JP7455833B2 - 回路パターン作成システム、および回路パターン作成方法 - Google Patents

回路パターン作成システム、および回路パターン作成方法 Download PDF

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Publication number
JP7455833B2
JP7455833B2 JP2021530376A JP2021530376A JP7455833B2 JP 7455833 B2 JP7455833 B2 JP 7455833B2 JP 2021530376 A JP2021530376 A JP 2021530376A JP 2021530376 A JP2021530376 A JP 2021530376A JP 7455833 B2 JP7455833 B2 JP 7455833B2
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Japan
Prior art keywords
wiring
design information
circuit pattern
width dimension
wirings
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JP2021530376A
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Japanese (ja)
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JPWO2021005683A1 (enrdf_load_stackoverflow
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亮二郎 富永
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021530376A 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法 Active JP7455833B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026997 WO2021005683A1 (ja) 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法

Publications (2)

Publication Number Publication Date
JPWO2021005683A1 JPWO2021005683A1 (enrdf_load_stackoverflow) 2021-01-14
JP7455833B2 true JP7455833B2 (ja) 2024-03-26

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JP2021530376A Active JP7455833B2 (ja) 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法

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JP (1) JP7455833B2 (enrdf_load_stackoverflow)
WO (1) WO2021005683A1 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201346A (ja) 2006-01-30 2007-08-09 Mitsuboshi Belting Ltd セラミックス回路基板及びその製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221411A (ja) * 1994-02-08 1995-08-18 Toyota Autom Loom Works Ltd プリント配線基板及びその製造方法
JP2631641B2 (ja) * 1995-07-03 1997-07-16 ローム株式会社 印刷配線基板
JPH09307201A (ja) * 1996-05-10 1997-11-28 Hitachi Aic Inc プリント配線板
JPH10242600A (ja) * 1997-02-28 1998-09-11 Nec Home Electron Ltd 高周波回路用プリント基板
JPH1056242A (ja) * 1997-06-09 1998-02-24 Nitto Denko Corp フレキシブルプリント回路板
JP2001007456A (ja) * 1999-06-17 2001-01-12 Toshiba Corp 配線回路基板
GB2483702A (en) * 2010-09-17 2012-03-21 Ge Aviat Systems Ltd Method for the manufacture of a Silicon Carbide, Silicon Oxide interface having reduced interfacial carbon gettering
JP5875496B2 (ja) * 2012-09-26 2016-03-02 富士フイルム株式会社 パターン形成方法、およびパターン形成装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007201346A (ja) 2006-01-30 2007-08-09 Mitsuboshi Belting Ltd セラミックス回路基板及びその製造方法

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JPWO2021005683A1 (enrdf_load_stackoverflow) 2021-01-14
WO2021005683A1 (ja) 2021-01-14

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