JP2023536564A5 - - Google Patents
Info
- Publication number
- JP2023536564A5 JP2023536564A5 JP2022578865A JP2022578865A JP2023536564A5 JP 2023536564 A5 JP2023536564 A5 JP 2023536564A5 JP 2022578865 A JP2022578865 A JP 2022578865A JP 2022578865 A JP2022578865 A JP 2022578865A JP 2023536564 A5 JP2023536564 A5 JP 2023536564A5
- Authority
- JP
- Japan
- Prior art keywords
- dimensional structures
- sample
- learning model
- deep learning
- computer systems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063062446P | 2020-08-07 | 2020-08-07 | |
| US63/062,446 | 2020-08-07 | ||
| US17/393,979 | 2021-08-04 | ||
| US17/393,979 US11644756B2 (en) | 2020-08-07 | 2021-08-04 | 3D structure inspection or metrology using deep learning |
| PCT/US2021/044859 WO2022032046A1 (en) | 2020-08-07 | 2021-08-06 | 3d structure inspection or metrology using deep learning |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023536564A JP2023536564A (ja) | 2023-08-28 |
| JP2023536564A5 true JP2023536564A5 (https=) | 2024-06-25 |
| JP7598393B2 JP7598393B2 (ja) | 2024-12-11 |
Family
ID=80114982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022578865A Active JP7598393B2 (ja) | 2020-08-07 | 2021-08-06 | 深層学習を用いた三次元構造の検査または計測 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11644756B2 (https=) |
| EP (1) | EP4153939A4 (https=) |
| JP (1) | JP7598393B2 (https=) |
| KR (1) | KR102685758B1 (https=) |
| CN (1) | CN115917246A (https=) |
| IL (1) | IL299069B2 (https=) |
| TW (1) | TWI865814B (https=) |
| WO (1) | WO2022032046A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12057336B2 (en) * | 2020-12-16 | 2024-08-06 | Samsung Electronics Co., Ltd. | Estimating heights of defects in a wafer by scaling a 3D model using an artificial neural network |
| TWI820815B (zh) * | 2022-07-22 | 2023-11-01 | 合晶科技股份有限公司 | 平坦度缺陷特徵檢測方法 |
| IL299017B2 (en) * | 2022-12-12 | 2024-09-01 | Applied Materials Israel Ltd | Automatic segmentation of an image of a semiconductor specimen and usage in metrology |
| CN115791835B (zh) * | 2023-01-10 | 2025-01-24 | 上海语荻光电科技有限公司 | 一种图像采集系统及全息显示用微透镜阵列的微弱缺陷检测方法 |
| US12511731B2 (en) * | 2023-05-09 | 2025-12-30 | Orbotech Ltd. | System and method for three-dimensional imaging of samples using a machine learning algorithm |
| CN117601433A (zh) * | 2023-11-21 | 2024-02-27 | 湖南华曙高科技股份有限公司 | 零件平整度预测模型训练方法及零件平整度预测方法 |
| CN117824505B (zh) * | 2024-03-05 | 2024-05-07 | 四川京炜交通工程技术有限公司 | 一种公路护栏梁板中心离地高度快速检测装置 |
| US20250363615A1 (en) * | 2024-05-27 | 2025-11-27 | Kla Corporation | Image reconstruction via manifold learning |
| WO2026033368A1 (en) * | 2024-08-08 | 2026-02-12 | Orbotech Ltd | Ai 3d-reconstruction from single camera and multiple illumination angles |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG48813A1 (en) * | 1993-08-12 | 1998-05-18 | Cytotherapeutics Inc | Improved composition and methods for the delivery of biologically active molecules using genetically altered cells contained in biocompatible immunoisolatory capsules |
| JP4382315B2 (ja) * | 2001-09-28 | 2009-12-09 | 株式会社日立ハイテクノロジーズ | ウェーハバンプの外観検査方法及びウェーハバンプの外観検査装置 |
| US7126699B1 (en) | 2002-10-18 | 2006-10-24 | Kla-Tencor Technologies Corp. | Systems and methods for multi-dimensional metrology and/or inspection of a specimen |
| JP2006135129A (ja) * | 2004-11-08 | 2006-05-25 | Seiko Epson Corp | 半導体検査装置及び半導体装置の製造方法 |
| US8041103B2 (en) | 2005-11-18 | 2011-10-18 | Kla-Tencor Technologies Corp. | Methods and systems for determining a position of inspection data in design data space |
| US7676077B2 (en) | 2005-11-18 | 2010-03-09 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| US8698093B1 (en) | 2007-01-19 | 2014-04-15 | Kla-Tencor Corporation | Objective lens with deflector plates immersed in electrostatic lens field |
| US7782452B2 (en) | 2007-08-31 | 2010-08-24 | Kla-Tencor Technologies Corp. | Systems and method for simultaneously inspecting a specimen with two distinct channels |
| US8126255B2 (en) | 2007-09-20 | 2012-02-28 | Kla-Tencor Corp. | Systems and methods for creating persistent data for a wafer and for using persistent data for inspection-related functions |
| US8237213B2 (en) | 2010-07-15 | 2012-08-07 | Micron Technology, Inc. | Memory arrays having substantially vertical, adjacent semiconductor structures and the formation thereof |
