JP2022042712A5 - - Google Patents

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Publication number
JP2022042712A5
JP2022042712A5 JP2020148266A JP2020148266A JP2022042712A5 JP 2022042712 A5 JP2022042712 A5 JP 2022042712A5 JP 2020148266 A JP2020148266 A JP 2020148266A JP 2020148266 A JP2020148266 A JP 2020148266A JP 2022042712 A5 JP2022042712 A5 JP 2022042712A5
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JP
Japan
Prior art keywords
semiconductor element
conductive
wiring member
flexible wiring
conductive path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020148266A
Other languages
English (en)
Japanese (ja)
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JP7533036B2 (ja
JP2022042712A (ja
Filing date
Publication date
Priority claimed from JP2020148266A external-priority patent/JP7533036B2/ja
Priority to JP2020148266A priority Critical patent/JP7533036B2/ja
Application filed filed Critical
Priority to PCT/JP2021/028691 priority patent/WO2022049963A1/ja
Priority to CN202180050249.1A priority patent/CN115956294A/zh
Priority to US18/043,672 priority patent/US12490383B2/en
Publication of JP2022042712A publication Critical patent/JP2022042712A/ja
Publication of JP2022042712A5 publication Critical patent/JP2022042712A5/ja
Priority to JP2024100395A priority patent/JP7722528B2/ja
Publication of JP7533036B2 publication Critical patent/JP7533036B2/ja
Application granted granted Critical
Active legal-status Critical Current
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JP2020148266A 2020-09-03 2020-09-03 回路構成体 Active JP7533036B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020148266A JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体
PCT/JP2021/028691 WO2022049963A1 (ja) 2020-09-03 2021-08-03 回路構成体
CN202180050249.1A CN115956294A (zh) 2020-09-03 2021-08-03 电路结构体
US18/043,672 US12490383B2 (en) 2020-09-03 2021-08-03 Circuit assembly
JP2024100395A JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020148266A JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024100395A Division JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Publications (3)

Publication Number Publication Date
JP2022042712A JP2022042712A (ja) 2022-03-15
JP2022042712A5 true JP2022042712A5 (https=) 2023-01-24
JP7533036B2 JP7533036B2 (ja) 2024-08-14

Family

ID=80491118

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020148266A Active JP7533036B2 (ja) 2020-09-03 2020-09-03 回路構成体
JP2024100395A Active JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024100395A Active JP7722528B2 (ja) 2020-09-03 2024-06-21 回路構成体

Country Status (4)

Country Link
US (1) US12490383B2 (https=)
JP (2) JP7533036B2 (https=)
CN (1) CN115956294A (https=)
WO (1) WO2022049963A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5222641B2 (ja) * 2008-07-09 2013-06-26 株式会社オートネットワーク技術研究所 回路構成体
DE102009046258B3 (de) * 2009-10-30 2011-07-07 Infineon Technologies AG, 85579 Leistungshalbleitermodul und Verfahren zum Betrieb eines Leistungshalbleitermoduls
JP2016220277A (ja) 2015-05-14 2016-12-22 矢崎総業株式会社 電気接続箱
CN106377236A (zh) * 2016-11-12 2017-02-08 深圳市易特科信息技术有限公司 带有十二导联心电监测仪的健康监测一体机
JP2019096769A (ja) 2017-11-24 2019-06-20 株式会社オートネットワーク技術研究所 回路構成体
JP6939542B2 (ja) * 2017-12-28 2021-09-22 株式会社オートネットワーク技術研究所 電気接続装置
JP2020013896A (ja) 2018-07-18 2020-01-23 株式会社オートネットワーク技術研究所 回路基板
US11183440B2 (en) * 2018-12-10 2021-11-23 Gan Systems Inc. Power modules for ultra-fast wide-bandgap power switching devices

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