JP7480915B2 - 欠陥検査装置および欠陥検査方法 - Google Patents

欠陥検査装置および欠陥検査方法 Download PDF

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Publication number
JP7480915B2
JP7480915B2 JP2023520898A JP2023520898A JP7480915B2 JP 7480915 B2 JP7480915 B2 JP 7480915B2 JP 2023520898 A JP2023520898 A JP 2023520898A JP 2023520898 A JP2023520898 A JP 2023520898A JP 7480915 B2 JP7480915 B2 JP 7480915B2
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Prior art keywords
optical path
interference
laser light
measurement unit
light
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Japanese (ja)
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JPWO2022239522A5 (https=
JPWO2022239522A1 (https=
Inventor
浩司 堀川
健二 田窪
貴秀 畠堀
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Shimadzu Corp
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Shimadzu Corp
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/041—Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/32—Arrangements for suppressing undesired influences, e.g. temperature or pressure variations, compensating for signal noise
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/0289—Internal structure, e.g. defects, grain size, texture

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Optics & Photonics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2023520898A 2021-05-14 2022-03-25 欠陥検査装置および欠陥検査方法 Active JP7480915B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021082490 2021-05-14
JP2021082490 2021-05-14
PCT/JP2022/014263 WO2022239522A1 (ja) 2021-05-14 2022-03-25 欠陥検査装置および欠陥検査方法

Publications (3)

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JPWO2022239522A1 JPWO2022239522A1 (https=) 2022-11-17
JPWO2022239522A5 JPWO2022239522A5 (https=) 2023-11-28
JP7480915B2 true JP7480915B2 (ja) 2024-05-10

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JP2023520898A Active JP7480915B2 (ja) 2021-05-14 2022-03-25 欠陥検査装置および欠陥検査方法

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Country Link
US (1) US12596105B2 (https=)
JP (1) JP7480915B2 (https=)
CN (1) CN117280206A (https=)
WO (1) WO2022239522A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7725037B1 (ja) * 2025-02-05 2025-08-19 株式会社日本エー・エム・シー 表面検査装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760904A (en) 1996-07-26 1998-06-02 General Electric Company Method and system for inspecting a surface of an object with laser ultrasound
WO2001027600A1 (en) 1999-10-14 2001-04-19 Sumitomo Metal Industries., Ltd. Method for inspecting surface of semiconductor wafer
JP2004101189A (ja) 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2013221793A (ja) 2012-04-13 2013-10-28 Toshiba Corp レーザ超音波検査装置及び方法
CN111316093A (zh) 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法
JP2021047090A (ja) 2019-09-18 2021-03-25 株式会社島津製作所 欠陥検査装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6451695B2 (ja) * 2016-06-02 2019-01-16 株式会社島津製作所 欠陥検査方法及び欠陥検査装置
WO2020129209A1 (ja) * 2018-12-20 2020-06-25 株式会社島津製作所 欠陥検査装置および欠陥検査方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760904A (en) 1996-07-26 1998-06-02 General Electric Company Method and system for inspecting a surface of an object with laser ultrasound
WO2001027600A1 (en) 1999-10-14 2001-04-19 Sumitomo Metal Industries., Ltd. Method for inspecting surface of semiconductor wafer
JP2004101189A (ja) 2002-09-04 2004-04-02 Hitachi Ltd 欠陥検査装置及び欠陥検査方法
JP2013221793A (ja) 2012-04-13 2013-10-28 Toshiba Corp レーザ超音波検査装置及び方法
CN111316093A (zh) 2018-12-14 2020-06-19 合刃科技（深圳）有限公司 结构缺陷检测系统及结构缺陷检测方法
JP2021047090A (ja) 2019-09-18 2021-03-25 株式会社島津製作所 欠陥検査装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7725037B1 (ja) * 2025-02-05 2025-08-19 株式会社日本エー・エム・シー 表面検査装置

Also Published As

Publication number Publication date
WO2022239522A1 (ja) 2022-11-17
CN117280206A (zh) 2023-12-22
JPWO2022239522A1 (https=) 2022-11-17
US20240230601A1 (en) 2024-07-11
US12596105B2 (en) 2026-04-07

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