JP7440606B2 - 部品実装機および部品実装システム - Google Patents

部品実装機および部品実装システム Download PDF

Info

Publication number
JP7440606B2
JP7440606B2 JP2022501522A JP2022501522A JP7440606B2 JP 7440606 B2 JP7440606 B2 JP 7440606B2 JP 2022501522 A JP2022501522 A JP 2022501522A JP 2022501522 A JP2022501522 A JP 2022501522A JP 7440606 B2 JP7440606 B2 JP 7440606B2
Authority
JP
Japan
Prior art keywords
component
feeder
determination process
supply position
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022501522A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021166179A1 (https=
Inventor
岳史 櫻山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of JPWO2021166179A1 publication Critical patent/JPWO2021166179A1/ja
Application granted granted Critical
Publication of JP7440606B2 publication Critical patent/JP7440606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022501522A 2020-02-20 2020-02-20 部品実装機および部品実装システム Active JP7440606B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/006872 WO2021166179A1 (ja) 2020-02-20 2020-02-20 部品実装機および部品実装システム

Publications (2)

Publication Number Publication Date
JPWO2021166179A1 JPWO2021166179A1 (https=) 2021-08-26
JP7440606B2 true JP7440606B2 (ja) 2024-02-28

Family

ID=77390754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501522A Active JP7440606B2 (ja) 2020-02-20 2020-02-20 部品実装機および部品実装システム

Country Status (5)

Country Link
US (1) US12052826B2 (https=)
EP (1) EP4110030A4 (https=)
JP (1) JP7440606B2 (https=)
CN (1) CN115004878B (https=)
WO (1) WO2021166179A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD224526S (zh) * 2021-11-16 2023-04-01 日商松下知識產權經營股份有限公司 帶式送料器之部分
CN119732196A (zh) * 2022-09-30 2025-03-28 株式会社富士 元件安装机及元件有无判断方法
WO2025126372A1 (ja) * 2023-12-13 2025-06-19 株式会社Fuji 部品実装システム
WO2025186877A1 (ja) * 2024-03-04 2025-09-12 株式会社Fuji 部品実装システム

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2937785B2 (ja) 1995-02-02 1999-08-23 ヤマハ発動機株式会社 実装機の部品状態検出装置
JP6043994B2 (ja) 2011-11-02 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、部品切れ判定方法及びプログラム
JP6103800B2 (ja) 2011-07-01 2017-03-29 富士機械製造株式会社 部品実装機
JP7113187B2 (ja) 2018-01-29 2022-08-05 パナソニックＩｐマネジメント株式会社 部品供給装置および部品装着システムならびに部品装着方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
JPH08274500A (ja) * 1996-04-30 1996-10-18 Yamaha Motor Co Ltd 実装機の部品吸着状態検出装置
JP3402968B2 (ja) * 1996-11-18 2003-05-06 ヤマハ発動機株式会社 実装装置
US7363702B2 (en) * 2002-04-01 2008-04-29 Fuji Machine Mfg. Co., Ltd. Working system for circuit substrate
JP4563205B2 (ja) * 2005-02-08 2010-10-13 富士機械製造株式会社 実装された電子部品の検査方法及び装置
JP5013816B2 (ja) * 2006-11-01 2012-08-29 Ｊｕｋｉ株式会社 表面実装装置
JP5385010B2 (ja) * 2009-05-29 2014-01-08 Ｊｕｋｉ株式会社 電子部品実装装置
US9265186B2 (en) * 2011-11-10 2016-02-16 Delaware Capital Formation, Inc. Camera system for aligning components of a PCB
JP6114509B2 (ja) * 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
EP3062593B1 (en) * 2013-10-21 2022-03-16 FUJI Corporation Electronic component mounting apparatus
US10225969B2 (en) * 2015-01-06 2019-03-05 Panasonic Intellectual Property Management Co., Ltd. Electronic component supply apparatus and method of processing component supply tape in electronic component supply apparatus
EP3334264B1 (en) 2015-08-05 2020-10-14 FUJI Corporation Component mounting apparatus
JP2017011316A (ja) 2016-10-21 2017-01-12 富士機械製造株式会社 部品実装機のカセット式フィーダ入替システム
JP6496908B2 (ja) * 2016-10-28 2019-04-10 パナソニックＩｐマネジメント株式会社 部品実装システム
US11291147B2 (en) * 2017-09-19 2022-03-29 Fuji Corporation Component mounting system
JP6838166B2 (ja) 2017-09-22 2021-03-03 株式会社Ｆｕｊｉ 部品装着機、および部品落下の判定方法
JP6974503B2 (ja) * 2018-01-18 2021-12-01 ヤマハ発動機株式会社 部品実装機、部品切れ判定方法
JP6913231B2 (ja) * 2018-03-23 2021-08-04 株式会社Ｆｕｊｉ 部品装着装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2937785B2 (ja) 1995-02-02 1999-08-23 ヤマハ発動機株式会社 実装機の部品状態検出装置
JP6103800B2 (ja) 2011-07-01 2017-03-29 富士機械製造株式会社 部品実装機
JP6043994B2 (ja) 2011-11-02 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、部品切れ判定方法及びプログラム
JP7113187B2 (ja) 2018-01-29 2022-08-05 パナソニックＩｐマネジメント株式会社 部品供給装置および部品装着システムならびに部品装着方法

Also Published As

Publication number Publication date
US12052826B2 (en) 2024-07-30
WO2021166179A1 (ja) 2021-08-26
EP4110030A4 (en) 2023-03-01
CN115004878B (zh) 2023-10-24
JPWO2021166179A1 (https=) 2021-08-26
CN115004878A (zh) 2022-09-02
EP4110030A1 (en) 2022-12-28
US20230067782A1 (en) 2023-03-02

Similar Documents

Publication Publication Date Title
JP7440606B2 (ja) 部品実装機および部品実装システム
JP6411028B2 (ja) 管理装置
JP7407151B2 (ja) 部品実装システム
CN116491236B (zh) 元件安装系统
JP7427074B2 (ja) 部品実装機の不調判定装置および不調判定方法
JPWO2018198333A1 (ja) 作業システム
JP7406571B2 (ja) 検査装置及び検査方法
CN116602066B (zh) 元件补给方法及管理装置
JP7776623B2 (ja) 部品実装システム及び画像分類方法
JP7572837B2 (ja) 部品実装システム
JP7590552B2 (ja) 判断装置
JP7197705B2 (ja) 実装装置、実装システム及び検査実装方法
JP7761676B2 (ja) 準備装置、実装装置、実装システム及び情報処理方法
EP4007473A1 (en) Mounting device and method for controlling mounting device
WO2025186877A1 (ja) 部品実装システム
JP7807286B2 (ja) 画像処理装置および部品実装機並びに画像処理方法
JP7431927B2 (ja) 部品実装システム
JP2024160816A (ja) 保守装置、実装装置及び実装システム
JP2024043657A (ja) 送りピッチチェック方法及びプログラム
WO2021053790A1 (ja) 部品実装機
JP2020205311A (ja) キャリアおよび検査用基板並びに部品実装システム
JPWO2018096574A1 (ja) 装着機

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220801

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230704

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20230822

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231026

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240130

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240215

R150 Certificate of patent or registration of utility model

Ref document number: 7440606

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150