KR102692696B1 - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법 Download PDF

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Publication number
KR102692696B1
KR102692696B1 KR1020237017247A KR20237017247A KR102692696B1 KR 102692696 B1 KR102692696 B1 KR 102692696B1 KR 1020237017247 A KR1020237017247 A KR 1020237017247A KR 20237017247 A KR20237017247 A KR 20237017247A KR 102692696 B1 KR102692696 B1 KR 102692696B1
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South Korea
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processing
substrate
support tray
container body
processing space
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Korean (ko)
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KR20230085211A (ko
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노리타케 스미
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가부시키가이샤 스크린 홀딩스
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020237017247A 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법 Active KR102692696B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2020-197880 2020-11-30
JP2020197880A JP7557352B2 (ja) 2020-11-30 2020-11-30 基板処理装置および基板処理方法
PCT/JP2021/043391 WO2022114127A1 (ja) 2020-11-30 2021-11-26 基板処理装置および基板処理方法

Publications (2)

Publication Number Publication Date
KR20230085211A KR20230085211A (ko) 2023-06-13
KR102692696B1 true KR102692696B1 (ko) 2024-08-07

Family

ID=81755637

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237017247A Active KR102692696B1 (ko) 2020-11-30 2021-11-26 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
JP (1) JP7557352B2 (enExample)
KR (1) KR102692696B1 (enExample)
CN (1) CN116529862A (enExample)
TW (1) TWI804076B (enExample)
WO (1) WO2022114127A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020127513A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機
JP2020127512A (ja) * 2019-02-07 2020-08-27 京楽産業．株式会社 遊技機

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6015738B2 (ja) 2014-11-25 2016-10-26 東京エレクトロン株式会社 処理装置、処理方法及び記憶媒体
KR102055712B1 (ko) * 2015-10-04 2019-12-13 어플라이드 머티어리얼스, 인코포레이티드 감소된 용적의 처리 챔버
JP2017157746A (ja) * 2016-03-03 2017-09-07 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
JP6922048B2 (ja) * 2016-11-04 2021-08-18 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記録媒体
JP2018082043A (ja) * 2016-11-16 2018-05-24 東京エレクトロン株式会社 基板処理装置
US10872789B2 (en) * 2017-09-28 2020-12-22 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer cooling system
JP6906416B2 (ja) * 2017-09-29 2021-07-21 東京エレクトロン株式会社 基板処理装置
JP7038524B2 (ja) * 2017-11-14 2022-03-18 東京エレクトロン株式会社 基板処理装置の洗浄装置および洗浄方法
JP7308688B2 (ja) * 2019-08-05 2023-07-14 東京エレクトロン株式会社 基板処理装置および基板乾燥方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5471740B2 (ja) 2010-04-08 2014-04-16 東京エレクトロン株式会社 基板処理装置

Also Published As

Publication number Publication date
TW202236479A (zh) 2022-09-16
KR20230085211A (ko) 2023-06-13
JP2022086069A (ja) 2022-06-09
WO2022114127A1 (ja) 2022-06-02
TWI804076B (zh) 2023-06-01
CN116529862A (zh) 2023-08-01
JP7557352B2 (ja) 2024-09-27

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