JP7524187B2 - 温度センサを有するピンリフティング装置 - Google Patents

温度センサを有するピンリフティング装置 Download PDF

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Publication number
JP7524187B2
JP7524187B2 JP2021532844A JP2021532844A JP7524187B2 JP 7524187 B2 JP7524187 B2 JP 7524187B2 JP 2021532844 A JP2021532844 A JP 2021532844A JP 2021532844 A JP2021532844 A JP 2021532844A JP 7524187 B2 JP7524187 B2 JP 7524187B2
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Prior art keywords
lifting device
pin lifting
temperature sensor
temperature
measurement signal
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JP2021532844A
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Japanese (ja)
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JP2022512468A (ja
JP2022512468A5 (https=
Inventor
エッシェンモーザー，アドリアン
ドュア，ミハエル
ホーファー，アンドレアス
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VAT Holding AG
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VAT Holding AG
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Publication of JP2022512468A5 publication Critical patent/JP2022512468A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2021532844A 2018-12-11 2019-12-10 温度センサを有するピンリフティング装置 Active JP7524187B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102018009630.1 2018-12-11
DE102018009630.1A DE102018009630A1 (de) 2018-12-11 2018-12-11 Stifthubvorrichtung mit Temperatursensor
PCT/EP2019/084516 WO2020120510A1 (de) 2018-12-11 2019-12-10 Stifthubvorrichtung mit temperatursensor

Publications (3)

Publication Number Publication Date
JP2022512468A JP2022512468A (ja) 2022-02-04
JP2022512468A5 JP2022512468A5 (https=) 2022-10-21
JP7524187B2 true JP7524187B2 (ja) 2024-07-29

Family

ID=68848296

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JP2021532844A Active JP7524187B2 (ja) 2018-12-11 2019-12-10 温度センサを有するピンリフティング装置

Country Status (7)

Country Link
US (1) US12381108B2 (https=)
JP (1) JP7524187B2 (https=)
KR (1) KR102805233B1 (https=)
CN (1) CN112970101B (https=)
DE (1) DE102018009630A1 (https=)
TW (1) TWI837223B (https=)
WO (1) WO2020120510A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018009630A1 (de) * 2018-12-11 2020-06-18 Vat Holding Ag Stifthubvorrichtung mit Temperatursensor
CN113488370B (zh) * 2021-07-06 2024-05-31 北京屹唐半导体科技股份有限公司 用于等离子体处理设备的升降销组件
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
CN120291061B (zh) * 2025-06-09 2025-08-26 蓝河科技(绍兴)有限公司 气体分配装置和半导体设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2012521652A (ja) 2009-03-24 2012-09-13 ラム リサーチ コーポレーション デチャック時における電位スパイクを抑制する方法及び装置
US20170362712A1 (en) 2016-06-21 2017-12-21 Applied Materials, Inc. Substrate temperature monitoring
JP2018093173A (ja) 2016-12-05 2018-06-14 東京エレクトロン株式会社 プラズマ処理装置

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KR100260587B1 (ko) * 1993-06-01 2000-08-01 히가시 데쓰로 정전척 및 그의 제조방법
JP3604522B2 (ja) 1995-11-28 2004-12-22 東京エレクトロン株式会社 熱処理方法及びその装置
US5900062A (en) 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
JP3398936B2 (ja) 1999-04-09 2003-04-21 日本エー・エス・エム株式会社 半導体処理装置
US6481723B1 (en) 2001-03-30 2002-11-19 Lam Research Corporation Lift pin impact management
US6646857B2 (en) 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
KR100964619B1 (ko) * 2003-10-06 2010-06-22 삼성전자주식회사 리프트 핀, 이를 포함하는 리프팅 장치
US7244311B2 (en) * 2004-10-13 2007-07-17 Lam Research Corporation Heat transfer system for improved semiconductor processing uniformity
KR101402875B1 (ko) * 2006-12-11 2014-06-03 엘아이지에이디피 주식회사 리프트 핀, 리프트 핀용 가열장치 및 이를 갖춘평판표시소자 제조장치
JP5008147B2 (ja) * 2008-06-05 2012-08-22 東京エレクトロン株式会社 減圧乾燥装置
JP2010087342A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd リフトピン
JP5484981B2 (ja) * 2010-03-25 2014-05-07 東京エレクトロン株式会社 基板載置台及び基板処理装置
TWI624903B (zh) * 2013-03-15 2018-05-21 應用材料股份有限公司 在雜訊環境中之現場溫度測量
KR20150066285A (ko) * 2013-12-06 2015-06-16 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
US10049905B2 (en) 2014-09-25 2018-08-14 Tokyo Electron Limited Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus
US20170352565A1 (en) * 2016-06-07 2017-12-07 Chunlei Zhang Workpiece carrier with gas pressure in inner cavities
US9892956B1 (en) * 2016-10-12 2018-02-13 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder
EP3421849A1 (de) * 2017-06-30 2019-01-02 VAT Holding AG Vakuumventil mit temperatursensor
DE102018009630A1 (de) * 2018-12-11 2020-06-18 Vat Holding Ag Stifthubvorrichtung mit Temperatursensor
DE102018009871A1 (de) * 2018-12-19 2020-06-25 Vat Holding Ag Stifthubvorrichtung mit Zustandsüberwachung
US12211734B2 (en) * 2021-03-12 2025-01-28 Applied Materials, Inc. Lift pin mechanism

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
JP2012521652A (ja) 2009-03-24 2012-09-13 ラム リサーチ コーポレーション デチャック時における電位スパイクを抑制する方法及び装置
US20170362712A1 (en) 2016-06-21 2017-12-21 Applied Materials, Inc. Substrate temperature monitoring
JP2018093173A (ja) 2016-12-05 2018-06-14 東京エレクトロン株式会社 プラズマ処理装置

Also Published As

Publication number Publication date
KR20210099633A (ko) 2021-08-12
JP2022512468A (ja) 2022-02-04
CN112970101B (zh) 2022-12-30
DE102018009630A1 (de) 2020-06-18
TWI837223B (zh) 2024-04-01
WO2020120510A1 (de) 2020-06-18
US20220020629A1 (en) 2022-01-20
CN112970101A (zh) 2021-06-15
US12381108B2 (en) 2025-08-05
TW202029394A (zh) 2020-08-01
KR102805233B1 (ko) 2025-05-12

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