the formation thereof
KR20120064581A (ko) * 2010-12-09 2012-06-19 한국전자통신연구원 영상 분류 방법 및 이를 위한 장치
US8664594B1 (en) 2011-04-18 2014-03-04 Kla-Tencor Corporation Electron-optical system for high-speed and high-sensitivity inspections
US8692204B2 (en) 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
NL2009168A (en) * 2011-08-19 2013-02-21 Asml Netherlands Bv Lithographic apparatus and method.
US8716662B1 (en) 2012-07-16 2014-05-06 Kla-Tencor Corporation Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations
JP2014115245A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
GB2526866A (en) 2014-06-05 2015-12-09 Univ Bristol Apparatus for and method of inspecting surface topography of a moving object
US10127653B2 (en) 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9830421B2 (en) 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10495446B2 (en) * 2015-06-29 2019-12-03 Kla-Tencor Corporation Methods and apparatus for measuring height on a semiconductor wafer
JP2018091807A (ja) * 2016-12-07 2018-06-14 オルボテック リミテッド 欠陥良否判定方法及び装置
US10473454B1 (en) * 2017-01-06 2019-11-12 Kla-Tencor Corporation Imaging-based height measurement based on known geometric information
CN106846463B (zh) * 2017-01-13 2020-02-18 清华大学 基于深度学习神经网络的显微图像三维重建方法及系统
US10733744B2 (en) 2017-05-11 2020-08-04 Kla-Tencor Corp. Learning based approach for aligning images acquired with different modalities
US20190130188A1 (en) 2017-10-26 2019-05-02 Qualcomm Incorporated Object classification in a video analytics system
JP7052377B2 (ja) * 2018-01-29 2022-04-12 セイコーエプソン株式会社 検査装置及び検査方法
CN110945528B (zh) * 2018-02-07 2021-04-02 应用材料以色列公司 产生可用于检查半导体样品的训练集的方法及其系统
US11222415B2 (en) * 2018-04-26 2022-01-11 The Regents Of The University Of California Systems and methods for deep learning microscopy
JP7438150B2 (ja) 2018-06-29 2024-02-26 デルタレイ・ベーフェー 反復投影マッチング法を用いた放射線イメージングによる物品検査
TW202020577A (zh) * 2018-09-28 2020-06-01 荷蘭商Ａｓｍｌ荷蘭公司 基於晶圓量測判定熱點排序
US12561823B2 (en) * 2019-02-15 2026-02-24 Hitachi High-Tech Corporation Structure estimation system and structure estimation program for estimating height of structure based on data from charged particle beam device
CN109887018A (zh) * 2019-02-28 2019-06-14 中国计量大学 一种基于深度学习的光子3d成像系统
CN110443882B (zh) * 2019-07-05 2021-06-11 清华大学 基于深度学习算法的光场显微三维重建方法及装置
CN110554046A (zh) * 2019-09-05 2019-12-10 西安多维机器视觉检测技术有限公司 一种用于电子元器件引脚的检测系统和方法
US11580650B2 (en) 2019-10-01 2023-02-14 KLA Corp. Multi-imaging mode image alignment
CN110779937B (zh) * 2019-10-11 2023-02-03 上海航天精密机械研究所 一种铸件产品内部缺陷智能检测装置
CN111047681B (zh) * 2019-11-07 2022-03-22 北京理工大学 基于深度学习的单像素三维端到端重建方法及装置
KR102228957B1 (ko) 2019-12-30 2021-03-17 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
CN111260720A (zh) * 2020-01-13 2020-06-09 浙江大学 一种基于深度学习方法的目标高度测定系统
KR102837524B1 (ko) * 2020-02-03 2025-07-22 나노트로닉스 이미징, 인코포레이티드 딥 포토메트릭 러닝(dpl) 시스템, 장치 및 방법

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