JPWO2022239522A1 - - Google Patents
Info
- Publication number
- JPWO2022239522A1 JPWO2022239522A1 JP2023520898A JP2023520898A JPWO2022239522A1 JP WO2022239522 A1 JPWO2022239522 A1 JP WO2022239522A1 JP 2023520898 A JP2023520898 A JP 2023520898A JP 2023520898 A JP2023520898 A JP 2023520898A JP WO2022239522 A1 JPWO2022239522 A1 JP WO2022239522A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/041—Analysing solids on the surface of the material, e.g. using Lamb, Rayleigh or shear waves
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/892—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles characterised by the flaw, defect or object feature examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/32—Arrangements for suppressing undesired influences, e.g. temperature or pressure variations, compensating for signal noise
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/0289—Internal structure, e.g. defects, grain size, texture
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Optics & Photonics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021082490 | 2021-05-14 | ||
| JP2021082490 | 2021-05-14 | ||
| PCT/JP2022/014263 WO2022239522A1 (ja) | 2021-05-14 | 2022-03-25 | 欠陥検査装置および欠陥検査方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022239522A1 true JPWO2022239522A1 (https=) | 2022-11-17 |
| JPWO2022239522A5 JPWO2022239522A5 (https=) | 2023-11-28 |
| JP7480915B2 JP7480915B2 (ja) | 2024-05-10 |
Family
ID=84029550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023520898A Active JP7480915B2 (ja) | 2021-05-14 | 2022-03-25 | 欠陥検査装置および欠陥検査方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12596105B2 (https=) |
| JP (1) | JP7480915B2 (https=) |
| CN (1) | CN117280206A (https=) |
| WO (1) | WO2022239522A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7725037B1 (ja) * | 2025-02-05 | 2025-08-19 | 株式会社日本エー・エム・シー | 表面検査装置 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5760904A (en) * | 1996-07-26 | 1998-06-02 | General Electric Company | Method and system for inspecting a surface of an object with laser ultrasound |
| WO2001027600A1 (en) * | 1999-10-14 | 2001-04-19 | Sumitomo Metal Industries., Ltd. | Method for inspecting surface of semiconductor wafer |
| JP2004101189A (ja) * | 2002-09-04 | 2004-04-02 | Hitachi Ltd | 欠陥検査装置及び欠陥検査方法 |
| JP2013221793A (ja) * | 2012-04-13 | 2013-10-28 | Toshiba Corp | レーザ超音波検査装置及び方法 |
| CN111316093A (zh) * | 2018-12-14 | 2020-06-19 | 合刃科技（深圳）有限公司 | 结构缺陷检测系统及结构缺陷检测方法 |
| JP2021047090A (ja) * | 2019-09-18 | 2021-03-25 | 株式会社島津製作所 | 欠陥検査装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6451695B2 (ja) * | 2016-06-02 | 2019-01-16 | 株式会社島津製作所 | 欠陥検査方法及び欠陥検査装置 |
| WO2020129209A1 (ja) * | 2018-12-20 | 2020-06-25 | 株式会社島津製作所 | 欠陥検査装置および欠陥検査方法 |
-
2022
- 2022-03-25 US US18/290,270 patent/US12596105B2/en active Active
- 2022-03-25 CN CN202280032443.1A patent/CN117280206A/zh active Pending
- 2022-03-25 WO PCT/JP2022/014263 patent/WO2022239522A1/ja not_active Ceased
- 2022-03-25 JP JP2023520898A patent/JP7480915B2/ja active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5760904A (en) * | 1996-07-26 | 1998-06-02 | General Electric Company | Method and system for inspecting a surface of an object with laser ultrasound |
| WO2001027600A1 (en) * | 1999-10-14 | 2001-04-19 | Sumitomo Metal Industries., Ltd. | Method for inspecting surface of semiconductor wafer |
| JP2004101189A (ja) * | 2002-09-04 | 2004-04-02 | Hitachi Ltd | 欠陥検査装置及び欠陥検査方法 |
| JP2013221793A (ja) * | 2012-04-13 | 2013-10-28 | Toshiba Corp | レーザ超音波検査装置及び方法 |
| CN111316093A (zh) * | 2018-12-14 | 2020-06-19 | 合刃科技（深圳）有限公司 | 结构缺陷检测系统及结构缺陷检测方法 |
| JP2021047090A (ja) * | 2019-09-18 | 2021-03-25 | 株式会社島津製作所 | 欠陥検査装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022239522A1 (ja) | 2022-11-17 |
| CN117280206A (zh) | 2023-12-22 |
| JP7480915B2 (ja) | 2024-05-10 |
| US20240230601A1 (en) | 2024-07-11 |
| US12596105B2 (en) | 2026-04-07 |
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