JP7544447B2 - アンテナモジュールおよび通信デバイス - Google Patents
アンテナモジュールおよび通信デバイス Download PDFInfo
- Publication number
- JP7544447B2 JP7544447B2 JP2020545640A JP2020545640A JP7544447B2 JP 7544447 B2 JP7544447 B2 JP 7544447B2 JP 2020545640 A JP2020545640 A JP 2020545640A JP 2020545640 A JP2020545640 A JP 2020545640A JP 7544447 B2 JP7544447 B2 JP 7544447B2
- Authority
- JP
- Japan
- Prior art keywords
- antenna
- communication device
- antenna patches
- array
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/08—Means for collapsing antennas or parts thereof
- H01Q1/085—Flexible aerials; Whip aerials with a resilient base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/01—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the shape of the antenna or antenna system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q11/00—Electrically-long antennas having dimensions more than twice the shortest operating wavelength and consisting of conductive active radiating elements
- H01Q11/12—Resonant antennas
- H01Q11/14—Resonant antennas with parts bent, folded, shaped or screened or with phasing impedances, to obtain desired phase relation of radiation from selected sections of the antenna or to obtain desired polarisation effect
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Waveguide Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Details Of Aerials (AREA)
- Support Of Aerials (AREA)
- Transceivers (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024139346A JP7772304B2 (ja) | 2018-06-05 | 2024-08-20 | アンテナモジュールおよび通信デバイス |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/000,795 | 2018-06-05 | ||
| US16/000,795 US10797394B2 (en) | 2018-06-05 | 2018-06-05 | Antenna modules and communication devices |
| PCT/US2019/030838 WO2019236230A1 (en) | 2018-06-05 | 2019-05-06 | Antenna modules and communication devices |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024139346A Division JP7772304B2 (ja) | 2018-06-05 | 2024-08-20 | アンテナモジュールおよび通信デバイス |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021526321A JP2021526321A (ja) | 2021-09-30 |
| JPWO2019236230A5 JPWO2019236230A5 (https=) | 2022-04-06 |
| JP2021526321A5 JP2021526321A5 (https=) | 2022-04-06 |
| JP7544447B2 true JP7544447B2 (ja) | 2024-09-03 |
Family
ID=68695302
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020545640A Active JP7544447B2 (ja) | 2018-06-05 | 2019-05-06 | アンテナモジュールおよび通信デバイス |
| JP2024139346A Active JP7772304B2 (ja) | 2018-06-05 | 2024-08-20 | アンテナモジュールおよび通信デバイス |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024139346A Active JP7772304B2 (ja) | 2018-06-05 | 2024-08-20 | アンテナモジュールおよび通信デバイス |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US10797394B2 (https=) |
| EP (1) | EP3804032A4 (https=) |
| JP (2) | JP7544447B2 (https=) |
| KR (1) | KR102344153B1 (https=) |
| CN (1) | CN111886755A (https=) |
| SG (1) | SG11202009749TA (https=) |
| TW (1) | TWI797316B (https=) |
| WO (1) | WO2019236230A1 (https=) |
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| KR102468136B1 (ko) | 2018-04-23 | 2022-11-18 | 삼성전자 주식회사 | 안테나 장치 및 이를 포함하는 전자 장치 |
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| US11509037B2 (en) | 2018-05-29 | 2022-11-22 | Intel Corporation | Integrated circuit packages, antenna modules, and communication devices |
| US10797394B2 (en) | 2018-06-05 | 2020-10-06 | Intel Corporation | Antenna modules and communication devices |
| EP3588673B1 (en) * | 2018-06-29 | 2024-04-03 | Advanced Automotive Antennas, S.L. | Under-roof antenna modules for vehicles |
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| JP7047918B2 (ja) * | 2018-08-06 | 2022-04-05 | 株式会社村田製作所 | アンテナモジュール |
| KR102526400B1 (ko) * | 2018-09-06 | 2023-04-28 | 삼성전자주식회사 | 5g 안테나 모듈을 포함하는 전자 장치 |
| JP2020065246A (ja) * | 2018-10-16 | 2020-04-23 | 株式会社村田製作所 | 通信装置 |
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| US11258165B2 (en) * | 2018-12-31 | 2022-02-22 | Qualcomm Incorporated | Asymmetric antenna structure |
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| KR20220034547A (ko) * | 2020-09-11 | 2022-03-18 | 삼성전기주식회사 | 안테나 장치 및 이를 포함하는 전자 장치 |
| KR102930613B1 (ko) * | 2020-09-29 | 2026-02-24 | 동우 화인켐 주식회사 | 안테나 패키지 및 이를 포함하는 화상 표시 장치 |
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| CN113809514B (zh) * | 2021-11-16 | 2022-02-15 | 深圳市睿德通讯科技有限公司 | 天线设备及电子装置 |
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- 2019-05-06 CN CN201980021396.9A patent/CN111886755A/zh active Pending
- 2019-05-06 WO PCT/US2019/030838 patent/WO2019236230A1/en not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| US11664596B2 (en) | 2023-05-30 |
| TWI797316B (zh) | 2023-04-01 |
| US20190372229A1 (en) | 2019-12-05 |
| TW202005168A (zh) | 2020-01-16 |
| EP3804032A4 (en) | 2022-03-16 |
| JP2021526321A (ja) | 2021-09-30 |
| US20200403316A1 (en) | 2020-12-24 |
| US10797394B2 (en) | 2020-10-06 |
| US11121468B2 (en) | 2021-09-14 |
| JP2024170443A (ja) | 2024-12-10 |
| US20210344116A1 (en) | 2021-11-04 |
| WO2019236230A1 (en) | 2019-12-12 |
| SG11202009749TA (en) | 2020-10-29 |
| CN111886755A (zh) | 2020-11-03 |
| KR20200123150A (ko) | 2020-10-28 |
| KR102344153B1 (ko) | 2021-12-29 |
| EP3804032A1 (en) | 2021-04-14 |
| JP7772304B2 (ja) | 2025-11-18 |
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