DE102018009630A1 - Stifthubvorrichtung mit Temperatursensor - Google Patents

Stifthubvorrichtung mit Temperatursensor Download PDF

Info

Publication number
DE102018009630A1
DE102018009630A1 DE102018009630.1A DE102018009630A DE102018009630A1 DE 102018009630 A1 DE102018009630 A1 DE 102018009630A1 DE 102018009630 A DE102018009630 A DE 102018009630A DE 102018009630 A1 DE102018009630 A1 DE 102018009630A1
Authority
DE
Germany
Prior art keywords
lifting device
temperature sensor
pin
temperature
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102018009630.1A
Other languages
German (de)
English (en)
Inventor
Adrian Eschenmoser
Michael DÜR
Andreas Hofer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
VAT Holding AG
Original Assignee
VAT Holding AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by VAT Holding AG filed Critical VAT Holding AG
Priority to DE102018009630.1A priority Critical patent/DE102018009630A1/de
Priority to TW108142476A priority patent/TWI837223B/zh
Priority to US17/312,867 priority patent/US12381108B2/en
Priority to CN201980073933.4A priority patent/CN112970101B/zh
Priority to JP2021532844A priority patent/JP7524187B2/ja
Priority to KR1020217021211A priority patent/KR102805233B1/ko
Priority to PCT/EP2019/084516 priority patent/WO2020120510A1/de
Publication of DE102018009630A1 publication Critical patent/DE102018009630A1/de
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K13/00—Thermometers specially adapted for specific purposes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE102018009630.1A 2018-12-11 2018-12-11 Stifthubvorrichtung mit Temperatursensor Withdrawn DE102018009630A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102018009630.1A DE102018009630A1 (de) 2018-12-11 2018-12-11 Stifthubvorrichtung mit Temperatursensor
TW108142476A TWI837223B (zh) 2018-12-11 2019-11-22 具有溫度感測器的銷舉升裝置
US17/312,867 US12381108B2 (en) 2018-12-11 2019-12-10 Pin lifting device having a temperature sensor
CN201980073933.4A CN112970101B (zh) 2018-12-11 2019-12-10 具有温度传感器的销举升装置
JP2021532844A JP7524187B2 (ja) 2018-12-11 2019-12-10 温度センサを有するピンリフティング装置
KR1020217021211A KR102805233B1 (ko) 2018-12-11 2019-12-10 온도 센서를 갖는 핀 리프팅 장치
PCT/EP2019/084516 WO2020120510A1 (de) 2018-12-11 2019-12-10 Stifthubvorrichtung mit temperatursensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102018009630.1A DE102018009630A1 (de) 2018-12-11 2018-12-11 Stifthubvorrichtung mit Temperatursensor

Publications (1)

Publication Number Publication Date
DE102018009630A1 true DE102018009630A1 (de) 2020-06-18

Family

ID=68848296

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102018009630.1A Withdrawn DE102018009630A1 (de) 2018-12-11 2018-12-11 Stifthubvorrichtung mit Temperatursensor

Country Status (7)

Country Link
US (1) US12381108B2 (https=)
JP (1) JP7524187B2 (https=)
KR (1) KR102805233B1 (https=)
CN (1) CN112970101B (https=)
DE (1) DE102018009630A1 (https=)
TW (1) TWI837223B (https=)
WO (1) WO2020120510A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018009630A1 (de) * 2018-12-11 2020-06-18 Vat Holding Ag Stifthubvorrichtung mit Temperatursensor
CN113488370B (zh) * 2021-07-06 2024-05-31 北京屹唐半导体科技股份有限公司 用于等离子体处理设备的升降销组件
JP7715464B2 (ja) * 2021-09-02 2025-07-30 東京エレクトロン株式会社 基板処理装置
CN120291061B (zh) * 2025-06-09 2025-08-26 蓝河科技(绍兴)有限公司 气体分配装置和半导体设备

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625526A (en) * 1993-06-01 1997-04-29 Tokyo Electron Limited Electrostatic chuck
US6481723B1 (en) 2001-03-30 2002-11-19 Lam Research Corporation Lift pin impact management
US6646857B2 (en) 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
US20180130696A1 (en) * 2016-10-12 2018-05-10 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3604522B2 (ja) 1995-11-28 2004-12-22 東京エレクトロン株式会社 熱処理方法及びその装置
US5900062A (en) 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US5886864A (en) * 1996-12-02 1999-03-23 Applied Materials, Inc. Substrate support member for uniform heating of a substrate
JP3398936B2 (ja) 1999-04-09 2003-04-21 日本エー・エス・エム株式会社 半導体処理装置
JP2004022803A (ja) 2002-06-17 2004-01-22 Taiheiyo Cement Corp 温度測定機能付き突き上げピン
KR100964619B1 (ko) * 2003-10-06 2010-06-22 삼성전자주식회사 리프트 핀, 이를 포함하는 리프팅 장치
US7244311B2 (en) * 2004-10-13 2007-07-17 Lam Research Corporation Heat transfer system for improved semiconductor processing uniformity
KR101402875B1 (ko) * 2006-12-11 2014-06-03 엘아이지에이디피 주식회사 리프트 핀, 리프트 핀용 가열장치 및 이를 갖춘평판표시소자 제조장치
JP5008147B2 (ja) * 2008-06-05 2012-08-22 東京エレクトロン株式会社 減圧乾燥装置
JP2010087342A (ja) * 2008-10-01 2010-04-15 Toray Eng Co Ltd リフトピン
US8313612B2 (en) 2009-03-24 2012-11-20 Lam Research Corporation Method and apparatus for reduction of voltage potential spike during dechucking
JP5484981B2 (ja) * 2010-03-25 2014-05-07 東京エレクトロン株式会社 基板載置台及び基板処理装置
TWI624903B (zh) * 2013-03-15 2018-05-21 應用材料股份有限公司 在雜訊環境中之現場溫度測量
KR20150066285A (ko) * 2013-12-06 2015-06-16 세메스 주식회사 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
US10049905B2 (en) 2014-09-25 2018-08-14 Tokyo Electron Limited Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus
US20170352565A1 (en) * 2016-06-07 2017-12-07 Chunlei Zhang Workpiece carrier with gas pressure in inner cavities
US10184183B2 (en) 2016-06-21 2019-01-22 Applied Materials, Inc. Substrate temperature monitoring
TWI765936B (zh) 2016-11-29 2022-06-01 美商東京威力科創Ｆｓｉ股份有限公司 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭
JP7130359B2 (ja) 2016-12-05 2022-09-05 東京エレクトロン株式会社 プラズマ処理装置
EP3421849A1 (de) * 2017-06-30 2019-01-02 VAT Holding AG Vakuumventil mit temperatursensor
DE102018009630A1 (de) * 2018-12-11 2020-06-18 Vat Holding Ag Stifthubvorrichtung mit Temperatursensor
DE102018009871A1 (de) * 2018-12-19 2020-06-25 Vat Holding Ag Stifthubvorrichtung mit Zustandsüberwachung
US12211734B2 (en) * 2021-03-12 2025-01-28 Applied Materials, Inc. Lift pin mechanism

