JP7453784B2 - プッシャ、基板搬送装置、および基板処理装置 - Google Patents

プッシャ、基板搬送装置、および基板処理装置 Download PDF

Info

Publication number
JP7453784B2
JP7453784B2 JP2019228056A JP2019228056A JP7453784B2 JP 7453784 B2 JP7453784 B2 JP 7453784B2 JP 2019228056 A JP2019228056 A JP 2019228056A JP 2019228056 A JP2019228056 A JP 2019228056A JP 7453784 B2 JP7453784 B2 JP 7453784B2
Authority
JP
Japan
Prior art keywords
substrate
support
top ring
roller
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019228056A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021094660A (ja
JP2021094660A5 (enrdf_load_stackoverflow
Inventor
昭尋 谷澤
賢一 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2019228056A priority Critical patent/JP7453784B2/ja
Priority to EP20903091.5A priority patent/EP4079451A4/en
Priority to PCT/JP2020/042722 priority patent/WO2021124761A1/ja
Priority to TW109145081A priority patent/TW202133302A/zh
Publication of JP2021094660A publication Critical patent/JP2021094660A/ja
Publication of JP2021094660A5 publication Critical patent/JP2021094660A5/ja
Application granted granted Critical
Publication of JP7453784B2 publication Critical patent/JP7453784B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
JP2019228056A 2019-12-18 2019-12-18 プッシャ、基板搬送装置、および基板処理装置 Active JP7453784B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019228056A JP7453784B2 (ja) 2019-12-18 2019-12-18 プッシャ、基板搬送装置、および基板処理装置
EP20903091.5A EP4079451A4 (en) 2019-12-18 2020-11-17 SLIDE, SUBSTRATE TRANSPORT DEVICE AND SUBSTRATE TREATMENT DEVICE
PCT/JP2020/042722 WO2021124761A1 (ja) 2019-12-18 2020-11-17 プッシャ、基板搬送装置、および基板処理装置
TW109145081A TW202133302A (zh) 2019-12-18 2020-12-18 推送器、基板搬送裝置、及基板處理裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019228056A JP7453784B2 (ja) 2019-12-18 2019-12-18 プッシャ、基板搬送装置、および基板処理装置

Publications (3)

Publication Number Publication Date
JP2021094660A JP2021094660A (ja) 2021-06-24
JP2021094660A5 JP2021094660A5 (enrdf_load_stackoverflow) 2022-09-27
JP7453784B2 true JP7453784B2 (ja) 2024-03-21

Family

ID=76430165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019228056A Active JP7453784B2 (ja) 2019-12-18 2019-12-18 プッシャ、基板搬送装置、および基板処理装置

Country Status (1)

Country Link
JP (1) JP7453784B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023170262A (ja) * 2022-05-18 2023-12-01 株式会社荏原製作所 基板研磨方法、プログラム、および、基板研磨装置

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005517613A (ja) 2002-02-12 2005-06-16 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング コンベヤ処理ラインで平坦な加工物を搬送するための装置および方法
JP2006232468A (ja) 2005-02-24 2006-09-07 Tokyo Electron Ltd 処理システム
JP2006303249A (ja) 2005-04-21 2006-11-02 Ebara Corp ウエハ受渡装置、ポリッシング装置、及びウエハ受け取り方法
JP2007084282A (ja) 2005-09-22 2007-04-05 Asahi Glass Co Ltd 板材処理装置及び板材製造方法
JP2010114468A (ja) 2010-02-08 2010-05-20 Ebara Corp 研磨装置及び研磨方法
JP2010215308A (ja) 2009-03-13 2010-09-30 Pfu Ltd 給送装置
JP2014218324A (ja) 2013-05-07 2014-11-20 株式会社フジ機工 基板搬送装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0430201Y2 (enrdf_load_stackoverflow) * 1986-07-18 1992-07-21

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005517613A (ja) 2002-02-12 2005-06-16 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング コンベヤ処理ラインで平坦な加工物を搬送するための装置および方法
JP2006232468A (ja) 2005-02-24 2006-09-07 Tokyo Electron Ltd 処理システム
JP2006303249A (ja) 2005-04-21 2006-11-02 Ebara Corp ウエハ受渡装置、ポリッシング装置、及びウエハ受け取り方法
JP2007084282A (ja) 2005-09-22 2007-04-05 Asahi Glass Co Ltd 板材処理装置及び板材製造方法
JP2010215308A (ja) 2009-03-13 2010-09-30 Pfu Ltd 給送装置
JP2010114468A (ja) 2010-02-08 2010-05-20 Ebara Corp 研磨装置及び研磨方法
JP2014218324A (ja) 2013-05-07 2014-11-20 株式会社フジ機工 基板搬送装置

Also Published As

Publication number Publication date
JP2021094660A (ja) 2021-06-24

Similar Documents

Publication Publication Date Title
JP7166817B2 (ja) 基板搬送装置および基板搬送装置を備える基板処理装置
JP5593299B2 (ja) 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体
JP7096746B2 (ja) 基板搬送装置および基板搬送装置を備える基板処理装置
JP5608469B2 (ja) 塗布装置
WO2012093574A1 (ja) 剥離装置、剥離システム、剥離方法及びコンピュータ記憶媒体
WO2021124761A1 (ja) プッシャ、基板搬送装置、および基板処理装置
JP7453784B2 (ja) プッシャ、基板搬送装置、および基板処理装置
TW202446696A (zh) 基板輸送裝置及具備基板輸送裝置的基板處理裝置
EP4527553A1 (en) Substrate polishing method, program, and substrate polishing device
JP2018143942A (ja) 塗布装置および塗布方法
JP7548761B2 (ja) 基板処理装置
WO2022091500A1 (ja) 基板を保持するためのヘッドおよび基板処理装置
KR101465989B1 (ko) 기판 코팅 장치
JP2012028698A (ja) 研削装置
JP5524766B2 (ja) 平行度確認治具
KR100626555B1 (ko) 비금속재 절단장치
JP2008235494A (ja) 半導体基板の受け渡し方法
JP2003284986A (ja) 基板処理装置
TW202240754A (zh) 拾取筒夾、拾取裝置及安裝裝置
JP2013084798A (ja) 基板検査装置、基板搬送方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220915

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220915

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20231027

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231218

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240228

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240308

R150 Certificate of patent or registration of utility model

Ref document number: 7453784

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150