JPWO2022190711A1 - - Google Patents
Info
- Publication number
- JPWO2022190711A1 JPWO2022190711A1 JP2023505206A JP2023505206A JPWO2022190711A1 JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1 JP 2023505206 A JP2023505206 A JP 2023505206A JP 2023505206 A JP2023505206 A JP 2023505206A JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/02—Treatment of water, waste water, or sewage by heating
- C02F1/04—Treatment of water, waste water, or sewage by heating by distillation or evaporation
- C02F1/045—Treatment of water, waste water, or sewage by heating by distillation or evaporation for obtaining ultra-pure water
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B37/00—Component parts or details of steam boilers
- F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
- F22B37/42—Applications, arrangements or dispositions of alarm or automatic safety devices
- F22B37/44—Applications, arrangements or dispositions of alarm or automatic safety devices of safety valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
- F22D1/003—Feed-water heater systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
- F22D1/36—Water and air preheating systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D5/00—Controlling water feed or water level; Automatic water feeding or water-level regulators
- F22D5/26—Automatic feed-control systems
- F22D5/30—Automatic feed-control systems responsive to both water level and amount of steam withdrawn or steam pressure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/03—Pressure
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/38—Gas flow rate
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/42—Liquid level
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Chemical & Material Sciences (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Drying Of Semiconductors (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021038960 | 2021-03-11 | ||
| JP2021038960 | 2021-03-11 | ||
| PCT/JP2022/003750 WO2022190711A1 (ja) | 2021-03-11 | 2022-02-01 | 気化器および気化供給装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022190711A1 true JPWO2022190711A1 (https=) | 2022-09-15 |
| JP7577382B2 JP7577382B2 (ja) | 2024-11-05 |
Family
ID=83226673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023505206A Active JP7577382B2 (ja) | 2021-03-11 | 2022-02-01 | 気化器および気化供給装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240101446A1 (https=) |
| JP (1) | JP7577382B2 (https=) |
| KR (1) | KR102776034B1 (https=) |
| TW (1) | TWI800264B (https=) |
| WO (1) | WO2022190711A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025019830A (ja) * | 2023-07-28 | 2025-02-07 | 東京エレクトロン株式会社 | 気化装置、水蒸気処理システムおよび水蒸気処理方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312612U (https=) * | 1976-07-15 | 1978-02-02 | ||
| JPH0242697U (https=) * | 1988-09-14 | 1990-03-23 | ||
| JP2001308070A (ja) * | 2000-04-24 | 2001-11-02 | Matsushita Electric Ind Co Ltd | ドライエッチング装置およびそれを用いた半導体基板の処理方法 |
| JP2002110611A (ja) * | 2000-10-04 | 2002-04-12 | Texas Instr Japan Ltd | 半導体ウェハの洗浄方法及び装置 |
| JP2004063715A (ja) * | 2002-07-29 | 2004-02-26 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
| WO2018070464A1 (ja) * | 2016-10-14 | 2018-04-19 | 株式会社フジキン | 流体制御装置 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6814897B2 (en) * | 1998-03-27 | 2004-11-09 | Discovision Associates | Method for manufacturing a molding tool used for substrate molding |
| JP3661757B2 (ja) | 1999-09-30 | 2005-06-22 | 横河電機株式会社 | 気化器 |
| KR20050113549A (ko) * | 2002-05-29 | 2005-12-02 | 가부시키가이샤 와타나베 쇼코 | 기화기 및 이를 사용한 각종 장치 그리고 기화방법 |
| US6977047B2 (en) * | 2003-09-15 | 2005-12-20 | Mechanical Equipment Company, Inc. | Method and system for the manufacture of pharmaceutical water |
| US20080073559A1 (en) * | 2003-12-12 | 2008-03-27 | Horsky Thomas N | Controlling the flow of vapors sublimated from solids |
| JP4324619B2 (ja) * | 2007-03-29 | 2009-09-02 | 東京エレクトロン株式会社 | 気化装置、成膜装置及び気化方法 |
| TWI413149B (zh) * | 2008-01-22 | 2013-10-21 | 山米奎普公司 | 離子源氣體反應器及用於將氣體饋給材料轉化成不同分子或原子物種之方法 |
| US8460509B2 (en) * | 2008-02-11 | 2013-06-11 | Total Water Management, LLC | Water evaporation system and method |
| JP6372998B2 (ja) | 2013-12-05 | 2018-08-15 | 株式会社フジキン | 圧力式流量制御装置 |
| JP6578125B2 (ja) * | 2015-04-30 | 2019-09-18 | 株式会社フジキン | 気化供給装置 |
-
2022
- 2022-02-01 US US18/264,501 patent/US20240101446A1/en active Pending
- 2022-02-01 KR KR1020237012789A patent/KR102776034B1/ko active Active
- 2022-02-01 WO PCT/JP2022/003750 patent/WO2022190711A1/ja not_active Ceased
- 2022-02-01 JP JP2023505206A patent/JP7577382B2/ja active Active
- 2022-02-16 TW TW111105579A patent/TWI800264B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5312612U (https=) * | 1976-07-15 | 1978-02-02 | ||
| JPH0242697U (https=) * | 1988-09-14 | 1990-03-23 | ||
| JP2001308070A (ja) * | 2000-04-24 | 2001-11-02 | Matsushita Electric Ind Co Ltd | ドライエッチング装置およびそれを用いた半導体基板の処理方法 |
| JP2002110611A (ja) * | 2000-10-04 | 2002-04-12 | Texas Instr Japan Ltd | 半導体ウェハの洗浄方法及び装置 |
| JP2004063715A (ja) * | 2002-07-29 | 2004-02-26 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
| WO2018070464A1 (ja) * | 2016-10-14 | 2018-04-19 | 株式会社フジキン | 流体制御装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102776034B1 (ko) | 2025-03-07 |
| TW202244307A (zh) | 2022-11-16 |
| JP7577382B2 (ja) | 2024-11-05 |
| KR20230069985A (ko) | 2023-05-19 |
| WO2022190711A1 (ja) | 2022-09-15 |
| US20240101446A1 (en) | 2024-03-28 |
| TWI800264B (zh) | 2023-04-21 |
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