JP2018032890A - 無線モジュール - Google Patents
無線モジュール Download PDFInfo
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- JP2018032890A JP2018032890A JP2016161614A JP2016161614A JP2018032890A JP 2018032890 A JP2018032890 A JP 2018032890A JP 2016161614 A JP2016161614 A JP 2016161614A JP 2016161614 A JP2016161614 A JP 2016161614A JP 2018032890 A JP2018032890 A JP 2018032890A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
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- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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- H—ELECTRICITY
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- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/526—Electromagnetic shields
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
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- H01Q21/00—Antenna arrays or systems
- H01Q21/28—Combinations of substantially independent non-interacting antenna units or systems
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- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
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- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
- H01Q9/045—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means
- H01Q9/0457—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with particular feeding means electromagnetically coupled to the feed line
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- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0485—Dielectric resonator antennas
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- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/06—Details
- H01Q9/065—Microstrip dipole antennas
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- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
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- H—ELECTRICITY
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- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
- H01Q9/40—Element having extended radiating surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
- H01R24/40—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency
- H01R24/50—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts specially adapted for high frequency mounted on a PCB [Printed Circuit Board]
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- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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Abstract
【解決手段】誘電体基板にグランドプレーンが設けられている。誘電体基板に高周波集積回路素子が実装されている。誘電体基板の上に、高周波集積回路素子を電磁気的にシールドするシールド部材が設けられている。誘電体基板に、グランドプレーンに対してシールド部材と同一の側に配置された第1のアンテナ素子が設けられている。第1のアンテナ素子と高周波集積回路素子とが第1の給電線で接続される。平面視において、第1のアンテナ素子の一部分がシールド部材の外側に配置され、残りの部分がシールド部材と重なっているか、または第1のアンテナ素子の全域がシールド部材の外側に配置されており、シールド部材からの離隔距離が第1のアンテナ素子の共振波長の1/2以下である。
【選択図】図1
Description
誘電体基板と、
前記誘電体基板に設けられたグランドプレーンと、
前記誘電体基板に実装された高周波集積回路素子と、
前記誘電体基板の上に設けられ、前記高周波集積回路素子を電磁気的にシールドするシールド部材と、
前記誘電体基板に設けられ、前記グランドプレーンに対して前記シールド部材と同一の側に配置された第1のアンテナ素子と、
前記第1のアンテナ素子と前記高周波集積回路素子とを接続する第1の給電線と
を有し、
平面視において、前記第1のアンテナ素子の一部分が前記シールド部材の外側に配置され、
残りの部分が前記シールド部材と重なっているか、または前記第1のアンテナ素子の全域が前記シールド部材の外側に配置されており、前記シールド部材からの離隔距離が前記第1のアンテナ素子の共振波長の1/2以下である。
さらに、前記誘電体基板に設けられ、前記グランドプレーンに対して前記シールド部材とは反対側に配置された第2のアンテナ素子と、
前記第2のアンテナ素子と前記高周波集積回路素子とを接続する第2の給電線と
を有する。
図1を参照して第1の実施例による無線モジュールについて説明する。
次に、図3を参照して第2の実施例による無線モジュールについて説明する。以下、図1に示した第1の実施例との相違点について説明し共通の構成については説明を省略する。
次に、図4を参照して第3の実施例による無線モジュールについて説明する。以下、図1に示した第1の実施例による無線モジュールとの相違点について説明し、共通の構成については説明を省略する。
次に、図5を参照して第4の実施例による無線モジュールについて説明する。以下、図1に示した第1の実施例による無線モジュールとの相違点について説明し、共通の構成については説明を省略する。
