JP7547199B2 - 低い熱抵抗率を有する電気絶縁性サーマルコネクタ - Google Patents

低い熱抵抗率を有する電気絶縁性サーマルコネクタ Download PDF

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Publication number
JP7547199B2
JP7547199B2 JP2020516542A JP2020516542A JP7547199B2 JP 7547199 B2 JP7547199 B2 JP 7547199B2 JP 2020516542 A JP2020516542 A JP 2020516542A JP 2020516542 A JP2020516542 A JP 2020516542A JP 7547199 B2 JP7547199 B2 JP 7547199B2
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Prior art keywords
thermal connector
terminal
thermal
bar
connector
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JP2020516542A
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Japanese (ja)
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JP2020534697A (ja
Inventor
ダージン，スコット・ビー
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Kyocera AVX Components Corp
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Kyocera AVX Components Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2020516542A 2017-09-21 2018-09-19 低い熱抵抗率を有する電気絶縁性サーマルコネクタ Active JP7547199B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024065083A JP2024081802A (ja) 2017-09-21 2024-04-15 低い熱抵抗率を有する電気絶縁性サーマルコネクタ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762561408P 2017-09-21 2017-09-21
US62/561,408 2017-09-21
PCT/US2018/051725 WO2019060402A1 (en) 2017-09-21 2018-09-19 ELECTRICALLY INSULATING THERMAL CONNECTOR HAVING LOW THERMAL RESISTIVITY

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024065083A Division JP2024081802A (ja) 2017-09-21 2024-04-15 低い熱抵抗率を有する電気絶縁性サーマルコネクタ

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JP2020534697A JP2020534697A (ja) 2020-11-26
JP7547199B2 true JP7547199B2 (ja) 2024-09-09

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JP2020516542A Active JP7547199B2 (ja) 2017-09-21 2018-09-19 低い熱抵抗率を有する電気絶縁性サーマルコネクタ
JP2024065083A Pending JP2024081802A (ja) 2017-09-21 2024-04-15 低い熱抵抗率を有する電気絶縁性サーマルコネクタ

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US (2) US10660238B2 (enExample)
EP (2) EP3685643B1 (enExample)
JP (2) JP7547199B2 (enExample)
CN (1) CN111108818B (enExample)
WO (1) WO2019060402A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht
CN117461395A (zh) * 2021-06-28 2024-01-26 京瓷Avx元器件公司 可嵌入的电绝缘热连接器、以及包括其的电路板
US12177960B2 (en) 2021-09-09 2024-12-24 KYOCERA AVX Components Corporation High frequency and high power thin film component
US20230076503A1 (en) * 2021-09-09 2023-03-09 KYOCERA AVX Components Corporation Electronically Insulating Thermal Connector having a Low Thermal Resistivity
WO2024189135A1 (en) * 2023-03-14 2024-09-19 Lotus Microsystems Aps A thermal conductor component

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JP2007150186A (ja) 2005-11-30 2007-06-14 Tdk Corp 薄膜電子部品用電極、薄膜電子部品及びその製造方法
JP2008270325A (ja) 2007-04-17 2008-11-06 Matsushita Electric Ind Co Ltd 静電気対策部品およびこれを用いた発光ダイオードモジュール
JP2012239116A (ja) 2011-05-13 2012-12-06 Tdk Corp アンテナ装置及びこれを用いた無線通信機器
JP2013222950A (ja) 2012-04-19 2013-10-28 Fuji Electric Co Ltd パワー半導体モジュール
JP2014220294A (ja) 2013-05-02 2014-11-20 シチズン電子株式会社 Ｌｅｄパッケージ
JP2016076573A (ja) 2014-10-06 2016-05-12 トヨタ自動車株式会社 フィルムコンデンサ
JP2017143227A (ja) 2016-02-12 2017-08-17 株式会社村田製作所 半導体集積回路素子の放熱構造、ならびに、半導体集積回路素子及びその製造方法

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JP2000261271A (ja) 1999-03-04 2000-09-22 Murata Mfg Co Ltd 積層型ローパスフィルタ
JP2007150186A (ja) 2005-11-30 2007-06-14 Tdk Corp 薄膜電子部品用電極、薄膜電子部品及びその製造方法
JP2008270325A (ja) 2007-04-17 2008-11-06 Matsushita Electric Ind Co Ltd 静電気対策部品およびこれを用いた発光ダイオードモジュール
JP2012239116A (ja) 2011-05-13 2012-12-06 Tdk Corp アンテナ装置及びこれを用いた無線通信機器
JP2013222950A (ja) 2012-04-19 2013-10-28 Fuji Electric Co Ltd パワー半導体モジュール
JP2014220294A (ja) 2013-05-02 2014-11-20 シチズン電子株式会社 Ｌｅｄパッケージ
JP2016076573A (ja) 2014-10-06 2016-05-12 トヨタ自動車株式会社 フィルムコンデンサ
JP2017143227A (ja) 2016-02-12 2017-08-17 株式会社村田製作所 半導体集積回路素子の放熱構造、ならびに、半導体集積回路素子及びその製造方法

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Publication number Publication date
WO2019060402A4 (en) 2019-05-16
US20190090381A1 (en) 2019-03-21
WO2019060402A1 (en) 2019-03-28
CN111108818A (zh) 2020-05-05
JP2020534697A (ja) 2020-11-26
EP4567877A3 (en) 2025-09-03
US11116109B2 (en) 2021-09-07
EP4567877A2 (en) 2025-06-11
JP2024081802A (ja) 2024-06-18
CN111108818B (zh) 2022-06-28
EP3685643B1 (en) 2025-07-23
EP3685643A1 (en) 2020-07-29
US20200260610A1 (en) 2020-08-13
EP3685643A4 (en) 2021-06-30
US10660238B2 (en) 2020-05-19

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