TWI800264B - 汽化器及汽化供給裝置 - Google Patents

汽化器及汽化供給裝置 Download PDF

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Publication number
TWI800264B
TWI800264B TW111105579A TW111105579A TWI800264B TW I800264 B TWI800264 B TW I800264B TW 111105579 A TW111105579 A TW 111105579A TW 111105579 A TW111105579 A TW 111105579A TW I800264 B TWI800264 B TW I800264B
Authority
TW
Taiwan
Prior art keywords
vaporizer
supply device
vaporization supply
vaporization
supply
Prior art date
Application number
TW111105579A
Other languages
English (en)
Other versions
TW202244307A (zh
Inventor
徳田伊知郎
中川瑞貴
平尾圭志
皆見幸男
Original Assignee
日商富士金股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士金股份有限公司 filed Critical 日商富士金股份有限公司
Publication of TW202244307A publication Critical patent/TW202244307A/zh
Application granted granted Critical
Publication of TWI800264B publication Critical patent/TWI800264B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F1/00—Treatment of water, waste water, or sewage
    • C02F1/02—Treatment of water, waste water, or sewage by heating
    • C02F1/04—Treatment of water, waste water, or sewage by heating by distillation or evaporation
    • C02F1/045—Treatment of water, waste water, or sewage by heating by distillation or evaporation for obtaining ultra-pure water
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B1/00—Methods of steam generation characterised by form of heating method
    • F22B1/28—Methods of steam generation characterised by form of heating method in boilers heated electrically
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22B—METHODS OF STEAM GENERATION; STEAM BOILERS
    • F22B37/00—Component parts or details of steam boilers
    • F22B37/02—Component parts or details of steam boilers applicable to more than one kind or type of steam boiler
    • F22B37/42—Applications, arrangements, or dispositions of alarm or automatic safety devices
    • F22B37/44—Applications, arrangements, or dispositions of alarm or automatic safety devices of safety valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/003—Feed-water heater systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D1/00—Feed-water heaters, i.e. economisers or like preheaters
    • F22D1/36—Water and air preheating systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F22—STEAM GENERATION
    • F22D—PREHEATING, OR ACCUMULATING PREHEATED, FEED-WATER FOR STEAM GENERATION; FEED-WATER SUPPLY FOR STEAM GENERATION; CONTROLLING WATER LEVEL FOR STEAM GENERATION; AUXILIARY DEVICES FOR PROMOTING WATER CIRCULATION WITHIN STEAM BOILERS
    • F22D5/00—Controlling water feed or water level; Automatic water feeding or water-level regulators
    • F22D5/26—Automatic feed-control systems
    • F22D5/30—Automatic feed-control systems responsive to both water level and amount of steam withdrawn or steam pressure
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
    • C02F2103/02—Non-contaminated water, e.g. for industrial water supply
    • C02F2103/04—Non-contaminated water, e.g. for industrial water supply for obtaining ultra-pure water
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/03—Pressure
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/38—Gas flow rate
    • C—CHEMISTRY; METALLURGY
    • C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
    • C02F2209/00—Controlling or monitoring parameters in water treatment
    • C02F2209/42—Liquid level
TW111105579A 2021-03-11 2022-02-16 汽化器及汽化供給裝置 TWI800264B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021038960 2021-03-11
JP2021-038960 2021-03-11

Publications (2)

Publication Number Publication Date
TW202244307A TW202244307A (zh) 2022-11-16
TWI800264B true TWI800264B (zh) 2023-04-21

Family

ID=83226673

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111105579A TWI800264B (zh) 2021-03-11 2022-02-16 汽化器及汽化供給裝置

Country Status (5)

Country Link
US (1) US20240101446A1 (zh)
JP (1) JPWO2022190711A1 (zh)
KR (1) KR20230069985A (zh)
TW (1) TWI800264B (zh)
WO (1) WO2022190711A1 (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200401841A (en) * 2002-05-29 2004-02-01 Watanabe M & Co Ltd Vaporizer, various apparatus including the same and method of vaporization
CN101285178A (zh) * 2007-03-29 2008-10-15 东京毅力科创株式会社 汽化器和半导体处理系统
CN107532298A (zh) * 2015-04-30 2018-01-02 株式会社富士金 气化供给装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5312612U (zh) * 1976-07-15 1978-02-02
JPH0242697U (zh) * 1988-09-14 1990-03-23
JP3661757B2 (ja) 1999-09-30 2005-06-22 横河電機株式会社 気化器
JP2001308070A (ja) * 2000-04-24 2001-11-02 Matsushita Electric Ind Co Ltd ドライエッチング装置およびそれを用いた半導体基板の処理方法
JP2002110611A (ja) 2000-10-04 2002-04-12 Texas Instr Japan Ltd 半導体ウェハの洗浄方法及び装置
JP2004063715A (ja) * 2002-07-29 2004-02-26 Hitachi Kokusai Electric Inc 半導体装置の製造方法および基板処理装置
JP6372998B2 (ja) 2013-12-05 2018-08-15 株式会社フジキン 圧力式流量制御装置
WO2018070464A1 (ja) * 2016-10-14 2018-04-19 株式会社フジキン 流体制御装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200401841A (en) * 2002-05-29 2004-02-01 Watanabe M & Co Ltd Vaporizer, various apparatus including the same and method of vaporization
CN101285178A (zh) * 2007-03-29 2008-10-15 东京毅力科创株式会社 汽化器和半导体处理系统
CN107532298A (zh) * 2015-04-30 2018-01-02 株式会社富士金 气化供给装置

Also Published As

Publication number Publication date
KR20230069985A (ko) 2023-05-19
US20240101446A1 (en) 2024-03-28
WO2022190711A1 (ja) 2022-09-15
JPWO2022190711A1 (zh) 2022-09-15
TW202244307A (zh) 2022-11-16

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