次に、図6を参照して第5の実施例による無線モジュールについて説明する。以下、図5に示した第4の実施例による無線モジュールとの相違点について説明し、共通の構成については説明を省略する。
11 グランドプレーン
12 信号用のランド
15 第2のアンテナ素子
16 第2の給電線
19 放射電極
21 高周波集積回路素子
22 受動部品
25 シールド部材
27 シールド膜
28 グランド接続ビア
30 封止部材
32 誘電体層
35 第1のアンテナ素子
35a、35b 縁
36 第1の給電線
37 金属棒
38 伝送線路
39 放射電極
39a、39b 縁
40 導体棒
41 短絡部材
Claims (6)
- 誘電体基板と、
前記誘電体基板に設けられたグランドプレーンと、
前記誘電体基板に実装された高周波集積回路素子と、
前記誘電体基板の上に設けられ、前記高周波集積回路素子を電磁気的にシールドするシールド部材と、
前記誘電体基板に設けられ、前記グランドプレーンに対して前記シールド部材と同一の側に配置された第1のアンテナ素子と、
前記第1のアンテナ素子と前記高周波集積回路素子とを接続する第1の給電線と
を有し、
平面視において、前記第1のアンテナ素子の一部分が前記シールド部材の外側に配置され、
残りの部分が前記シールド部材と重なっているか、または前記第1のアンテナ素子の全域が前記シールド部材の外側に配置されており、前記シールド部材からの離隔距離が前記第1のアンテナ素子の共振波長の1/2以下である無線モジュール。 - 前記シールド部材は前記グランドプレーンに接続されている請求項1に記載の無線モジュール。
- さらに、
前記誘電体基板に設けられ、前記グランドプレーンに対して前記シールド部材とは反対側に配置された第2のアンテナ素子と、
前記第2のアンテナ素子と前記高周波集積回路素子とを接続する第2の給電線と
を有する請求項1または2に記載の無線モジュール。 - 前記第1のアンテナ素子はパッチアンテナであり、平面視において前記パッチアンテナの一部分が前記シールド部材と重なっている請求項1乃至3のいずれか1項に記載の無線モジュール。
- 前記第1のアンテナ素子は、平面視において前記シールド部材からの離隔距離が前記第1のアンテナ素子の共振波長の1/2以下の位置に配置されたモノポールアンテナである請求項1乃至3のいずれか1項に記載の無線モジュール。
- 前記モノポールアンテナは先端において前記シールド部材に短絡されている請求項5に記載の無線モジュール。
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JP2016161614A JP6500859B2 (ja) | 2016-08-22 | 2016-08-22 | 無線モジュール |
US15/679,588 US20180053735A1 (en) | 2016-08-22 | 2017-08-17 | Wireless module |
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JP2016161614A JP6500859B2 (ja) | 2016-08-22 | 2016-08-22 | 無線モジュール |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2020009037A1 (ja) * | 2018-07-06 | 2021-06-24 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
JP2021526321A (ja) * | 2018-06-05 | 2021-09-30 | インテル・コーポレーション | アンテナモジュールおよび通信デバイス |
WO2022202623A1 (ja) * | 2021-03-26 | 2022-09-29 | 株式会社デンソー | アンテナ装置、通信装置 |
US11870132B2 (en) | 2018-03-29 | 2024-01-09 | Intel Corporation | Antenna modules and communication devices |
WO2024034303A1 (ja) * | 2022-08-10 | 2024-02-15 | 株式会社村田製作所 | 高周波モジュール、通信装置、及び高周波モジュールの製造方法 |
US12068525B2 (en) | 2018-05-29 | 2024-08-20 | Intel Corporation | Integrated circuit packages, antenna modules, and communication devices |
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TWI663701B (zh) * | 2017-04-28 | 2019-06-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
TWI668831B (zh) * | 2018-04-17 | 2019-08-11 | 矽品精密工業股份有限公司 | 電子裝置與電子封裝件 |
US11081453B2 (en) * | 2018-07-03 | 2021-08-03 | Mediatek Inc. | Semiconductor package structure with antenna |
TWI695472B (zh) * | 2018-11-07 | 2020-06-01 | 欣興電子股份有限公司 | 晶片封裝結構及其製造方法 |
US11177222B2 (en) * | 2019-07-29 | 2021-11-16 | Micron Technology, Inc. | Semiconductor packages and associated methods with antennas and EMI isolation shields |
US20220285286A1 (en) * | 2021-03-03 | 2022-09-08 | Qualcomm Technologies Inc. | Package comprising metal layer configured for electromagnetic interference shield and heat dissipation |
CN116053220A (zh) * | 2022-12-26 | 2023-05-02 | 青岛歌尔微电子研究院有限公司 | 一种无线系统级封装模组 |
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US11870132B2 (en) | 2018-03-29 | 2024-01-09 | Intel Corporation | Antenna modules and communication devices |
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JP7544447B2 (ja) | 2018-06-05 | 2024-09-03 | インテル・コーポレーション | アンテナモジュールおよび通信デバイス |
JPWO2020009037A1 (ja) * | 2018-07-06 | 2021-06-24 | 株式会社村田製作所 | アンテナモジュール及び通信装置 |
WO2022202623A1 (ja) * | 2021-03-26 | 2022-09-29 | 株式会社デンソー | アンテナ装置、通信装置 |
JP7530855B2 (ja) | 2021-03-26 | 2024-08-08 | 株式会社Soken | アンテナ装置、通信装置 |
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