IL299069B2 - 3D structure or metrology inspection using deep learning - Google Patents

3D structure or metrology inspection using deep learning

Info

Publication number
IL299069B2
IL299069B2 IL299069A IL29906922A IL299069B2 IL 299069 B2 IL299069 B2 IL 299069B2 IL 299069 A IL299069 A IL 299069A IL 29906922 A IL29906922 A IL 29906922A IL 299069 B2 IL299069 B2 IL 299069B2
Authority
IL
Israel
Prior art keywords
images
dimensional structures
specimen
computer systems
deep learning
Prior art date
Application number
IL299069A
Other languages
English (en)
Hebrew (he)
Other versions
IL299069B1 (en
IL299069A (en
Original Assignee
Kla Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Corp filed Critical Kla Corp
Publication of IL299069A publication Critical patent/IL299069A/en
Publication of IL299069B1 publication Critical patent/IL299069B1/en
Publication of IL299069B2 publication Critical patent/IL299069B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70653—Metrology techniques
    • G03F7/70666—Aerial image, i.e. measuring the image of the patterned exposure light at the image plane of the projection system
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/045—Combinations of networks
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/04—Architecture, e.g. interconnection topology
    • G06N3/0464—Convolutional networks [CNN, ConvNet]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00—Computing arrangements based on biological models
    • G06N3/02—Neural networks
    • G06N3/08—Learning methods
    • G06N3/09—Supervised learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/529—Depth or shape recovery from texture
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/50—Depth or shape recovery
    • G06T7/55—Depth or shape recovery from multiple images
    • G06T7/586—Depth or shape recovery from multiple images from multiple light sources, e.g. photometric stereo
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G01N2021/8825—Separate detection of dark field and bright field
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10056—Microscopic image
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20081—Training; Learning
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/20—Special algorithmic details
    • G06T2207/20084—Artificial neural networks [ANN]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computational Linguistics (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Molecular Biology (AREA)
  • Computing Systems (AREA)
  • General Engineering & Computer Science (AREA)
  • Biophysics (AREA)
  • Mathematical Physics (AREA)
  • Software Systems (AREA)
  • Biomedical Technology (AREA)
  • Evolutionary Computation (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Signal Processing (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
IL299069A 2020-08-07 2021-08-06 3D structure or metrology inspection using deep learning IL299069B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202063062446P 2020-08-07 2020-08-07
US17/393,979 US11644756B2 (en) 2020-08-07 2021-08-04 3D structure inspection or metrology using deep learning
PCT/US2021/044859 WO2022032046A1 (en) 2020-08-07 2021-08-06 3d structure inspection or metrology using deep learning

Publications (3)

Publication Number Publication Date
IL299069A IL299069A (en) 2023-02-01
IL299069B1 IL299069B1 (en) 2024-04-01
IL299069B2 true IL299069B2 (en) 2024-08-01

Family

ID=80114982

Family Applications (1)

Application Number Title Priority Date Filing Date
IL299069A IL299069B2 (en) 2020-08-07 2021-08-06 3D structure or metrology inspection using deep learning

Country Status (8)

Country Link
US (1) US11644756B2 (https=)
EP (1) EP4153939A4 (https=)
JP (1) JP7598393B2 (https=)
KR (1) KR102685758B1 (https=)
CN (1) CN115917246A (https=)
IL (1) IL299069B2 (https=)
TW (1) TWI865814B (https=)
WO (1) WO2022032046A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12057336B2 (en) * 2020-12-16 2024-08-06 Samsung Electronics Co., Ltd. Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network
TWI820815B (zh) * 2022-07-22 2023-11-01 合晶科技股份有限公司 平坦度缺陷特徵檢測方法
IL299017B2 (en) * 2022-12-12 2024-09-01 Applied Materials Israel Ltd Automatic segmentation of an image of a semiconductor specimen and usage in metrology
CN115791835B (zh) * 2023-01-10 2025-01-24 上海语荻光电科技有限公司 一种图像采集系统及全息显示用微透镜阵列的微弱缺陷检测方法
US12511731B2 (en) * 2023-05-09 2025-12-30 Orbotech Ltd. System and method for three-dimensional imaging of samples using a machine learning algorithm
CN117601433A (zh) * 2023-11-21 2024-02-27 湖南华曙高科技股份有限公司 零件平整度预测模型训练方法及零件平整度预测方法
CN117824505B (zh) * 2024-03-05 2024-05-07 四川京炜交通工程技术有限公司 一种公路护栏梁板中心离地高度快速检测装置
US20250363615A1 (en) * 2024-05-27 2025-11-27 Kla Corporation Image reconstruction via manifold learning
WO2026033368A1 (en) * 2024-08-08 2026-02-12 Orbotech Ltd Ai 3d-reconstruction from single camera and multiple illumination angles

