JPWO2021005683A1 - - Google Patents

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Publication number
JPWO2021005683A1
JPWO2021005683A1 JP2021530376A JP2021530376A JPWO2021005683A1 JP WO2021005683 A1 JPWO2021005683 A1 JP WO2021005683A1 JP 2021530376 A JP2021530376 A JP 2021530376A JP 2021530376 A JP2021530376 A JP 2021530376A JP WO2021005683 A1 JPWO2021005683 A1 JP WO2021005683A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021530376A
Other languages
Japanese (ja)
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JP7455833B2 (ja
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Publication date
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Publication of JPWO2021005683A1 publication Critical patent/JPWO2021005683A1/ja
Application granted granted Critical
Publication of JP7455833B2 publication Critical patent/JP7455833B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2021530376A 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法 Active JP7455833B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/026997 WO2021005683A1 (ja) 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法

Publications (2)

Publication Number Publication Date
JPWO2021005683A1 true JPWO2021005683A1 (enrdf_load_stackoverflow) 2021-01-14
JP7455833B2 JP7455833B2 (ja) 2024-03-26

Family

ID=74114979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021530376A Active JP7455833B2 (ja) 2019-07-08 2019-07-08 回路パターン作成システム、および回路パターン作成方法

Country Status (2)

Country Link
JP (1) JP7455833B2 (enrdf_load_stackoverflow)
WO (1) WO2021005683A1 (enrdf_load_stackoverflow)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221411A (ja) * 1994-02-08 1995-08-18 Toyota Autom Loom Works Ltd プリント配線基板及びその製造方法
JPH0846304A (ja) * 1995-07-03 1996-02-16 Rohm Co Ltd 印刷配線基板
JPH09307201A (ja) * 1996-05-10 1997-11-28 Hitachi Aic Inc プリント配線板
JPH1056242A (ja) * 1997-06-09 1998-02-24 Nitto Denko Corp フレキシブルプリント回路板
JPH10242600A (ja) * 1997-02-28 1998-09-11 Nec Home Electron Ltd 高周波回路用プリント基板
JP2001007456A (ja) * 1999-06-17 2001-01-12 Toshiba Corp 配線回路基板
JP2007201346A (ja) * 2006-01-30 2007-08-09 Mitsuboshi Belting Ltd セラミックス回路基板及びその製造方法
JP2012074696A (ja) * 2010-09-17 2012-04-12 Ge Aviation Systems Ltd 炭化ケイ素半導体デバイス
JP2014067847A (ja) * 2012-09-26 2014-04-17 Fujifilm Corp パターン形成方法、電子配線基板、光学デバイスおよびパターン形成装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221411A (ja) * 1994-02-08 1995-08-18 Toyota Autom Loom Works Ltd プリント配線基板及びその製造方法
JPH0846304A (ja) * 1995-07-03 1996-02-16 Rohm Co Ltd 印刷配線基板
JPH09307201A (ja) * 1996-05-10 1997-11-28 Hitachi Aic Inc プリント配線板
JPH10242600A (ja) * 1997-02-28 1998-09-11 Nec Home Electron Ltd 高周波回路用プリント基板
JPH1056242A (ja) * 1997-06-09 1998-02-24 Nitto Denko Corp フレキシブルプリント回路板
JP2001007456A (ja) * 1999-06-17 2001-01-12 Toshiba Corp 配線回路基板
JP2007201346A (ja) * 2006-01-30 2007-08-09 Mitsuboshi Belting Ltd セラミックス回路基板及びその製造方法
JP2012074696A (ja) * 2010-09-17 2012-04-12 Ge Aviation Systems Ltd 炭化ケイ素半導体デバイス
JP2014067847A (ja) * 2012-09-26 2014-04-17 Fujifilm Corp パターン形成方法、電子配線基板、光学デバイスおよびパターン形成装置

Also Published As

Publication number Publication date
JP7455833B2 (ja) 2024-03-26
WO2021005683A1 (ja) 2021-01-14

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