JPWO2023182346A5 - - Google Patents
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- Publication number
- JPWO2023182346A5 JPWO2023182346A5 JP2023556764A JP2023556764A JPWO2023182346A5 JP WO2023182346 A5 JPWO2023182346 A5 JP WO2023182346A5 JP 2023556764 A JP2023556764 A JP 2023556764A JP 2023556764 A JP2023556764 A JP 2023556764A JP WO2023182346 A5 JPWO2023182346 A5 JP WO2023182346A5
- Authority
- JP
- Japan
- Prior art keywords
- curable resin
- electronic materials
- resin composition
- phosphorus compound
- feldspar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012776 electronic material Substances 0.000 claims 8
- 239000011342 resin composition Substances 0.000 claims 8
- 239000010433 feldspar Substances 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 229920005989 resin Polymers 0.000 claims 7
- 229910052698 phosphorus Inorganic materials 0.000 claims 6
- 239000011574 phosphorus Substances 0.000 claims 6
- -1 phosphorus compound Chemical class 0.000 claims 6
- 229920005573 silicon-containing polymer Polymers 0.000 claims 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 150000003018 phosphorus compounds Chemical class 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000004114 Ammonium polyphosphate Substances 0.000 claims 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 1
- 235000019826 ammonium polyphosphate Nutrition 0.000 claims 1
- 229920001276 ammonium polyphosphate Polymers 0.000 claims 1
- 239000011521 glass Substances 0.000 claims 1
- 229920000233 poly(alkylene oxides) Polymers 0.000 claims 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 claims 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022050856 | 2022-03-25 | ||
| JP2022050856 | 2022-03-25 | ||
| PCT/JP2023/011196 WO2023182346A1 (ja) | 2022-03-25 | 2023-03-22 | 電子材料用硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023182346A1 JPWO2023182346A1 (https=) | 2023-09-28 |
| JPWO2023182346A5 true JPWO2023182346A5 (https=) | 2024-03-01 |
| JP7473144B2 JP7473144B2 (ja) | 2024-04-23 |
Family
ID=88101596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556764A Active JP7473144B2 (ja) | 2022-03-25 | 2023-03-22 | 電子材料用硬化性樹脂組成物 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7473144B2 (https=) |
| TW (1) | TW202348734A (https=) |
| WO (1) | WO2023182346A1 (https=) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009114383A1 (en) * | 2008-03-12 | 2009-09-17 | Dow Global Technologies Inc. | Polyphenolic compounds and epoxy resins comprising cycloaliphatic moieties and process for the production thereof |
| KR101124543B1 (ko) * | 2010-02-04 | 2012-03-20 | 두성산업 주식회사 | 고 바이오 에너지 방사 기능을 가진 전자파 차폐용 원단 |
| CN106753213A (zh) * | 2016-12-23 | 2017-05-31 | 铜陵安博电路板有限公司 | 一种具有优异防潮防水性能的pcb电路板用有机硅电子灌封胶 |
| WO2019139157A1 (ja) * | 2018-01-12 | 2019-07-18 | 積水フーラー株式会社 | 硬化性組成物及び塗膜防水剤 |
| CN108047689A (zh) * | 2018-01-25 | 2018-05-18 | 杨秀枝 | 一种防火型低介电常数电子材料的制备方法 |
| KR102349047B1 (ko) * | 2021-11-10 | 2022-01-10 | 브이엠텍(주) | 산화피막 형성방법 |
-
2023
- 2023-03-22 JP JP2023556764A patent/JP7473144B2/ja active Active
- 2023-03-22 WO PCT/JP2023/011196 patent/WO2023182346A1/ja not_active Ceased
- 2023-03-24 TW TW112111170A patent/TW202348734A/zh unknown
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