| KR20120064581A (ko) * | 2010-12-09 | 2012-06-19 | 한국전자통신연구원 | 영상 분류 방법 및 이를 위한 장치 |
| US8664594B1 (en) | 2011-04-18 | 2014-03-04 | Kla-Tencor Corporation | Electron-optical system for high-speed and high-sensitivity inspections |
| US8692204B2 (en) | 2011-04-26 | 2014-04-08 | Kla-Tencor Corporation | Apparatus and methods for electron beam detection |
| NL2009168A (en) * | 2011-08-19 | 2013-02-21 | Asml Netherlands Bv | Lithographic apparatus and method. |
| US8716662B1 (en) | 2012-07-16 | 2014-05-06 | Kla-Tencor Corporation | Methods and apparatus to review defects using scanning electron microscope with multiple electron beam configurations |
| JP2014115245A (ja) * | 2012-12-12 | 2014-06-26 | Tokyo Electron Ltd | 基板の欠陥検査方法、基板の欠陥検査装置、プログラム及びコンピュータ記憶媒体 |
| US9222895B2 (en) | 2013-02-25 | 2015-12-29 | Kla-Tencor Corp. | Generalized virtual inspector |
| GB2526866A (en) | 2014-06-05 | 2015-12-09 | Univ Bristol | Apparatus for and method of inspecting surface topography of a moving object |
| US10127653B2 (en) | 2014-07-22 | 2018-11-13 | Kla-Tencor Corp. | Determining coordinates for an area of interest on a specimen |
| US9830421B2 (en) | 2014-12-31 | 2017-11-28 | Kla-Tencor Corp. | Alignment of inspection to design using built in targets |
| US10495446B2 (en) * | 2015-06-29 | 2019-12-03 | Kla-Tencor Corporation | Methods and apparatus for measuring height on a semiconductor wafer |
| JP2018091807A (ja) * | 2016-12-07 | 2018-06-14 | オルボテック リミテッド | 欠陥良否判定方法及び装置 |
| US10473454B1 (en) * | 2017-01-06 | 2019-11-12 | Kla-Tencor Corporation | Imaging-based height measurement based on known geometric information |
| CN106846463B (zh) * | 2017-01-13 | 2020-02-18 | 清华大学 | 基于深度学习神经网络的显微图像三维重建方法及系统 |
| US10733744B2 (en) | 2017-05-11 | 2020-08-04 | Kla-Tencor Corp. | Learning based approach for aligning images acquired with different modalities |
| US20190130188A1 (en) | 2017-10-26 | 2019-05-02 | Qualcomm Incorporated | Object classification in a video analytics system |
| JP7052377B2 (ja) * | 2018-01-29 | 2022-04-12 | セイコーエプソン株式会社 | 検査装置及び検査方法 |
| CN110945528B (zh) * | 2018-02-07 | 2021-04-02 | 应用材料以色列公司 | 产生可用于检查半导体样品的训练集的方法及其系统 |
| US11222415B2 (en) * | 2018-04-26 | 2022-01-11 | The Regents Of The University Of California | Systems and methods for deep learning microscopy |
| JP7438150B2 (ja) | 2018-06-29 | 2024-02-26 | デルタレイ・ベーフェー | 反復投影マッチング法を用いた放射線イメージングによる物品検査 |
| TW202020577A (zh) * | 2018-09-28 | 2020-06-01 | 荷蘭商Asml荷蘭公司 | 基於晶圓量測判定熱點排序 |
| US12561823B2 (en) * | 2019-02-15 | 2026-02-24 | Hitachi High-Tech Corporation | Structure estimation system and structure estimation program for estimating height of structure based on data from charged particle beam device |
| CN109887018A (zh) * | 2019-02-28 | 2019-06-14 | 中国计量大学 | 一种基于深度学习的光子3d成像系统 |
| CN110443882B (zh) * | 2019-07-05 | 2021-06-11 | 清华大学 | 基于深度学习算法的光场显微三维重建方法及装置 |
| CN110554046A (zh) * | 2019-09-05 | 2019-12-10 | 西安多维机器视觉检测技术有限公司 | 一种用于电子元器件引脚的检测系统和方法 |
| US11580650B2 (en) | 2019-10-01 | 2023-02-14 | KLA Corp. | Multi-imaging mode image alignment |
| CN110779937B (zh) * | 2019-10-11 | 2023-02-03 | 上海航天精密机械研究所 | 一种铸件产品内部缺陷智能检测装置 |
| CN111047681B (zh) * | 2019-11-07 | 2022-03-22 | 北京理工大学 | 基于深度学习的单像素三维端到端重建方法及装置 |
| KR102228957B1 (ko) | 2019-12-30 | 2021-03-17 | 주식회사 고영테크놀러지 | 인쇄 회로 기판 검사 장치, 스크린 프린터의 결함 유형 결정 방법 및 컴퓨터 판독 가능한 기록 매체 |
| CN111260720A (zh) * | 2020-01-13 | 2020-06-09 | 浙江大学 | 一种基于深度学习方法的目标高度测定系统 |
| KR102837524B1 (ko) * | 2020-02-03 | 2025-07-22 | 나노트로닉스 이미징, 인코포레이티드 | 딥 포토메트릭 러닝(dpl) 시스템, 장치 및 방법 |
-
2021
- 2021-08-04 US US17/393,979 patent/US11644756B2/en active Active
- 2021-08-06 EP EP21852542.6A patent/EP4153939A4/en active Pending
- 2021-08-06 CN CN202180045618.8A patent/CN115917246A/zh active Pending
- 2021-08-06 JP JP2022578865A patent/JP7598393B2/ja active Active
- 2021-08-06 TW TW110129043A patent/TWI865814B/zh active
- 2021-08-06 IL IL299069A patent/IL299069B2/en unknown
- 2021-08-06 WO PCT/US2021/044859 patent/WO2022032046A1/en not_active Ceased
- 2021-08-06 KR KR1020227045445A patent/KR102685758B1/ko active Active
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