JP2022512468A5 - - Google Patents
Info
- Publication number
- JP2022512468A5 JP2022512468A5 JP2021532844A JP2021532844A JP2022512468A5 JP 2022512468 A5 JP2022512468 A5 JP 2022512468A5 JP 2021532844 A JP2021532844 A JP 2021532844A JP 2021532844 A JP2021532844 A JP 2021532844A JP 2022512468 A5 JP2022512468 A5 JP 2022512468A5
- Authority
- JP
- Japan
- Prior art keywords
- lifting device
- pin lifting
- temperature
- status information
- measurement signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018009630.1 | 2018-12-11 | ||
| DE102018009630.1A DE102018009630A1 (de) | 2018-12-11 | 2018-12-11 | Stifthubvorrichtung mit Temperatursensor |
| PCT/EP2019/084516 WO2020120510A1 (de) | 2018-12-11 | 2019-12-10 | Stifthubvorrichtung mit temperatursensor |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022512468A JP2022512468A (ja) | 2022-02-04 |
| JP2022512468A5 true JP2022512468A5 (https=) | 2022-10-21 |
| JP7524187B2 JP7524187B2 (ja) | 2024-07-29 |
Family
ID=68848296
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021532844A Active JP7524187B2 (ja) | 2018-12-11 | 2019-12-10 | 温度センサを有するピンリフティング装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12381108B2 (https=) |
| JP (1) | JP7524187B2 (https=) |
| KR (1) | KR102805233B1 (https=) |
| CN (1) | CN112970101B (https=) |
| DE (1) | DE102018009630A1 (https=) |
| TW (1) | TWI837223B (https=) |
| WO (1) | WO2020120510A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018009630A1 (de) * | 2018-12-11 | 2020-06-18 | Vat Holding Ag | Stifthubvorrichtung mit Temperatursensor |
| CN113488370B (zh) * | 2021-07-06 | 2024-05-31 | 北京屹唐半导体科技股份有限公司 | 用于等离子体处理设备的升降销组件 |
| JP7715464B2 (ja) * | 2021-09-02 | 2025-07-30 | 東京エレクトロン株式会社 | 基板処理装置 |
| CN120291061B (zh) * | 2025-06-09 | 2025-08-26 | 蓝河科技(绍兴)有限公司 | 气体分配装置和半导体设备 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100260587B1 (ko) * | 1993-06-01 | 2000-08-01 | 히가시 데쓰로 | 정전척 및 그의 제조방법 |
| JP3604522B2 (ja) | 1995-11-28 | 2004-12-22 | 東京エレクトロン株式会社 | 熱処理方法及びその装置 |
| US5900062A (en) | 1995-12-28 | 1999-05-04 | Applied Materials, Inc. | Lift pin for dechucking substrates |
| US5886864A (en) * | 1996-12-02 | 1999-03-23 | Applied Materials, Inc. | Substrate support member for uniform heating of a substrate |
| JP3398936B2 (ja) | 1999-04-09 | 2003-04-21 | 日本エー・エス・エム株式会社 | 半導体処理装置 |
| US6481723B1 (en) | 2001-03-30 | 2002-11-19 | Lam Research Corporation | Lift pin impact management |
| US6646857B2 (en) | 2001-03-30 | 2003-11-11 | Lam Research Corporation | Semiconductor wafer lifting device and methods for implementing the same |
| JP2004022803A (ja) | 2002-06-17 | 2004-01-22 | Taiheiyo Cement Corp | 温度測定機能付き突き上げピン |
| KR100964619B1 (ko) * | 2003-10-06 | 2010-06-22 | 삼성전자주식회사 | 리프트 핀, 이를 포함하는 리프팅 장치 |
| US7244311B2 (en) * | 2004-10-13 | 2007-07-17 | Lam Research Corporation | Heat transfer system for improved semiconductor processing uniformity |
| KR101402875B1 (ko) * | 2006-12-11 | 2014-06-03 | 엘아이지에이디피 주식회사 | 리프트 핀, 리프트 핀용 가열장치 및 이를 갖춘평판표시소자 제조장치 |
| JP5008147B2 (ja) * | 2008-06-05 | 2012-08-22 | 東京エレクトロン株式会社 | 減圧乾燥装置 |
| JP2010087342A (ja) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | リフトピン |
| US8313612B2 (en) | 2009-03-24 | 2012-11-20 | Lam Research Corporation | Method and apparatus for reduction of voltage potential spike during dechucking |
| JP5484981B2 (ja) * | 2010-03-25 | 2014-05-07 | 東京エレクトロン株式会社 | 基板載置台及び基板処理装置 |
| TWI624903B (zh) * | 2013-03-15 | 2018-05-21 | 應用材料股份有限公司 | 在雜訊環境中之現場溫度測量 |
| KR20150066285A (ko) * | 2013-12-06 | 2015-06-16 | 세메스 주식회사 | 기판 지지 유닛 및 이를 포함하는 기판 처리 장치 |
| US10049905B2 (en) | 2014-09-25 | 2018-08-14 | Tokyo Electron Limited | Substrate heat treatment apparatus, substrate heat treatment method, storage medium and heat-treatment-condition detecting apparatus |
| US20170352565A1 (en) * | 2016-06-07 | 2017-12-07 | Chunlei Zhang | Workpiece carrier with gas pressure in inner cavities |
| US10184183B2 (en) | 2016-06-21 | 2019-01-22 | Applied Materials, Inc. | Substrate temperature monitoring |
| US9892956B1 (en) * | 2016-10-12 | 2018-02-13 | Lam Research Corporation | Wafer positioning pedestal for semiconductor processing |
| TWI765936B (zh) | 2016-11-29 | 2022-06-01 | 美商東京威力科創Ｆｓｉ股份有限公司 | 用以對處理腔室中之微電子基板進行處理的平移與旋轉夾頭 |
| JP7130359B2 (ja) | 2016-12-05 | 2022-09-05 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| EP3361316A1 (de) * | 2017-02-14 | 2018-08-15 | VAT Holding AG | Pneumatische stifthubvorrichtung und pneumatischer hubzylinder |
| EP3421849A1 (de) * | 2017-06-30 | 2019-01-02 | VAT Holding AG | Vakuumventil mit temperatursensor |
| DE102018009630A1 (de) * | 2018-12-11 | 2020-06-18 | Vat Holding Ag | Stifthubvorrichtung mit Temperatursensor |
| DE102018009871A1 (de) * | 2018-12-19 | 2020-06-25 | Vat Holding Ag | Stifthubvorrichtung mit Zustandsüberwachung |
| US12211734B2 (en) * | 2021-03-12 | 2025-01-28 | Applied Materials, Inc. | Lift pin mechanism |
-
2018
- 2018-12-11 DE DE102018009630.1A patent/DE102018009630A1/de not_active Withdrawn
-
2019
- 2019-11-22 TW TW108142476A patent/TWI837223B/zh active
- 2019-12-10 JP JP2021532844A patent/JP7524187B2/ja active Active
- 2019-12-10 KR KR1020217021211A patent/KR102805233B1/ko active Active
- 2019-12-10 CN CN201980073933.4A patent/CN112970101B/zh active Active
- 2019-12-10 US US17/312,867 patent/US12381108B2/en active Active
- 2019-12-10 WO PCT/EP2019/084516 patent/WO2020120510A1/de not_active Ceased
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