JP7557352B2 - 基板処理装置および基板処理方法 - Google Patents

基板処理装置および基板処理方法 Download PDF

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Publication number
JP7557352B2
JP7557352B2 JP2020197880A JP2020197880A JP7557352B2 JP 7557352 B2 JP7557352 B2 JP 7557352B2 JP 2020197880 A JP2020197880 A JP 2020197880A JP 2020197880 A JP2020197880 A JP 2020197880A JP 7557352 B2 JP7557352 B2 JP 7557352B2
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Japan
Prior art keywords
substrate
processing
support tray
container body
lid portion
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JP2020197880A
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English (en)
Japanese (ja)
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JP2022086069A5 (enExample
JP2022086069A (ja
Inventor
周武 墨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2020197880A priority Critical patent/JP7557352B2/ja
Priority to KR1020237017247A priority patent/KR102692696B1/ko
Priority to PCT/JP2021/043391 priority patent/WO2022114127A1/ja
Priority to CN202180079981.1A priority patent/CN116529862A/zh
Priority to TW110144510A priority patent/TWI804076B/zh
Publication of JP2022086069A publication Critical patent/JP2022086069A/ja
Publication of JP2022086069A5 publication Critical patent/JP2022086069A5/ja
Application granted granted Critical
Publication of JP7557352B2 publication Critical patent/JP7557352B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2020197880A 2020-11-30 2020-11-30 基板処理装置および基板処理方法 Active JP7557352B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法
KR1020237017247A KR102692696B1 (ko) 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법
PCT/JP2021/043391 WO2022114127A1 (ja) 2020-11-30 2021-11-26 基板処理装置および基板処理方法
CN202180079981.1A CN116529862A (zh) 2020-11-30 2021-11-26 基板处理装置及基板处理方法
TW110144510A TWI804076B (zh) 2020-11-30 2021-11-30 基板處理裝置及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法

Publications (3)

Publication Number Publication Date
JP2022086069A JP2022086069A (ja) 2022-06-09
JP2022086069A5 JP2022086069A5 (enExample) 2023-05-30
JP7557352B2 true JP7557352B2 (ja) 2024-09-27

Family

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Family Applications (1)

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JP2020197880A Active JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法

Country Status (5)

Country Link
JP (1) JP7557352B2 (enExample)
KR (1) KR102692696B1 (enExample)
CN (1) CN116529862A (enExample)
TW (1) TWI804076B (enExample)
WO (1) WO2022114127A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017157746A (ja) 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2018530919A (ja) 2015-10-04 2018-10-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 容積が縮小された処理チャンバ
JP2020170873A (ja) 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) * 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018530919A (ja) 2015-10-04 2018-10-18 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 容積が縮小された処理チャンバ
JP2017157746A (ja) 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP2020170873A (ja) 2016-11-04 2020-10-15 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体

Also Published As

Publication number Publication date
WO2022114127A1 (ja) 2022-06-02
KR20230085211A (ko) 2023-06-13
TWI804076B (zh) 2023-06-01
KR102692696B1 (ko) 2024-08-07
JP2022086069A (ja) 2022-06-09
CN116529862A (zh) 2023-08-01
TW202236479A (zh) 2022-09-16

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