JP7533036B2 - 回路構成体 - Google Patents

回路構成体 Download PDF

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Publication number
JP7533036B2
JP7533036B2 JP2020148266A JP2020148266A JP7533036B2 JP 7533036 B2 JP7533036 B2 JP 7533036B2 JP 2020148266 A JP2020148266 A JP 2020148266A JP 2020148266 A JP2020148266 A JP 2020148266A JP 7533036 B2 JP7533036 B2 JP 7533036B2
Authority
JP
Japan
Prior art keywords
power
bus bar
terminal
circuit section
conductive path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020148266A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022042712A5 (https=
JP2022042712A (ja
Inventor
秀夫 森岡
有延 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
AutoNetworks Technologies Ltd
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Wiring Systems Ltd, AutoNetworks Technologies Ltd, Sumitomo Electric Industries Ltd filed Critical Sumitomo Wiring Systems Ltd
Priority to JP2020148266A priority Critical patent/JP7533036B2/ja
Priority to PCT/JP2021/028691 priority patent/WO2022049963A1/ja
Priority to CN202180050249.1A priority patent/CN115956294A/zh
Priority to US18/043,672 priority patent/US12490383B2/en
Publication of JP2022042712A publication Critical patent/JP2022042712A/ja
Publication of JP2022042712A5 publication Critical patent/JP2022042712A5/ja
Priority to JP2024100395A priority patent/JP7722528B2/ja
Application granted granted Critical
Publication of JP7533036B2 publication Critical patent/JP7533036B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Conversion In General (AREA)
  • Connection Or Junction Boxes (AREA)
JP2020148266A 2020-09-03 2020-09-03 回路構成体 Active JP7533036B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020148266A JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体
PCT/JP2021/028691 WO2022049963A1 (ja) 2020-09-03 2021-08-03 回路構成体
CN202180050249.1A CN115956294A (zh) 2020-09-03 2021-08-03 电路结构体
US18/043,672 US12490383B2 (en) 2020-09-03 2021-08-03 Circuit assembly
JP2024100395A JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020148266A JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024100395A Division JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Publications (3)

Publication Number Publication Date
JP2022042712A JP2022042712A (ja) 2022-03-15
JP2022042712A5 JP2022042712A5 (https=) 2023-01-24
JP7533036B2 true JP7533036B2 (ja) 2024-08-14

Family

ID=80491118

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020148266A Active JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体
JP2024100395A Active JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024100395A Active JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Country Status (4)

Country Link
US (1) US12490383B2 (https=)
JP (2) JP7533036B2 (https=)
CN (1) CN115956294A (https=)
WO (1) WO2022049963A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010022117A (ja) 2008-07-09 2010-01-28 Autonetworks Technologies Ltd 回路構成体
WO2019131222A1 (ja) 2017-12-28 2019-07-04 株式会社オートネットワーク技術研究所 電気接続装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009046258B3 (de) * 2009-10-30 2011-07-07 Infineon Technologies AG, 85579 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls
JP2016220277A (ja) 2015-05-14 2016-12-22 矢崎総業株式会社 電気接続箱
CN106377236A (zh) * 2016-11-12 2017-02-08 深圳市易特科信息技术有限公司 带有十二导联心电监测仪的健康监测一体机
JP2019096769A (ja) 2017-11-24 2019-06-20 株式会社オートネットワーク技術研究所 回路構成体
JP2020013896A (ja) 2018-07-18 2020-01-23 株式会社オートネットワーク技術研究所 回路基板
US11183440B2 (en) * 2018-12-10 2021-11-23 Gan Systems Inc. Power modules for ultra-fast wide-bandgap power switching devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010022117A (ja) 2008-07-09 2010-01-28 Autonetworks Technologies Ltd 回路構成体
WO2019131222A1 (ja) 2017-12-28 2019-07-04 株式会社オートネットワーク技術研究所 電気接続装置

Also Published As

Publication number Publication date
US12490383B2 (en) 2025-12-02
JP2024111245A (ja) 2024-08-16
CN115956294A (zh) 2023-04-11
JP7722528B2 (ja) 2025-08-13
US20230354526A1 (en) 2023-11-02
JP2022042712A (ja) 2022-03-15
WO2022049963A1 (ja) 2022-03-10

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