JP7473429B2 - レーザー加工装置 - Google Patents
レーザー加工装置 Download PDFInfo
- Publication number
- JP7473429B2 JP7473429B2 JP2020151919A JP2020151919A JP7473429B2 JP 7473429 B2 JP7473429 B2 JP 7473429B2 JP 2020151919 A JP2020151919 A JP 2020151919A JP 2020151919 A JP2020151919 A JP 2020151919A JP 7473429 B2 JP7473429 B2 JP 7473429B2
- Authority
- JP
- Japan
- Prior art keywords
- air
- nozzle
- flow path
- sub
- laser beam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002347 injection Methods 0.000 claims description 59
- 239000007924 injection Substances 0.000 claims description 59
- 239000006059 cover glass Substances 0.000 claims description 54
- 238000003384 imaging method Methods 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000011084 recovery Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/005—Devices for removing chips by blowing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020151919A JP7473429B2 (ja) | 2020-09-10 | 2020-09-10 | レーザー加工装置 |
KR1020210108404A KR20220033983A (ko) | 2020-09-10 | 2021-08-18 | 레이저 가공 장치 |
CN202111030378.2A CN114248011A (zh) | 2020-09-10 | 2021-09-03 | 激光加工装置 |
TW110133140A TW202211320A (zh) | 2020-09-10 | 2021-09-07 | 雷射加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020151919A JP7473429B2 (ja) | 2020-09-10 | 2020-09-10 | レーザー加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2022046068A JP2022046068A (ja) | 2022-03-23 |
JP7473429B2 true JP7473429B2 (ja) | 2024-04-23 |
Family
ID=80779767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020151919A Active JP7473429B2 (ja) | 2020-09-10 | 2020-09-10 | レーザー加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7473429B2 (ko) |
KR (1) | KR20220033983A (ko) |
CN (1) | CN114248011A (ko) |
TW (1) | TW202211320A (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20240078842A (ko) | 2022-11-28 | 2024-06-04 | 김형근 | 레이저 가공장치 |
KR102578688B1 (ko) * | 2023-04-20 | 2023-09-14 | 제놉스 주식회사 | 보호 윈도우 교체 시기 모니터링 기능이 구비된 에프세타 렌즈 모듈 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004306106A (ja) | 2003-04-09 | 2004-11-04 | Babcock Hitachi Kk | レーザ加工ヘッド |
JP2007216281A (ja) | 2006-02-20 | 2007-08-30 | Nissan Motor Co Ltd | レーザ加工ヘッドおよびレーザ加工方法 |
JP2011121099A (ja) | 2009-12-11 | 2011-06-23 | Disco Abrasive Syst Ltd | レーザー加工装置 |
WO2017203862A1 (ja) | 2016-05-23 | 2017-11-30 | パナソニックIpマネジメント株式会社 | レーザ溶接装置、およびレーザ溶接方法 |
WO2019230193A1 (ja) | 2018-05-31 | 2019-12-05 | パナソニックIpマネジメント株式会社 | 防汚ガス供給装置及びレーザ加工ヘッドの防汚方法 |
-
2020
- 2020-09-10 JP JP2020151919A patent/JP7473429B2/ja active Active
-
2021
- 2021-08-18 KR KR1020210108404A patent/KR20220033983A/ko active Search and Examination
- 2021-09-03 CN CN202111030378.2A patent/CN114248011A/zh active Pending
- 2021-09-07 TW TW110133140A patent/TW202211320A/zh unknown
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004306106A (ja) | 2003-04-09 | 2004-11-04 | Babcock Hitachi Kk | レーザ加工ヘッド |
JP2007216281A (ja) | 2006-02-20 | 2007-08-30 | Nissan Motor Co Ltd | レーザ加工ヘッドおよびレーザ加工方法 |
JP2011121099A (ja) | 2009-12-11 | 2011-06-23 | Disco Abrasive Syst Ltd | レーザー加工装置 |
WO2017203862A1 (ja) | 2016-05-23 | 2017-11-30 | パナソニックIpマネジメント株式会社 | レーザ溶接装置、およびレーザ溶接方法 |
WO2019230193A1 (ja) | 2018-05-31 | 2019-12-05 | パナソニックIpマネジメント株式会社 | 防汚ガス供給装置及びレーザ加工ヘッドの防汚方法 |
Also Published As
Publication number | Publication date |
---|---|
CN114248011A (zh) | 2022-03-29 |
JP2022046068A (ja) | 2022-03-23 |
KR20220033983A (ko) | 2022-03-17 |
TW202211320A (zh) | 2022-03-16 |
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