JP7560345B2 - ダイシングテープ - Google Patents

ダイシングテープ Download PDF

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Publication number
JP7560345B2
JP7560345B2 JP2020208544A JP2020208544A JP7560345B2 JP 7560345 B2 JP7560345 B2 JP 7560345B2 JP 2020208544 A JP2020208544 A JP 2020208544A JP 2020208544 A JP2020208544 A JP 2020208544A JP 7560345 B2 JP7560345 B2 JP 7560345B2
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JP
Japan
Prior art keywords
resin
die bond
film
adhesive layer
mass
Prior art date
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Active
Application number
JP2020208544A
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English (en)
Japanese (ja)
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JP2022095302A5 (enrdf_load_stackoverflow
JP2022095302A (ja
Inventor
俊之 角田
慧 古川
浩和 佐藤
理恵 田中
晃良 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Maxell Ltd
Original Assignee
Maxell Ltd
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Publication date
Application filed by Maxell Ltd filed Critical Maxell Ltd
Priority to JP2020208544A priority Critical patent/JP7560345B2/ja
Priority to CN202111526569.8A priority patent/CN114634768A/zh
Priority to TW110146695A priority patent/TWI888683B/zh
Priority to KR1020210179328A priority patent/KR20220086506A/ko
Publication of JP2022095302A publication Critical patent/JP2022095302A/ja
Publication of JP2022095302A5 publication Critical patent/JP2022095302A5/ja
Application granted granted Critical
Publication of JP7560345B2 publication Critical patent/JP7560345B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C08L23/0876—Salts thereof, i.e. ionomers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241—Polyolefin, e.g.rubber
    • C09J7/243—Ethylene or propylene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C09J2423/04—Presence of homo or copolymers of ethene
    • C09J2423/046—Presence of homo or copolymers of ethene in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2477/00—Presence of polyamide
    • C09J2477/006—Presence of polyamide in the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
JP2020208544A 2020-12-16 2020-12-16 ダイシングテープ Active JP7560345B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ
CN202111526569.8A CN114634768A (zh) 2020-12-16 2021-12-13 切割胶带和切割芯片接合膜
TW110146695A TWI888683B (zh) 2020-12-16 2021-12-14 晶圓切割膠帶
KR1020210179328A KR20220086506A (ko) 2020-12-16 2021-12-15 다이싱 테이프 및 다이싱 다이 본드 필름

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020208544A JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Publications (3)

Publication Number Publication Date
JP2022095302A JP2022095302A (ja) 2022-06-28
JP2022095302A5 JP2022095302A5 (enrdf_load_stackoverflow) 2023-03-07
JP7560345B2 true JP7560345B2 (ja) 2024-10-02

Family

ID=81945987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020208544A Active JP7560345B2 (ja) 2020-12-16 2020-12-16 ダイシングテープ

Country Status (3)

Country Link
JP (1) JP7560345B2 (enrdf_load_stackoverflow)
KR (1) KR20220086506A (enrdf_load_stackoverflow)
CN (1) CN114634768A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023188714A1 (enrdf_load_stackoverflow) * 2022-03-31 2023-10-05

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070119584A (ko) * 2007-08-27 2007-12-20 광 석 서 반도체 웨이퍼용 대전방지 다이싱 테이프
JP7105120B2 (ja) 2017-07-04 2022-07-22 日東電工株式会社 ダイシングテープ、ダイシングダイボンドフィルム、および半導体装置製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160040043A1 (en) 2013-12-19 2016-02-11 Lg Chem, Ltd. Composition for forming adhesive layer of dicing film, and dicing film
JP2017098369A (ja) 2015-11-20 2017-06-01 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
JP2018056282A (ja) 2016-09-28 2018-04-05 リンテック株式会社 保護膜付き半導体チップの製造方法及び半導体装置の製造方法
JP2019016816A (ja) 2016-11-18 2019-01-31 古河電気工業株式会社 貼合体
WO2018123804A1 (ja) 2016-12-27 2018-07-05 三井・デュポンポリケミカル株式会社 ダイシングフィルム基材およびダイシングフィルム
JP2019009203A (ja) 2017-06-22 2019-01-17 日東電工株式会社 ダイシングダイボンドフィルム
JP2020053453A (ja) 2018-09-25 2020-04-02 古河電気工業株式会社 電子デバイスパッケージ用テープ
JP7440633B2 (ja) 2020-06-10 2024-02-28 三井化学東セロ株式会社 電子装置の製造方法

Also Published As

Publication number Publication date
CN114634768A (zh) 2022-06-17
TW202239850A (zh) 2022-10-16
JP2022095302A (ja) 2022-06-28
KR20220086506A (ko) 2022-06-23

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