JP7577382B2 - 気化器および気化供給装置 - Google Patents

気化器および気化供給装置 Download PDF

Info

Publication number
JP7577382B2
JP7577382B2 JP2023505206A JP2023505206A JP7577382B2 JP 7577382 B2 JP7577382 B2 JP 7577382B2 JP 2023505206 A JP2023505206 A JP 2023505206A JP 2023505206 A JP2023505206 A JP 2023505206A JP 7577382 B2 JP7577382 B2 JP 7577382B2
Authority
JP
Japan
Prior art keywords
vaporization chamber
ultrapure water
heater
pressure
vaporizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023505206A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022190711A1 (https=
Inventor
伊知郎 徳田
瑞貴 中川
圭志 平尾
幸男 皆見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikin Inc
Original Assignee
Fujikin Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikin Inc filed Critical Fujikin Inc
Publication of JPWO2022190711A1 publication Critical patent/JPWO2022190711A1/ja
Application granted granted Critical
Publication of JP7577382B2 publication Critical patent/JP7577382B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/02—Treatment of water, waste water, or sewage by heating
    • C02F1/04—Treatment of water, waste water, or sewage by heating by distillation or evaporation
    • C02F1/045—Treatment of water, waste water, or sewage by heating by distillation or evaporation for obtaining ultra-pure water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B1/00—Methods of steam generation characterised by form of heating method
    • F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B37/00—Component parts or details of steam boilers
    • F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
    • F22B37/42—Applications, arrangements or dispositions of alarm or automatic safety devices
    • F22B37/44—Applications, arrangements or dispositions of alarm or automatic safety devices of safety valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/003—Feed-water heater systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/36—Water and air preheating systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D5/00—Controlling water feed or water level; Automatic water feeding or water-level regulators
    • F22D5/26—Automatic feed-control systems
    • F22D5/30—Automatic feed-control systems responsive to both water level and amount of steam withdrawn or steam pressure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02—Non-contaminated water, e.g. for industrial water supply
    • C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/03—Pressure
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/38—Gas flow rate
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/42—Liquid level

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Chemical & Material Sciences (AREA)
  • Hydrology & Water Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
JP2023505206A 2021-03-11 2022-02-01 気化器および気化供給装置 Active JP7577382B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021038960 2021-03-11
JP2021038960 2021-03-11
PCT/JP2022/003750 WO2022190711A1 (ja) 2021-03-11 2022-02-01 気化器および気化供給装置

Publications (2)

Publication Number Publication Date
JPWO2022190711A1 JPWO2022190711A1 (https=) 2022-09-15
JP7577382B2 true JP7577382B2 (ja) 2024-11-05

Family

ID=83226673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505206A Active JP7577382B2 (ja) 2021-03-11 2022-02-01 気化器および気化供給装置

Country Status (5)