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG48813A1 (en) * 1993-08-12 1998-05-18 Cytotherapeutics Inc Improved composition and methods for the delivery of biologically active molecules using genetically altered cells contained in biocompatible immunoisolatory capsules
JP4382315B2 (ja) * 2001-09-28 2009-12-09 株式会社日立ハイテクノロジーズ ウェーハバンプの外観検査方法及びウェーハバンプの外観検査装置
US7126699B1 (en) 2002-10-18 2006-10-24 Kla-Tencor Technologies Corp. Systems and methods for multi-dimensional metrology and/or inspection of a specimen
JP2006135129A (ja) * 2004-11-08 2006-05-25 Seiko Epson Corp 半導体検査装置及び半導体装置の製造方法
US8041103B2 (en) 2005-11-18 2011-10-18 Kla-Tencor Technologies Corp. Methods and systems for determining a position of inspection data in design data space
US7676077B2 (en) 2005-11-18 2010-03-09 Kla-Tencor Technologies Corp. Methods and systems for utilizing design data in combination with inspection data
US8698093B1 (en) 2007-01-19 2014-04-15 Kla-Tencor Corporation Objective lens with deflector plates immersed in electrostatic lens field
US7782452B2 (en) 2007-08-31 2010-08-24 Kla-Tencor Technologies Corp. Systems and method for simultaneously inspecting a specimen with two distinct channels
US8126255B2 (en) 2007-09-20 2012-02-28 Kla-Tencor Corp. Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions
US8237213B2 (en) 2010-07-15 2012-08-07 Micron Technology, Inc. Memory arrays having substantially vertical, adjacent semiconductor structures and the formation thereof
KR20120064581A (ko) * 2010-12-09 2012-06-19 한국전자통신연구원 영상 분류 방법 및 이를 위한 장치
US8664594B1 (en) 2011-04-18 2014-03-04 Kla-Tencor Corporation Electron-optical system for high-speed and high-sensitivity inspections
US8692204B2 (en) 2011-04-26 2014-04-08 Kla-Tencor Corporation Apparatus and methods for electron beam detection
NL2009168A (en) * 2011-08-19 2013-02-21 Asml Netherlands Bv Lithographic apparatus and method.
US8716662B1 (en) 2012-07-16 2014-05-06 Kla-Tencor Corporation Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations
JP2014115245A (ja) * 2012-12-12 2014-06-26 Tokyo Electron Ltd 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体
US9222895B2 (en) 2013-02-25 2015-12-29 Kla-Tencor Corp. Generalized virtual inspector
GB2526866A (en) 2014-06-05 2015-12-09 Univ Bristol Apparatus for and method of inspecting surface topography of a moving object
US10127653B2 (en) 2014-07-22 2018-11-13 Kla-Tencor Corp. Determining coordinates for an area of interest on a specimen
US9830421B2 (en) 2014-12-31 2017-11-28 Kla-Tencor Corp. Alignment of inspection to design using built in targets
US10495446B2 (en) * 2015-06-29 2019-12-03 Kla-Tencor Corporation Methods and apparatus for measuring height on a semiconductor wafer
JP2018091807A (ja) * 2016-12-07 2018-06-14 オルボテック リミテッド 欠陥良否判定方法及び装置
US10473454B1 (en) * 2017-01-06 2019-11-12 Kla-Tencor Corporation Imaging-based height measurement based on known geometric information
CN106846463B (zh) * 2017-01-13 2020-02-18 清华大学 基于深度学习神经网络的显微图像三维重建方法及系统
US10733744B2 (en) 2017-05-11 2020-08-04 Kla-Tencor Corp. Learning based approach for aligning images acquired with different modalities
US20190130188A1 (en) 2017-10-26 2019-05-02 Qualcomm Incorporated Object classification in a video analytics system
JP7052377B2 (ja) * 2018-01-29 2022-04-12 セイコーエプソン株式会社 検査装置及び検査方法
CN110945528B (zh) * 2018-02-07 2021-04-02 应用材料以色列公司 产生可用于检查半导体样品的训练集的方法及其系统
US11222415B2 (en) * 2018-04-26 2022-01-11 The Regents Of The University Of California Systems and methods for deep learning microscopy
JP7438150B2 (ja) 2018-06-29 2024-02-26 デルタレイ・ベーフェー 反復投影マッチング法を用いた放射線イメージングによる物品検査
TW202020577A (zh) * 2018-09-28 2020-06-01 荷蘭商Ａｓｍｌ荷蘭公司 基於晶圓量測判定熱點排序
US12561823B2 (en) * 2019-02-15 2026-02-24 Hitachi High-Tech Corporation Structure estimation system and structure estimation program for estimating height of structure based on data from charged particle beam device
CN109887018A (zh) * 2019-02-28 2019-06-14 中国计量大学 一种基于深度学习的光子3d成像系统
CN110443882B (zh) * 2019-07-05 2021-06-11 清华大学 基于深度学习算法的光场显微三维重建方法及装置
CN110554046A (zh) * 2019-09-05 2019-12-10 西安多维机器视觉检测技术有限公司 一种用于电子元器件引脚的检测系统和方法
US11580650B2 (en) 2019-10-01 2023-02-14 KLA Corp. Multi-imaging mode image alignment
CN110779937B (zh) * 2019-10-11 2023-02-03 上海航天精密机械研究所 一种铸件产品内部缺陷智能检测装置
CN111047681B (zh) * 2019-11-07 2022-03-22 北京理工大学 基于深度学习的单像素三维端到端重建方法及装置
KR102228957B1 (ko) 2019-12-30 2021-03-17 주식회사 고영테크놀러지 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체
CN111260720A (zh) * 2020-01-13 2020-06-09 浙江大学 一种基于深度学习方法的目标高度测定系统
KR102837524B1 (ko) * 2020-02-03 2025-07-22 나노트로닉스 이미징, 인코포레이티드 딥 포토메트릭 러닝(dpl) 시스템, 장치 및 방법

