JP7464205B1 - 電子部品内蔵基板 - Google Patents

電子部品内蔵基板 Download PDF

Info

Publication number
JP7464205B1
JP7464205B1 JP2023574732A JP2023574732A JP7464205B1 JP 7464205 B1 JP7464205 B1 JP 7464205B1 JP 2023574732 A JP2023574732 A JP 2023574732A JP 2023574732 A JP2023574732 A JP 2023574732A JP 7464205 B1 JP7464205 B1 JP 7464205B1
Authority
JP
Japan
Prior art keywords
electronic components
electronic component
substrate
surface side
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023574732A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024142436A1 (https=
JPWO2024142436A5 (https=
Inventor
秀彦 佐々木
敦 櫻井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority claimed from PCT/JP2023/023985 external-priority patent/WO2024142436A1/ja
Application granted granted Critical
Publication of JP7464205B1 publication Critical patent/JP7464205B1/ja
Publication of JPWO2024142436A1 publication Critical patent/JPWO2024142436A1/ja
Publication of JPWO2024142436A5 publication Critical patent/JPWO2024142436A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2023574732A 2022-12-27 2023-06-28 電子部品内蔵基板 Active JP7464205B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022209704 2022-12-27
JP2022209704 2022-12-27
PCT/JP2023/023985 WO2024142436A1 (ja) 2022-12-27 2023-06-28 電子部品内蔵基板

Publications (3)

Publication Number Publication Date
JP7464205B1 true JP7464205B1 (ja) 2024-04-09
JPWO2024142436A1 JPWO2024142436A1 (https=) 2024-07-04
JPWO2024142436A5 JPWO2024142436A5 (https=) 2024-11-26

Family

ID=90606814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023574732A Active JP7464205B1 (ja) 2022-12-27 2023-06-28 電子部品内蔵基板

Country Status (4)

Country Link
US (1) US20250261314A1 (https=)
JP (1) JP7464205B1 (https=)
CN (1) CN120052063A (https=)
DE (1) DE212023000168U1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025253832A1 (ja) * 2024-06-06 2025-12-11 株式会社村田製作所 電子部品内蔵基板及び電子部品内蔵基板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000063970A1 (en) * 1999-04-16 2000-10-26 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
JP2009016440A (ja) * 2007-07-02 2009-01-22 Alps Electric Co Ltd キャパシタおよび多層配線板
JP2012118342A (ja) * 2010-12-01 2012-06-21 Seiko Epson Corp 半導体装置および電気装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000063970A1 (en) * 1999-04-16 2000-10-26 Matsushita Electric Industrial Co., Ltd. Module component and method of manufacturing the same
JP2009016440A (ja) * 2007-07-02 2009-01-22 Alps Electric Co Ltd キャパシタおよび多層配線板
JP2012118342A (ja) * 2010-12-01 2012-06-21 Seiko Epson Corp 半導体装置および電気装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025253832A1 (ja) * 2024-06-06 2025-12-11 株式会社村田製作所 電子部品内蔵基板及び電子部品内蔵基板の製造方法

Also Published As

Publication number Publication date
US20250261314A1 (en) 2025-08-14
CN120052063A (zh) 2025-05-27
DE212023000168U1 (de) 2024-11-12
JPWO2024142436A1 (https=) 2024-07-04

Similar Documents

Publication Publication Date Title
CA2121712C (en) Multi-layer wiring board and a manufacturing method thereof
US20120024586A1 (en) Printed wiring board, method for manufacturing the same, and electronic equipment
JP7464205B1 (ja) 電子部品内蔵基板
JP2017073531A (ja) プリント回路基板及びその製造方法
CN101146401B (zh) 多层布线板
WO2024142436A1 (ja) 電子部品内蔵基板
US6657295B2 (en) Multilayer interconnect board and multilayer semiconductor device
KR20150028031A (ko) 인쇄회로기판
WO2023127725A1 (ja) スティフナ付き配線基板
JP2000188483A (ja) 多層プリント配線板の製造方法
JP7770533B2 (ja) 配線基板及び実装構造体
JPH07106770A (ja) 多層プリント配線板
JP7645399B2 (ja) 配線基板
JP3796804B2 (ja) プリント配線板及びその製造方法
JPH10303556A (ja) プリント配線板の製造方法
US20250247946A1 (en) Power board
JPH10135640A (ja) プリント配線板の構造及びその製造方法
KR100771307B1 (ko) 인쇄회로기판
WO2026009566A1 (ja) 電子部品内蔵基板
JPS6273937A (ja) 多層プリント板
KR20000059562A (ko) 다층 플렉시블 기판
JPH08274416A (ja) プリント配線板及びその製造方法
JPH0434838B2 (https=)
JPH0415983A (ja) 印刷配線板の放熱構造及びその製造方法
JPH09266364A (ja) プリント回路基板

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231204

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231204

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20231204

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240227

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240311

R150 Certificate of patent or registration of utility model

Ref document number: 7464205

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150