JP7446722B2 - 研削装置 - Google Patents

研削装置 Download PDF

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Publication number
JP7446722B2
JP7446722B2 JP2019092178A JP2019092178A JP7446722B2 JP 7446722 B2 JP7446722 B2 JP 7446722B2 JP 2019092178 A JP2019092178 A JP 2019092178A JP 2019092178 A JP2019092178 A JP 2019092178A JP 7446722 B2 JP7446722 B2 JP 7446722B2
Authority
JP
Japan
Prior art keywords
grinding
grinding wheel
state
image
chipping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2019092178A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020185646A (ja
Inventor
弘樹 宮本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Priority to JP2019092178A priority Critical patent/JP7446722B2/ja
Priority to KR1020200051548A priority patent/KR20200132699A/ko
Priority to TW109115242A priority patent/TW202042966A/zh
Priority to CN202010390764.1A priority patent/CN111941229B/zh
Publication of JP2020185646A publication Critical patent/JP2020185646A/ja
Application granted granted Critical
Publication of JP7446722B2 publication Critical patent/JP7446722B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Quality & Reliability (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
JP2019092178A 2019-05-15 2019-05-15 研削装置 Active JP7446722B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2019092178A JP7446722B2 (ja) 2019-05-15 2019-05-15 研削装置
KR1020200051548A KR20200132699A (ko) 2019-05-15 2020-04-28 연삭 장치
TW109115242A TW202042966A (zh) 2019-05-15 2020-05-07 磨削裝置
CN202010390764.1A CN111941229B (zh) 2019-05-15 2020-05-11 磨削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019092178A JP7446722B2 (ja) 2019-05-15 2019-05-15 研削装置

Publications (2)

Publication Number Publication Date
JP2020185646A JP2020185646A (ja) 2020-11-19
JP7446722B2 true JP7446722B2 (ja) 2024-03-11

Family

ID=73220783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019092178A Active JP7446722B2 (ja) 2019-05-15 2019-05-15 研削装置

Country Status (4)

Country Link
JP (1) JP7446722B2 (ko)
KR (1) KR20200132699A (ko)
CN (1) CN111941229B (ko)
TW (1) TW202042966A (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11883920B2 (en) * 2021-06-11 2024-01-30 Tan Kong Precision Tech Co., Ltd. Prognostic and health management system for precision ball grinding machines
WO2023248087A1 (en) * 2022-06-22 2023-12-28 3M Innovative Properties Company Abrasive articles, systems and methods of use
WO2023248088A1 (en) * 2022-06-22 2023-12-28 3M Innovative Properties Company Abrasive articles, systems and methods of use
CN115972078A (zh) * 2022-12-27 2023-04-18 西安奕斯伟材料科技股份有限公司 一种用于对硅片进行双面研磨的装置及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008122273A (ja) 2006-11-14 2008-05-29 Nikon Corp 砥石検査装置
JP2008155292A (ja) 2006-12-21 2008-07-10 Disco Abrasive Syst Ltd 基板の加工方法および加工装置
US20130316618A1 (en) 2012-05-22 2013-11-28 Samsung Display Co., Ltd. Apparatus for grinding a substrate and method of using the same
JP2018192572A (ja) 2017-05-18 2018-12-06 株式会社ディスコ 加工装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0641091B2 (ja) * 1983-11-10 1994-06-01 ワシノ機械株式会社 研削装置
JPH03239469A (ja) * 1990-02-16 1991-10-25 Matsushita Electric Works Ltd 研削加工装置
JP4464113B2 (ja) 2003-11-27 2010-05-19 株式会社ディスコ ウエーハの加工装置
CN1320335C (zh) * 2004-10-28 2007-06-06 上海交通大学 基于图像识别的砂轮形貌动态检测方法
JP2010194678A (ja) * 2009-02-25 2010-09-09 Olympus Corp 加工装置
CN102642176B (zh) * 2012-04-19 2014-06-04 浙江工业大学 针对磨粒软固结气压砂轮的检测修复系统
JP6077814B2 (ja) * 2012-10-10 2017-02-08 株式会社 ネオ Ｎｃデータ作成装置及びｎｃ研削盤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008122273A (ja) 2006-11-14 2008-05-29 Nikon Corp 砥石検査装置
JP2008155292A (ja) 2006-12-21 2008-07-10 Disco Abrasive Syst Ltd 基板の加工方法および加工装置
US20130316618A1 (en) 2012-05-22 2013-11-28 Samsung Display Co., Ltd. Apparatus for grinding a substrate and method of using the same
JP2018192572A (ja) 2017-05-18 2018-12-06 株式会社ディスコ 加工装置

Also Published As

Publication number Publication date
KR20200132699A (ko) 2020-11-25
JP2020185646A (ja) 2020-11-19
TW202042966A (zh) 2020-12-01
CN111941229B (zh) 2024-03-12
CN111941229A (zh) 2020-11-17

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