Also Published As

Publication number Publication date
JP7598393B2 (ja) 2024-12-11
KR20230046279A (ko) 2023-04-05
JP2023536564A (ja) 2023-08-28
IL299069B1 (en) 2024-04-01
US11644756B2 (en) 2023-05-09
WO2022032046A1 (en) 2022-02-10
CN115917246A (zh) 2023-04-04
EP4153939A1 (en) 2023-03-29
EP4153939A4 (en) 2024-07-17
TWI865814B (zh) 2024-12-11
TW202225677A (zh) 2022-07-01
IL299069A (en) 2023-02-01
US20220043357A1 (en) 2022-02-10
KR102685758B1 (ko) 2024-07-17

Similar Documents

Publication Publication Date Title
IL299069B1 (en) 3D structure or metrology inspection using deep learning
CN109900713B (zh) 摄像引导的无人机风电叶片缺陷动态检测系统及其方法
CN117274573B (zh) 基于二维图像和三维点云的飞机表面孔洞定位测量方法
JP2016106228A5 (https=)
CN111079518B (zh) 一种基于执法办案区场景下的倒地异常行为识别方法
US11080892B2 (en) Computer-implemented methods and system for localizing an object
CN103854283A (zh) 一种基于在线学习的移动增强现实跟踪注册方法
CN113393577B (zh) 一种倾斜摄影地形重建方法
JP2023536564A5 (https=)
Zeng et al. Distilling focal knowledge from imperfect expert for 3d object detection
CN119850720B (zh) 一种视频监控摄像机预置位确定方法
CN114399500B (zh) 一种高鲁棒性大罐工装卸料孔视觉识别及位姿检测方法
CN120279327B (zh) 一种基于图像分割识别的废旧锂电池分类处理方法及系统
CN116843756A (zh) 一种基于计算机视觉的望远镜位姿监测方法
CN108320310B (zh) 基于图像序列的空间目标三维姿态估计方法
CN113628170A (zh) 一种基于深度学习的激光线提取方法及系统
CN116563262A (zh) 基于多模态的建筑裂缝检测算法
CN119477770A (zh) 基于三维高斯泼溅的正射影像生成方法、装置及存储介质
CN117974895B (zh) 一种管道单目视频三维重建和深度预测方法及系统
CN113670268B (zh) 基于双目视觉的无人机和电力杆塔距离测量方法
CN110349133A (zh) 物体表面缺陷检测方法、装置
CN114283081B (zh) 基于金字塔加速的深度恢复方法、电子设备及存储介质
Xu et al. Adaptive remote sensing image attribute learning for active object detection
Hu et al. Attention mechanism based CNC milling cutter wear detection using machine vision
CN115526908A (zh) 一种高速运动滤棒爆珠检测与定位方法