JPWO2024142436A1 - - Google Patents
Info
- Publication number
- JPWO2024142436A1 JPWO2024142436A1 JP2023574732A JP2023574732A JPWO2024142436A1 JP WO2024142436 A1 JPWO2024142436 A1 JP WO2024142436A1 JP 2023574732 A JP2023574732 A JP 2023574732A JP 2023574732 A JP2023574732 A JP 2023574732A JP WO2024142436 A1 JPWO2024142436 A1 JP WO2024142436A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10439—Position of a single component
- H05K2201/10454—Vertically mounted
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10522—Adjacent components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022209704 | 2022-12-27 | ||
| JP2022209704 | 2022-12-27 | ||
| PCT/JP2023/023985 WO2024142436A1 (ja) | 2022-12-27 | 2023-06-28 | 電子部品内蔵基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7464205B1 JP7464205B1 (ja) | 2024-04-09 |
| JPWO2024142436A1 true JPWO2024142436A1 (https=) | 2024-07-04 |
| JPWO2024142436A5 JPWO2024142436A5 (https=) | 2024-11-26 |
Family
ID=90606814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023574732A Active JP7464205B1 (ja) | 2022-12-27 | 2023-06-28 | 電子部品内蔵基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250261314A1 (https=) |
| JP (1) | JP7464205B1 (https=) |
| CN (1) | CN120052063A (https=) |
| DE (1) | DE212023000168U1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025253832A1 (ja) * | 2024-06-06 | 2025-12-11 | 株式会社村田製作所 | 電子部品内蔵基板及び電子部品内蔵基板の製造方法 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3659167B2 (ja) * | 1999-04-16 | 2005-06-15 | 松下電器産業株式会社 | モジュール部品とその製造方法 |
| JP2009016440A (ja) * | 2007-07-02 | 2009-01-22 | Alps Electric Co Ltd | キャパシタおよび多層配線板 |
| JP2012118342A (ja) * | 2010-12-01 | 2012-06-21 | Seiko Epson Corp | 半導体装置および電気装置 |
-
2023
- 2023-06-28 DE DE212023000168.3U patent/DE212023000168U1/de active Active
- 2023-06-28 CN CN202380076309.6A patent/CN120052063A/zh active Pending
- 2023-06-28 JP JP2023574732A patent/JP7464205B1/ja active Active
-
2025
- 2025-04-28 US US19/190,869 patent/US20250261314A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20250261314A1 (en) | 2025-08-14 |
| CN120052063A (zh) | 2025-05-27 |
| DE212023000168U1 (de) | 2024-11-12 |
| JP7464205B1 (ja) | 2024-04-09 |
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