JPWO2022190711A1 - - Google Patents

Info

Publication number
JPWO2022190711A1
JPWO2022190711A1 JP2023505206A JP2023505206A JPWO2022190711A1 JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1 JP 2023505206 A JP2023505206 A JP 2023505206A JP 2023505206 A JP2023505206 A JP 2023505206A JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023505206A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022190711A1 publication Critical patent/JPWO2022190711A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00Treatment of water, waste water, or sewage
    • C02F1/02Treatment of water, waste water, or sewage by heating
    • C02F1/04Treatment of water, waste water, or sewage by heating by distillation or evaporation
    • C02F1/045Treatment of water, waste water, or sewage by heating by distillation or evaporation for obtaining ultra-pure water
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22BMETHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B1/00Methods of steam generation characterised by form of heating method
    • F22B1/28Methods of steam generation characterised by form of heating method in boilers heated electrically
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22BMETHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B37/00Component parts or details of steam boilers
    • F22B37/02Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
    • F22B37/42Applications, arrangements, or dispositions of alarm or automatic safety devices
    • F22B37/44Applications, arrangements, or dispositions of alarm or automatic safety devices of safety valves
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22DPREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/003Feed-water heater systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22DPREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/36Water and air preheating systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22STEAM GENERATION
    • F22DPREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D5/00Controlling water feed or water level; Automatic water feeding or water-level regulators
    • F22D5/26Automatic feed-control systems
    • F22D5/30Automatic feed-control systems responsive to both water level and amount of steam withdrawn or steam pressure
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065Plasma etching; Reactive-ion etching
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02Non-contaminated water, e.g. for industrial water supply
    • C02F2103/04Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/03Pressure
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/38Gas flow rate
    • CCHEMISTRY; METALLURGY
    • C02TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02FTREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00Controlling or monitoring parameters in water treatment
    • C02F2209/42Liquid level

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Sustainable Energy (AREA)
  • Sustainable Development (AREA)
  • Hydrology & Water Resources (AREA)
  • Environmental & Geological Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Filling Or Discharging Of Gas Storage Vessels (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
JP2023505206A 2021-03-11 2022-02-01 Pending JPWO2022190711A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021038960 2021-03-11
PCT/JP2022/003750 WO2022190711A1 (ja) 2021-03-11 2022-02-01 気化器および気化供給装置

Publications (1)

Publication Number Publication Date
JPWO2022190711A1 true JPWO2022190711A1 (ja) 2022-09-15

Family

ID=83226673

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023505206A Pending JPWO2022190711A1 (ja) 2021-03-11 2022-02-01

Country Status (5)

Country Link
US (1) US20240101446A1 (ja)
JP (1) JPWO2022190711A1 (ja)
KR (1) KR20230069985A (ja)
TW (1) TWI800264B (ja)
WO (1) WO2022190711A1 (ja)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312612U (ja) * 1976-07-15 1978-02-02
JPH0242697U (ja) * 1988-09-14 1990-03-23
JP3661757B2 (ja) 1999-09-30 2005-06-22 横河電機株式会社 気化器
JP2001308070A (ja) 2000-04-24 2001-11-02 Matsushita Electric Ind Co Ltd ドライエッチング装置およびそれを用いた半導体基板の処理方法
JP2002110611A (ja) * 2000-10-04 2002-04-12 Texas Instr Japan Ltd 半導体ウェハの洗浄方法及び装置
AU2003241915A1 (en) * 2002-05-29 2003-12-12 Kabushiki Kaisha Watanabe Shoko Vaporizer, various apparatuses including the same and method of vaporization
JP2004063715A (ja) 2002-07-29 2004-02-26 Hitachi Kokusai Electric Inc 半導体装置の製造方法および基板処理装置
JP4324619B2 (ja) * 2007-03-29 2009-09-02 東京エレクトロン株式会社 気化装置、成膜装置及び気化方法
JP6372998B2 (ja) 2013-12-05 2018-08-15 株式会社フジキン 圧力式流量制御装置
JP6578125B2 (ja) * 2015-04-30 2019-09-18 株式会社フジキン 気化供給装置
CN109791415A (zh) * 2016-10-14 2019-05-21 株式会社富士金 流体控制装置

Also Published As

Publication number Publication date
TWI800264B (zh) 2023-04-21
WO2022190711A1 (ja) 2022-09-15
US20240101446A1 (en) 2024-03-28
KR20230069985A (ko) 2023-05-19
TW202244307A (zh) 2022-11-16

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