JP7478767B2 - セラミックヒータ - Google Patents
セラミックヒータ Download PDFInfo
- Publication number
- JP7478767B2 JP7478767B2 JP2022032565A JP2022032565A JP7478767B2 JP 7478767 B2 JP7478767 B2 JP 7478767B2 JP 2022032565 A JP2022032565 A JP 2022032565A JP 2022032565 A JP2022032565 A JP 2022032565A JP 7478767 B2 JP7478767 B2 JP 7478767B2
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- Prior art keywords
- terminal
- zone
- heater
- ceramic plate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims description 86
- 238000001816 cooling Methods 0.000 claims description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 239000002826 coolant Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 238000004220 aggregation Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000011156 metal matrix composite Substances 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910018134 Al-Mg Inorganic materials 0.000 description 1
- 229910018467 Al—Mg Inorganic materials 0.000 description 1
- 229910018566 Al—Si—Mg Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0019—Circuit arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Description
表面にウエハ載置面を備えたセラミックプレートと、
前記セラミックプレートの表面を複数に分割したゾーンのそれぞれに対応して前記セラミックプレートに埋設されたゾーンヒータと、
前記ゾーンヒータの端部に前記セラミックプレートの内部配線を介して接続される端子と、
前記セラミックプレートに設けられ、前記端子が複数個集約して配置された端子集約領域と、
前記セラミックプレートに設けられ、前記端子が配置されていない端子空き領域と、
を備え、
前記ゾーンヒータとして、前記端子集約領域に対応するゾーンに設けられた端子集約領域対応ゾーンヒータと、端子空き領域に対応するゾーンに設けられた端子空き領域対応ゾーンヒータとを備える、
ものである。
Claims (4)
- 表面にウエハ載置面を備えたセラミックプレートと、
前記セラミックプレートの表面を複数に分割したゾーンのそれぞれに対応して前記セラミックプレートに埋設されたゾーンヒータと、
前記ゾーンヒータの端部に前記セラミックプレートの内部配線を介して接続される端子と、
前記セラミックプレートに設けられ、前記端子が複数個集約して配置された端子集約領域と、
前記セラミックプレートに設けられ、前記端子が配置されていない端子空き領域と、
を備え、
前記ゾーンヒータとして、前記端子集約領域に対応するゾーンに設けられた端子集約領域対応ゾーンヒータと、前記端子空き領域に対応するゾーンに設けられた端子空き領域対応ゾーンヒータとを備え、
前記セラミックプレートは、平面視で円形であり、
複数の前記ゾーンは、前記セラミックプレートと同心円となる円形領域ゾーンと、前記円形領域ゾーンの周りの円環帯を前記セラミックプレートの半径方向に沿って複数に分割した円環帯分割ゾーンとを備え、
前記端子集約領域に対応するゾーンは、複数の前記円環帯分割ゾーンから選択され、
前記端子集約領域に配置された複数個の前記端子は、該端子集約領域に対応する前記円環帯分割ゾーンの円弧の一端から他端にわたって設けられている、
セラミックヒータ。 - 前記端子集約領域に配置された複数個の端子は、前記セラミックプレートの同心円に沿って円弧状に設けられているか、前記セラミックプレートの同心円の接線方向に沿って直線状に設けられている、
請求項1に記載のセラミックヒータ。 - 前記端子集約領域は、前記セラミックプレートの最外周に位置するように設けられている、
請求項1又は2に記載のセラミックヒータ。 - 前記セラミックヒータは、前記セラミックプレートの下面に冷却プレートを接合した状態で用いられるものである、
請求項1~3のいずれか1項に記載のセラミックヒータ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022032565A JP7478767B2 (ja) | 2022-03-03 | 2022-03-03 | セラミックヒータ |
CN202211285014.3A CN116744481A (zh) | 2022-03-03 | 2022-10-20 | 陶瓷加热器 |
US18/157,191 US20230284341A1 (en) | 2022-03-03 | 2023-01-20 | Ceramic heater |
KR1020230009894A KR20230130527A (ko) | 2022-03-03 | 2023-01-26 | 세라믹 히터 |
TW112105666A TWI816627B (zh) | 2022-03-03 | 2023-02-17 | 陶瓷加熱器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022032565A JP7478767B2 (ja) | 2022-03-03 | 2022-03-03 | セラミックヒータ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2023128306A JP2023128306A (ja) | 2023-09-14 |
JP7478767B2 true JP7478767B2 (ja) | 2024-05-07 |
Family
ID=87850266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022032565A Active JP7478767B2 (ja) | 2022-03-03 | 2022-03-03 | セラミックヒータ |
Country Status (5)
Country | Link |
---|---|
US (1) | US20230284341A1 (ja) |
JP (1) | JP7478767B2 (ja) |
KR (1) | KR20230130527A (ja) |
CN (1) | CN116744481A (ja) |
TW (1) | TWI816627B (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005032933A (ja) | 2003-07-10 | 2005-02-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2018018587A (ja) | 2016-07-25 | 2018-02-01 | 日本特殊陶業株式会社 | 保持装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6804828B2 (ja) * | 2015-04-20 | 2020-12-23 | 日本特殊陶業株式会社 | セラミックヒータ及び静電チャック |
KR101806244B1 (ko) | 2016-04-08 | 2018-01-10 | 한국항공우주연구원 | 시험용 완충지지장치 |
KR102225236B1 (ko) * | 2017-03-06 | 2021-03-10 | 엔지케이 인슐레이터 엘티디 | 웨이퍼 지지대 |
JP7240341B2 (ja) * | 2020-02-03 | 2023-03-15 | 日本碍子株式会社 | セラミックヒータ及び熱電対ガイド |
-
2022
- 2022-03-03 JP JP2022032565A patent/JP7478767B2/ja active Active
- 2022-10-20 CN CN202211285014.3A patent/CN116744481A/zh active Pending
-
2023
- 2023-01-20 US US18/157,191 patent/US20230284341A1/en active Pending
- 2023-01-26 KR KR1020230009894A patent/KR20230130527A/ko not_active Application Discontinuation
- 2023-02-17 TW TW112105666A patent/TWI816627B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005032933A (ja) | 2003-07-10 | 2005-02-03 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2018018587A (ja) | 2016-07-25 | 2018-02-01 | 日本特殊陶業株式会社 | 保持装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI816627B (zh) | 2023-09-21 |
JP2023128306A (ja) | 2023-09-14 |
US20230284341A1 (en) | 2023-09-07 |
KR20230130527A (ko) | 2023-09-12 |
TW202336901A (zh) | 2023-09-16 |
CN116744481A (zh) | 2023-09-12 |
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