Country Link
US (1) US20240101446A1 (https=)
JP (1) JP7577382B2 (https=)
KR (1) KR102776034B1 (https=)
TW (1) TWI800264B (https=)
WO (1) WO2022190711A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025019830A (ja) * 2023-07-28 2025-02-07 東京エレクトロン株式会社 気化装置、水蒸気処理システムおよび水蒸気処理方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308070A (ja) 2000-04-24 2001-11-02 Matsushita Electric Ind Co Ltd ドライエッチング装置およびそれを用いた半導体基板の処理方法
JP2002110611A (ja) 2000-10-04 2002-04-12 Texas Instr Japan Ltd 半導体ウェハの洗浄方法及び装置
JP2004063715A (ja) 2002-07-29 2004-02-26 Hitachi Kokusai Electric Inc 半導体装置の製造方法および基板処理装置
WO2018070464A1 (ja) 2016-10-14 2018-04-19 株式会社フジキン 流体制御装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312612U (https=) * 1976-07-15 1978-02-02
JPH0242697U (https=) * 1988-09-14 1990-03-23
US6814897B2 (en) * 1998-03-27 2004-11-09 Discovision Associates Method for manufacturing a molding tool used for substrate molding
JP3661757B2 (ja) 1999-09-30 2005-06-22 横河電機株式会社 気化器
KR20050113549A (ko) * 2002-05-29 2005-12-02 가부시키가이샤 와타나베 쇼코 기화기 및 이를 사용한 각종 장치 그리고 기화방법
US6977047B2 (en) * 2003-09-15 2005-12-20 Mechanical Equipment Company, Inc. Method and system for the manufacture of pharmaceutical water
US20080073559A1 (en) * 2003-12-12 2008-03-27 Horsky Thomas N Controlling the flow of vapors sublimated from solids
JP4324619B2 (ja) * 2007-03-29 2009-09-02 東京エレクトロン株式会社 気化装置、成膜装置及び気化方法
TWI413149B (zh) * 2008-01-22 2013-10-21 山米奎普公司 離子源氣體反應器及用於將氣體饋給材料轉化成不同分子或原子物種之方法
US8460509B2 (en) * 2008-02-11 2013-06-11 Total Water Management, LLC Water evaporation system and method
JP6372998B2 (ja) 2013-12-05 2018-08-15 株式会社フジキン 圧力式流量制御装置
JP6578125B2 (ja) * 2015-04-30 2019-09-18 株式会社フジキン 気化供給装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001308070A (ja) 2000-04-24 2001-11-02 Matsushita Electric Ind Co Ltd ドライエッチング装置およびそれを用いた半導体基板の処理方法
JP2002110611A (ja) 2000-10-04 2002-04-12 Texas Instr Japan Ltd 半導体ウェハの洗浄方法及び装置
JP2004063715A (ja) 2002-07-29 2004-02-26 Hitachi Kokusai Electric Inc 半導体装置の製造方法および基板処理装置
WO2018070464A1 (ja) 2016-10-14 2018-04-19 株式会社フジキン 流体制御装置

Also Published As

Publication number Publication date
KR102776034B1 (ko) 2025-03-07
TW202244307A (zh) 2022-11-16
JPWO2022190711A1 (https=) 2022-09-15
KR20230069985A (ko) 2023-05-19
WO2022190711A1 (ja) 2022-09-15
US20240101446A1 (en) 2024-03-28
TWI800264B (zh) 2023-04-21

Similar Documents

Publication Publication Date Title
JP6094513B2 (ja) 処理ガス発生装置、処理ガス発生方法、基板処理方法及び記憶媒体
JP3828821B2 (ja) 液体材料気化供給装置
CN101430044B (zh) 一种液化气气化方法、气化装置和一种使用该气化方法和装置的液化气供应装置
JP7577382B2 (ja) 気化器および気化供給装置
KR20060047881A (ko) 액화 가스 운반용 선박의 에너지 생성 유닛에 가스 연료를공급하는 설비
TWI796376B (zh) 氣化系統和氣化系統用程式
KR102050789B1 (ko) 액화가스의 재기화 장치 및 방법
JP7577339B2 (ja) 気化供給装置
JP2017198439A (ja) 蒸気供給装置および蒸気供給方法
TWI896767B (zh) 氣化裝置、氣體供給裝置及氣體供給裝置之控制方法
JP7811165B2 (ja) 気化装置、気化装置の制御方法、気化装置用プログラム、及び、流体制御装置
CN117916864A (zh) 气化器
JP4284591B2 (ja) Ｌｐｇの熱交換器
KR102371901B1 (ko) 액체 재료 기화 장치, 액체 재료 기화 시스템
JP2004301186A (ja) 液化ガス気化システム
JP2025038806A (ja) 気化システム
JP2001263592A (ja) Ｌｎｇ気化方法および装置
JP2004309039A (ja) 一体型液化ガス気化装置
WO2001066999A1 (en) Liquefied gas evaporator
JP7011516B2 (ja) 液化天然ガス気化システム
JP2003277012A (ja) 水素生成器への原料供給装置及び方法
JP2005172317A (ja) 給湯器
JP7762595B2 (ja) 給湯システム
JP2021169847A (ja) ガス供給装置
KR20070006460A (ko) 가스 공급 라인

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230329

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240515

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240620

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240925

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20241016

R150 Certificate of patent or registration of utility model

Ref document number: 7577382

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150