JPWO2022190711A1 - - Google Patents
Info
- Publication number
- JPWO2022190711A1 JPWO2022190711A1 JP2023505206A JP2023505206A JPWO2022190711A1 JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1 JP 2023505206 A JP2023505206 A JP 2023505206A JP 2023505206 A JP2023505206 A JP 2023505206A JP WO2022190711 A1 JPWO2022190711 A1 JP WO2022190711A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/02—Treatment of water, waste water, or sewage by heating
- C02F1/04—Treatment of water, waste water, or sewage by heating by distillation or evaporation
- C02F1/045—Treatment of water, waste water, or sewage by heating by distillation or evaporation for obtaining ultra-pure water
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B1/00—Methods of steam generation characterised by form of heating method
- F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
- F22B37/00—Component parts or details of steam boilers
- F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
- F22B37/42—Applications, arrangements, or dispositions of alarm or automatic safety devices
- F22B37/44—Applications, arrangements, or dispositions of alarm or automatic safety devices of safety valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
- F22D1/003—Feed-water heater systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
- F22D1/36—Water and air preheating systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F22—STEAM GENERATION
- F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
- F22D5/00—Controlling water feed or water level; Automatic water feeding or water-level regulators
- F22D5/26—Automatic feed-control systems
- F22D5/30—Automatic feed-control systems responsive to both water level and amount of steam withdrawn or steam pressure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/02—Non-contaminated water, e.g. for industrial water supply
- C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/03—Pressure
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/38—Gas flow rate
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/42—Liquid level
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Hydrology & Water Resources (AREA)
- Environmental & Geological Engineering (AREA)
- Water Supply & Treatment (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Plasma & Fusion (AREA)
- Filling Or Discharging Of Gas Storage Vessels (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021038960 | 2021-03-11 | ||
PCT/JP2022/003750 WO2022190711A1 (ja) | 2021-03-11 | 2022-02-01 | 気化器および気化供給装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022190711A1 true JPWO2022190711A1 (ja) | 2022-09-15 |
Family
ID=83226673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023505206A Pending JPWO2022190711A1 (ja) | 2021-03-11 | 2022-02-01 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20240101446A1 (ja) |
JP (1) | JPWO2022190711A1 (ja) |
KR (1) | KR20230069985A (ja) |
TW (1) | TWI800264B (ja) |
WO (1) | WO2022190711A1 (ja) |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5312612U (ja) * | 1976-07-15 | 1978-02-02 | ||
JPH0242697U (ja) * | 1988-09-14 | 1990-03-23 | ||
JP3661757B2 (ja) | 1999-09-30 | 2005-06-22 | 横河電機株式会社 | 気化器 |
JP2001308070A (ja) | 2000-04-24 | 2001-11-02 | Matsushita Electric Ind Co Ltd | ドライエッチング装置およびそれを用いた半導体基板の処理方法 |
JP2002110611A (ja) * | 2000-10-04 | 2002-04-12 | Texas Instr Japan Ltd | 半導体ウェハの洗浄方法及び装置 |
AU2003241915A1 (en) * | 2002-05-29 | 2003-12-12 | Kabushiki Kaisha Watanabe Shoko | Vaporizer, various apparatuses including the same and method of vaporization |
JP2004063715A (ja) | 2002-07-29 | 2004-02-26 | Hitachi Kokusai Electric Inc | 半導体装置の製造方法および基板処理装置 |
JP4324619B2 (ja) * | 2007-03-29 | 2009-09-02 | 東京エレクトロン株式会社 | 気化装置、成膜装置及び気化方法 |
JP6372998B2 (ja) | 2013-12-05 | 2018-08-15 | 株式会社フジキン | 圧力式流量制御装置 |
JP6578125B2 (ja) * | 2015-04-30 | 2019-09-18 | 株式会社フジキン | 気化供給装置 |
CN109791415A (zh) * | 2016-10-14 | 2019-05-21 | 株式会社富士金 | 流体控制装置 |
-
2022
- 2022-02-01 JP JP2023505206A patent/JPWO2022190711A1/ja active Pending
- 2022-02-01 US US18/264,501 patent/US20240101446A1/en active Pending
- 2022-02-01 KR KR1020237012789A patent/KR20230069985A/ko unknown
- 2022-02-01 WO PCT/JP2022/003750 patent/WO2022190711A1/ja active Application Filing
- 2022-02-16 TW TW111105579A patent/TWI800264B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI800264B (zh) | 2023-04-21 |
WO2022190711A1 (ja) | 2022-09-15 |
US20240101446A1 (en) | 2024-03-28 |
KR20230069985A (ko) | 2023-05-19 |
TW202244307A (zh) | 2022-11-16 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230329 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20240515 |