JPWO2023188714A1 - - Google Patents

Info

Publication number
JPWO2023188714A1
JPWO2023188714A1 JP2024511281A JP2024511281A JPWO2023188714A1 JP WO2023188714 A1 JPWO2023188714 A1 JP WO2023188714A1 JP 2024511281 A JP2024511281 A JP 2024511281A JP 2024511281 A JP2024511281 A JP 2024511281A JP WO2023188714 A1 JPWO2023188714 A1 JP WO2023188714A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511281A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023188714A1 publication Critical patent/JPWO2023188714A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2024511281A 2022-03-31 2023-01-19 Pending JPWO2023188714A1 (enrdf_load_stackoverflow)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022060324 2022-03-31
PCT/JP2023/001444 WO2023188714A1 (ja) 2022-03-31 2023-01-19 粘着テープ及び加工方法

Publications (1)

Publication Number Publication Date
JPWO2023188714A1 true JPWO2023188714A1 (enrdf_load_stackoverflow) 2023-10-05

Family

ID=88200705

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511281A Pending JPWO2023188714A1 (enrdf_load_stackoverflow) 2022-03-31 2023-01-19

Country Status (3)

Country Link
JP (1) JPWO2023188714A1 (enrdf_load_stackoverflow)
TW (1) TW202346388A (enrdf_load_stackoverflow)
WO (1) WO2023188714A1 (enrdf_load_stackoverflow)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004300405A (ja) * 2003-03-20 2004-10-28 Toyo Ink Mfg Co Ltd 粘着剤組成物および粘着シート
JP2007053325A (ja) * 2005-07-20 2007-03-01 Furukawa Electric Co Ltd:The ダイシングダイボンドテープおよびダイシングテープ
CN101191041A (zh) * 2006-11-29 2008-06-04 上海康达化工有限公司 丙烯酸酯胶粘剂
JP2010129865A (ja) * 2008-11-28 2010-06-10 Furukawa Electric Co Ltd:The ダイシング用粘着テープ
JP2012136632A (ja) * 2010-12-27 2012-07-19 Furukawa Electric Co Ltd:The ウエハ貼着用粘着シート
KR20150059242A (ko) * 2013-11-22 2015-06-01 주식회사 엘지화학 점착제 조성물
JP2015109436A (ja) * 2013-10-23 2015-06-11 リンテック株式会社 ダイシングシート
WO2016056269A1 (ja) * 2014-01-23 2016-04-14 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7560345B2 (ja) * 2020-12-16 2024-10-02 マクセル株式会社 ダイシングテープ

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004300405A (ja) * 2003-03-20 2004-10-28 Toyo Ink Mfg Co Ltd 粘着剤組成物および粘着シート
JP2007053325A (ja) * 2005-07-20 2007-03-01 Furukawa Electric Co Ltd:The ダイシングダイボンドテープおよびダイシングテープ
CN101191041A (zh) * 2006-11-29 2008-06-04 上海康达化工有限公司 丙烯酸酯胶粘剂
JP2010129865A (ja) * 2008-11-28 2010-06-10 Furukawa Electric Co Ltd:The ダイシング用粘着テープ
JP2012136632A (ja) * 2010-12-27 2012-07-19 Furukawa Electric Co Ltd:The ウエハ貼着用粘着シート
JP2015109436A (ja) * 2013-10-23 2015-06-11 リンテック株式会社 ダイシングシート
KR20150059242A (ko) * 2013-11-22 2015-06-01 주식회사 엘지화학 점착제 조성물
WO2016056269A1 (ja) * 2014-01-23 2016-04-14 古河電気工業株式会社 半導体ウエハ表面保護用粘着テープおよび半導体ウエハの加工方法

Also Published As

Publication number Publication date
TW202346388A (zh) 2023-12-01
WO2023188714A1 (ja) 2023-10-05

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Effective date: 20240621

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