JP7473144B2 - 電子材料用硬化性樹脂組成物 - Google Patents

電子材料用硬化性樹脂組成物 Download PDF

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Publication number
JP7473144B2
JP7473144B2 JP2023556764A JP2023556764A JP7473144B2 JP 7473144 B2 JP7473144 B2 JP 7473144B2 JP 2023556764 A JP2023556764 A JP 2023556764A JP 2023556764 A JP2023556764 A JP 2023556764A JP 7473144 B2 JP7473144 B2 JP 7473144B2
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Prior art keywords
curable resin
electronic materials
resin composition
mass
group
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JP2023556764A
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Japanese (ja)
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JPWO2023182346A5 (https=
JPWO2023182346A1 (https=
Inventor
拓人 池内
昌己 木下
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023556764A 2022-03-25 2023-03-22 電子材料用硬化性樹脂組成物 Active JP7473144B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022050856 2022-03-25
JP2022050856 2022-03-25
PCT/JP2023/011196 WO2023182346A1 (ja) 2022-03-25 2023-03-22 電子材料用硬化性樹脂組成物

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JPWO2023182346A1 JPWO2023182346A1 (https=) 2023-09-28
JPWO2023182346A5 JPWO2023182346A5 (https=) 2024-03-01
JP7473144B2 true JP7473144B2 (ja) 2024-04-23

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JP (1) JP7473144B2 (https=)
TW (1) TW202348734A (https=)
WO (1) WO2023182346A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108047689A (zh) 2018-01-25 2018-05-18 杨秀枝 一种防火型低介电常数电子材料的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009114383A1 (en) * 2008-03-12 2009-09-17 Dow Global Technologies Inc. Polyphenolic compounds and epoxy resins comprising cycloaliphatic moieties and process for the production thereof
KR101124543B1 (ko) * 2010-02-04 2012-03-20 두성산업 주식회사 고 바이오 에너지 방사 기능을 가진 전자파 차폐용 원단
CN106753213A (zh) * 2016-12-23 2017-05-31 铜陵安博电路板有限公司 一种具有优异防潮防水性能的pcb电路板用有机硅电子灌封胶
WO2019139157A1 (ja) * 2018-01-12 2019-07-18 積水フーラー株式会社 硬化性組成物及び塗膜防水剤
KR102349047B1 (ko) * 2021-11-10 2022-01-10 브이엠텍(주) 산화피막 형성방법

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108047689A (zh) 2018-01-25 2018-05-18 杨秀枝 一种防火型低介电常数电子材料的制备方法

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Publication number Publication date
WO2023182346A1 (ja) 2023-09-28
JPWO2023182346A1 (https=) 2023-09-28
TW202348734A (zh) 2023-12-16

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