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5625526A (en) * 1993-06-01 1997-04-29 Tokyo Electron Limited Electrostatic chuck
US6481723B1 (en) 2001-03-30 2002-11-19 Lam Research Corporation Lift pin impact management
US6646857B2 (en) 2001-03-30 2003-11-11 Lam Research Corporation Semiconductor wafer lifting device and methods for implementing the same
US20180130696A1 (en) * 2016-10-12 2018-05-10 Lam Research Corporation Wafer positioning pedestal for semiconductor processing
EP3361316A1 (de) * 2017-02-14 2018-08-15 VAT Holding AG Pneumatische stifthubvorrichtung und pneumatischer hubzylinder

Also Published As

Publication number Publication date
KR20210099633A (ko) 2021-08-12
JP2022512468A (ja) 2022-02-04
JP7524187B2 (ja) 2024-07-29
CN112970101B (zh) 2022-12-30
TWI837223B (zh) 2024-04-01
WO2020120510A1 (de) 2020-06-18
US20220020629A1 (en) 2022-01-20
CN112970101A (zh) 2021-06-15
US12381108B2 (en) 2025-08-05
TW202029394A (zh) 2020-08-01
KR102805233B1 (ko) 2025-05-12

Similar Documents

Publication Publication Date Title
DE102018009871A1 (de) Stifthubvorrichtung mit Zustandsüberwachung
DE102018009630A1 (de) Stifthubvorrichtung mit Temperatursensor
EP1844342B1 (de) Verfahren und vorrichtung zum testen von halbleiterwafern mittels einer temperierbaren aufspanneinrichtung
DE102019008104A1 (de) Verfahren zur Überwachung, Positionsbestimmung und Positionierung eines Stiffthubsystems
EP2502057B1 (de) System und verfahren zur thermischen analyse
EP3283864A1 (de) Linearführungseinrichtung für eine vorschubachse
DE102018006903A1 (de) Galvanisch getrennte Stifthubvorrichtung
EP2921833A1 (de) Thermoanalytischer Sensor und Verfahren zu dessen Herstellung
WO2018162070A1 (de) Elektrostatische substrathalterung
EP1826812A1 (de) Verfahren und Vorrichtung zum Aufnehmen und/oder Transportieren von Substraten
WO2019002487A1 (de) Vakuumventil mit temperatursensor
WO2019244136A2 (de) Stellantrieb für einen bondkopf
DE102019006050A1 (de) Stifthubvorrichtung mit Gleitführung
DE102019007194A1 (de) Verstellvorrichtung für den Vakuumbereich mit Druckmessfunktionalität
DE102019111696A1 (de) Verfahren zur Temperaturmessung und Temperaturmessvorrichtung
DE102022128729A1 (de) Messgerät zum dimensionellen Messen, Verwendung des Messgeräts und Verfahren zum dimensionellen Messen
EP2880455B1 (de) Untersuchungsvorrichtung und -verfahren zur erfassung von eigenschaften eines materials in einer bauelement-probe
EP4679080A1 (de) Messvorrichtung zur charakterisierung eines messobjektes im vakuum mittels induktivem sensor in elektromagnetischer transmission
EP3990868B1 (de) Sensorelement und vorrichtung zur erfassung von prozessparametern in einer sinteranlage
DE102011050322B4 (de) Substrataufnahmeverfahren und Substrataufnahmevorrichtung
DE102023119032B4 (de) Sensoranordnung zur Erfassung von Deformationsereignissen
DE102012108820A1 (de) Sensor, elektrisches Bauelement, Verfahren zur Bestimmung einer Temperatur oder einer Betriebsdauer eines elektrischen Bauelements und Verwendung einer intermetallischen Phase oder einer Phasengrenze als Sensor
DE10354429B4 (de) Einrichtung zum Detektieren der Lage eines Objektes in einer drucktechnischen Maschine
DE102016221626A1 (de) Verfahren und Anordnung zur Überwachung des Ritzprozesses beim Ritzen von Bauteilen mit einem Ritzwerkzeug
EP0869353A2 (de) Sensor zur Messung physikalischer und / oder chemischer Grössen und Verfahren zur Herstellung eines Sensors

Legal Events

Date Code Title Description
R163 Identified publications notified
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee